The effect of thermal cycling on the fracture toughness of metallic glasses
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Thermal cycling devices are provided. In one embodiment, a thermal cycling device includes a packed tube comprising an inlet portion defining an inlet and an outlet portion defining an outlet. The packed tube is provided in a double coil arrangement, wherein the double coil arrangement causes radially neighboring turns of the packed tube to have opposing flow directions therethrough. The thermal cycling device further includes a cooling device disposed axially adjacent to the packed tube, and a heating device disposed axially adjacent to the packed tube opposite the cooling device.
TCAP (Thermal Cycling Absorption Process) is a gas chromatograph in principle using palladium in the column packing, but it is unique in the fact that the carrier gas, hydrogen, is being isotopically separated and the system is operated in a semi-continuous manner. TCAP units are used to purify tritium. The recent TCAP advances at Savannah River Site (SRS) include compressor-free concept for heating/cooling, push and pull separation using an active inverse column, and compact column design. The new developments allow significantly higher throughput and better reliability from 1/10 of the current production system's footprint while consuming 60% less energy. Various versions are derived in the meantime for external customers to be used in fusion energy projects.
Highlights: • Differently oriented grains were studied in situ using synchrotron diffraction. • The effect of thermo-mechanical history on hydrogen location in α-Zr is considered. • Hydrogen redistribution in alpha-Zr matrix during thermal cycling discussed. - Abstract: Hydride distribution in a dual-phase hydrided Zr-2.5wt%Nb has been studied. Samples having different prior thermo-mechanical processing history were thermally cycled within a 86 keV X-ray photon beam. The diffraction patterns generated with this technique allow the evaluation of the relative quantity of hydrides within differently oriented grain sets. It was found that hydrides exist primarily within two different α-Zr grain-sets. One grain-set has its {0002} α-Zr direction oriented very close to the hoop direction while the other exists within a plane approximately 20° away from it. During thermal cycling, the proportion or hydrides oriented within different grain sets was shown to change from the distribution associated with the prior thermomechanical processing, to that corresponding to the current thermal cycling conditions. It was also shown that the ability for hydrogen to redistribute in the matrix correlates with the cooling rate of the specimen.
Concentrating solar power plant designers are interested in supercritical CO 2 (sCO 2 ) for the power block to achieve > 50% electrical efficiency at > 700 °C. The goal of this project was to develop a long-term (> 100 kh) lifetime model for sCO 2 compatibility using 10–15 kh laboratory exposures. Three Ni-based alloys (625, 282 and 740H) and an advanced austenitic stainless steel were evaluated here in long-term exposures at 700–800 °C using 500-h cycles in laboratory air, 0.1 MPa industrial grade (IG) CO 2 and 30 MPa supercritical IG CO 2 and using 10-h cycles in 0.1 MPa IG CO 2 and O 2 . Mass change data and quantification of the oxide scale thickness and depth of internal attack after 1000–10,000 h exposures at 750 °C indicate that these materials are compatible with the sCO 2 environments with modeling used to predict long-term behavior. Comparison of the 0.1 and 30 MPa 500-h cycle results did not show a significant effect of pressure on the reaction, and no significant internal carburization was observed under these conditions, even for the stainless steel, suggesting that chromia scales may be better C diffusion barriers than expected. For the Ni-based alloys, thermal cycling to simulate the solar duty cycle did not result in scale spallation after 15 kh in 10-h cycles or 4 kh in 1-h cycles at 750 °C. However, the stainless steel specimens formed an Fe-rich oxide after ~ 1500-h cumulative exposure time in both 1- and 10-h cycles.
The rapid thermal cycling of a material is targeted. A microfluidic heat exchanger with an internal porous medium is coupled to tanks containing cold fluid and hot fluid. Fluid flows alternately from the cold tank and the hot tank into the porous medium, cooling and heating samples contained in the microfluidic heat exchanger's sample wells. A valve may be coupled to the tanks and a pump, and switching the position of the valve may switch the source and direction of fluid flowing through the porous medium. A controller may control the switching of valve positions based on the temperature of the samples and determined temperature thresholds. A sample tray for containing samples to be thermally cycled may be used in conjunction with the thermal cycling system. A surface or internal electrical heater may aid in heating the samples, or may replace the necessity for the hot tank.
The rapid thermal cycling of a material is targeted. A microfluidic heat exchanger with an internal porous medium is coupled to tanks containing cold fluid and hot fluid. Fluid flows alternately from the cold tank and the hot tank into the porous medium, cooling and heating samples contained in the microfluidic heat exchanger's sample wells. A valve may be coupled to the tanks and a pump, and switching the position of the valve may switch the source and direction of fluid flowing through the porous medium. A controller may control the switching of valve positions based on the temperature of the samples and determined temperature thresholds. A sample tray for containing samples to be thermally cycled may be used in conjunction with the thermal cycling system. A surface or internal electrical heater may aid in heating the samples, or may replace the necessity for the hot tank.
The thermal cycling tests used in the photovoltaic industry are slow, requiring over a month for 200 cycles and five months for 800 cycles. A faster alternative would reduce the cost of delay for module qualification. This study investigates the correlation between a baseline thermal cycling profile and profiles that are three and six times faster. Interconnect failure data for each profile was gathered across eight splits of varying material combinations. Models were applied to the failure data and factors which impacted interconnect lifetime were identified. Here, the results show that more cycles were required in the faster profiles for equivalency to the baseline profile. Furthermore, the equivalent number of cycles varied by a factor of two across the splits. Despite these limitations, the faster profiles offer substantial qualification time savings if the underlying failure mechanisms are understood.
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The influence of thermal cycling on the microstructure, magnetic phase transition and magnetic entropy change of a Gd 5 Si 1.3 Ge 2.7 thin film up to 1000 cycles is investigated. The authors found that after 1000 cycles a strong reduction of the crystallographic phase responsible for the magnetostructural transition (Orthorhombic II phase) occurs. We attribute this to the chemical disorder, caused by the large number of expansion/compression cycles that the Orthorhombic II phase undergoes across the magnetostructural transition. The suppression of the magnetostructural transition corresponds to a drastic decrease of the thin film magnetic entropy change. Our results reveal the importance of studying the thermal/magnetic cycles influence on magnetostructural transitions as they can damage a real-life device.
Structural rejuvenation in metallic glasses (MGs) induced by cryogenic thermal cycling has been intensively studied. However, the effect of thermal cycling on the atomic dynamics in MGs is still missing. In this work, we present a systematic study on the atomic dynamics in a La-based MG affected by sub-Tg annealing and thermal cycling. We find that the thermal cycling has little effect on the atomic dynamics in both as-cast and annealed MGs although it could significantly increase the free volume and change mechanical properties of the as-cast MG sample. In contrast, both the structure and mechanical properties of the well-relaxed sample are almost unchanged by thermal cycling. Further, the increased open volume, mainly in the form of atomic vacancies, does not greatly promote the atomic dynamics in the as-cast MG sample, indicating that the free volume induced by thermal cycling is not the key factor in stimulating the β-relaxation and the boson peak in the studied MG.
Effect of microstructural evolution on sagging behavior of aluminum foil was investigated during the brazing thermal cycle. During the brazing thermal cycle, the sagging behavior consists of three stages: slight sagging stage, accelerative sagging stage and slow sagging stage. The sagging of cold-rolled aluminum foil mainly occurs in the accelerative sagging stage, which is governed by recovery under external stress in the sagging test. The coarse recrystallized grain is responsible for the slow sagging stage by reducing grain boundary sliding. Increasing cold-rolled reduction and addition of final annealing heat treatment can improve sagging resistance by shortening recovery process during the brazing thermal cycle. Dissolution of dispersoids has few effects on sagging deformation.
Goals: Understand crystal structure and micro-structure changes during thermal cycling, understand reasons for ratcheting of TATB during thermal cycling, and Support of B61 LEP. Deliverables achieved: Completed in situ thermal cycling of loose powder and pressed pellet TATB on HIPPO, Quantified preferred orientation of pressed pellet, and quantified relative change of each of the six lattic parameters.
Magnesium chloride (MgCl 2 )-based molten salt phase change materials (PCMs) are promising candidates for thermal energy storage (TES) owing to their advantageous thermophysical properties, however, their high corrosivity in the molten state limits material compatibility. In this study, the corrosion behavior of 304?L stainless steel (SS304L) exposed to MgCl2 PCM was investigated as a function of thermal cycling (up to 9000 cycles) relevant to PCM-based TES systems. Microstructural changes and elemental redistribution at the alloy-salt interface under thermal cycling conditions were characterized using synchrotron-based X-ray fluorescence (XRF) and scanning electron microscopy coupled with energy dispersive X-ray spectroscopy (SEM-EDS). Results show that corrosion is governed by selective Cr-dissolution and elemental diffusion near the interface and grain boundaries. A clear transition in the dominant corrosion mechanism is observed with increasing thermal cycles. Surface corrosion is the dominant mechanism up to 1000 cycles, whereas intergranular corrosion becomes the primary degradation mode beyond 2000 cycles. These mechanistic changes are interpreted in terms of evolving interfacial chemistry, microstructure and the diffusion-driven redistribution of alloying elements.
Integrating SiC power MOSFETs is very attractive for advancing power electronic systems, yet the system reliability with new devices remains in question. This work presents two accelerated test experiments to further investigate the packaging and semiconductor failures of a TO-247 SiC MOSFET. First, a variation on power cycling experiments -- switching cycling -- is introduced. Traditional power cycling experiments utilize conduction losses to self-heat the device where a large temperature swing causes degradation at the packaging level. However, by decreasing the on-time such that the device only turns on and immediately turns off, the temperature swing is decreased and the semiconductor itself is degraded. This work shows experimental device degradation caused by continuous switching events - switching cycling, at 90% of the device's breakdown voltage. Second, thermal cycling experiments were conducted between -40 degrees C and 175 degrees C to observe degradation in the mechanical packaging of the device. Experimentally-measured changes in threshold voltage and ON-resistance are recorded in both experiments and compared. These results also illustrate the spectrum between device and package degradation from accelerated test methods.