Results for “Spreader” | Engineering Papers

DOE OSTI2020

Analysis and Evaluation of Thermally Annealed Pyrolytic Graphite Heat Spreader for Power Modules

Next generation power modules demand increased heat extraction capability along with reduced weight and volume. In this paper, thermally annealed pyrolytic graphite (TPG) is analyzed and compared with conventional materials used in power modules for thermal management. Fundamental properties of TPG are explained and compared with commonly used materials in power module heat spreaders and substrates. The encapsulated TPG based heat spreader is manufactured and compared with bulk copper in simulation and experimental based analysis. The results show that encapsulated TPG based heat spreader achieves more than 50% reduction in thermal resistance along with 48% reduction in weight in the heat spreader layer.

Gurpinar, Emre↗

NASA NTRS1984

The structural optimization of a spreader bar for twin lift helicopter operations

An optimization study was performed to develop a minimum weight spreader bar to allow two helicopters to lift the same payload. With this arrangement, the maximum payload that can be lifted is almost doubled without the expense of designing and building a new helicopter. The concept has had some limited use by civil helicopter operators using small helicopters and has been demonstrated in large scale by two CH-54's which successfully lifted a total load of 20 ton. To this point, rather heavy available beams or tower structures have been used for the spreader bar. Since the weight of the bar not only detracts from payload but also adds to the logistics problem, there are more than the usual incentives to minimize weight. Since the design requirement is for classic beam column with uniform side loads resulting from bar weight and aerodynamic drag, the design problem is particularly amenable to optimization. A study has been performed at Sikorsky to establish the minimum weight for a spreader bar sized to carry a load equal to the capacity of two Army BLACK HAWK helicopters. Toward this end, a computer program was written to analyze the spreader bar deflections and stresses and coupled to the NASA developed CONMIN optimization routines.

Dobyns, A.↗

DOE OSTI2019

Conductive heat spreader and heat sink assembly for optical devices

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

42 ENGINEERING↗

DOE OSTI2021

Conductive heat spreader and heat sink assembly for optical devices

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

Doany, Fuad Elias↗

DOE OSTI2022

The role of geographical spreaders in infectious pattern formation and front propagation speeds

The pattern formation and spatial spread of infectious populations are investigated using a kernel-based Susceptible–Infectious–Recovered (SIR) model applicable across a wide range of basic reproduction numbers R O . The goal is to examine the role of geographical spreaders on transient spatial pattern formation of infectious populations and the associated maximum invasive front speeds c max . In the simulations conducted here, geographical spreaders are defined as a portion of the infected population Φ experiencing high mobility between identical communities. The spatial organization of the infected population and c max are determined when the infections are randomly initiated in space within multiple communities. For small but finite , scaling analysis and numerical simulations in 1-dimension suggest that when the spreading kernel is Gaussian-shaped, where is the inverse of the infectious duration. This finding for agrees with a diffusion-based representation of mobility in 1-D. Numerical simulations in 2-D across wide-ranging suggest that , the variance of the spatial kernel describing mobility of long-distance geographical spreaders across communities, determines the spatial organization of infections across communities. When (long-distance mobility, where is the minimum spatial extent defining adjacent communities), the infectious population will experience a transient but spatially coherent pattern with a wavelength that can be derived from the spreading kernel properties. Moreover, the 2-D simulations for the bounded kernel suggest that attainment of is also dictated by but the magnitude is not sensitive to unlike diffusion-based models.

60 APPLIED LIFE SCIENCES↗

NASA NTRS2010

Diamond Heat-Spreader for Submillimeter-Wave Frequency Multipliers

The planar GaAs Shottky diode frequency multiplier is a critical technology for the local oscillator (LO) for submillimeter- wave heterodyne receivers due to low mass, tenability, long lifetime, and room-temperature operation. The use of a W-band (75-100 GHz) power amplifier followed by a frequency multiplier is the most common for submillimeter-wave sources. Its greatest challenge is to provide enough input power to the LO for instruments onboard future planetary missions. Recently, JPL produced 800 mW at 92.5 GHz by combining four MMICs in parallel in a balanced configuration. As more power at W-band is available to the multipliers, their power-handling capability be comes more important. High operating temperatures can lead to degradation of conversion efficiency or catastrophic failure. The goal of this innovation is to reduce the thermal resistance by attaching diamond film as a heat-spreader on the backside of multipliers to improve their power-handling capability. Polycrystalline diamond is deposited by hot-filament chemical vapor deposition (CVD). This diamond film acts as a heat-spreader to both the existing 250- and 300-GHz triplers, and has a high thermal conductivity (1,000-1,200 W/mK). It is approximately 2.5 times greater than copper (401 W/mK) and 20 times greater than GaAs (46 W/mK). It is an electrical insulator (resistivity approx. equals 10(exp 15) Ohms-cm), and has a low relative dielectric constant of 5.7. Diamond heat-spreaders reduce by at least 200 C at 250 mW of input power, compared to the tripler without diamond, according to thermal simulation. This superior thermal management provides a 100-percent increase in power-handling capability. For example, with this innovation, 40-mW output power has been achieved from a 250-GHz tripler at 350-mW input power, while the previous triplers, without diamond, suffered catastrophic failures. This breakthrough provides a stepping-stone for frequency multipliers-based LO up to 3 THz. The future work for this design is to apply the high output power from both the 250 and 300 GHz to multiple chains in order to generate milliwatts at 2.3 THz. Using the first generation of results for this innovation, 40 mW of output power were produced from a 240-GHz tripler at 350-mW input power, and 27- mW output power was produced from a 300-GHz tripler at 408-mW input power. This is two times higher than the current state-of-the-art output power capability. A finite-element thermal simulation also shows that 30-microns thick diamond dropped the temperature of the anodes by at least 200 C.

Lin, Robert H.↗

DOE OSTI2019

Experimental Demonstration of an Additively Manufactured Vapor Chamber Heat Spreader

Vapor chambers and heat pipes are often used as standalone heat spreaders for electronics cooling and in other applications. Metal additive manufacturing (AM) techniques have an intrinsic ability to form the porous structures and internal cavities required to fabricate a vapor chamber or a heat pipe. Additive manufacturing techniques thereby have potential for fabricating vapor chambers with complex geometries and locally tailored wick structures to improve performance as well as to monolithically embed vapor chamber heat spreaders within other components. The focus of the present work is to conduct an experimental assessment of the viability of additively manufactured vapor chambers. A direct metal laser sintering (DMLS) technique was used to fabricate a monolithic stainless steel vapor chamber heat spreader with a 39% porous, 0.5-mm thick wick and a 1.5-mm thick internal vapor core. The functionality of the as-printed vapor chamber was evaluated based on characterization of the heat spreading behavior with and without fluid charge. Charging with water decreased the effective thermal resistance of the device while spreading heat from a central hot spot, confirming functionality of the additively manufactured vapor chamber.

Ozguz, Serdar↗

DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

36 MATERIALS SCIENCE↗

DOE OSTI2016

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗

DOE OSTI2018

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗

DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

42 ENGINEERING↗

DOE OSTI2018

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Chainer, Timothy J.↗

DOE OSTI2023

DESIGNING THE SPREADERS AND SPLITTERS FOR THE FFA@CEBAF ENERGY UPGRADE

The FFA@CEBAF energy upgrade study aims to approximately double the final energy of the electron beam at the Continuous Electron Beam Accelerator Facility (CEBAF). It will do this by replacing the highest-energy recirculating arcs with fixed-field alternating gradient (FFA) arcs, allowing for several more passes to circulate through the machine. This upgrade necessitates the re-design of the vertical spreader sections, which separates each pass into different recirculation arcs. Additionally, the FFA arcs will need horizontal splitter lines to correct for time of flight and R56. This work will present the current state of the spreader re-design and splitter design.

Benesch, J.↗

DOE OSTI2014

Compact Spreader Schemes

This paper describes beam distribution schemes adopting a novel implementation based on low amplitude vertical deflections combined with horizontal ones generated by Lambertson-type septum magnets. This scheme offers substantial compactness in the longitudinal layouts of the beam lines and increased flexibility for beam delivery of multiple beam lines on a shot-to-shot basis. Fast kickers (FK) or transverse electric field RF Deflectors (RFD) provide the low amplitude deflections. Initially proposed at the Stanford Linear Accelerator Center (SLAC) as tools for beam diagnostics and more recently adopted for multiline beam pattern schemes, RFDs offer repetition capabilities and a likely better amplitude reproducibility when compared to FKs, which, in turn, offer more modest financial involvements both in construction and operation. Both solutions represent an ideal approach for the design of compact beam distribution systems resulting in space and cost savings while preserving flexibility and beam quality.

43 PARTICLE ACCELERATORS↗

DOE OSTI2018

Cascading RF deflectors in compact beam spreader schemes

This study describes beam distribution schemes based on transverse electric field radio-frequency deflectors (RFD) as fast-switching devices and provides numerical relationships between their respective frequencies and phases. The adoption of compact transverse deflecting cavities represents an ideal solution for the design of high repetition rate ( > 1 MHz), compact beam distribution systems. While directly applicable to modern FEL facilities, this approach also provides opportunities for expanding existing beam delivery systems with additional experimental areas simultaneously feeding multiple beamlines. We derive the formalism for cascading RFDs by adopting the proper choice of deflector frequencies which can generate a large variety of beam switch yard topologies. Finally, we present for reference a potential application operating at an rf frequency of 325 MHz with the comparison of three possible distinct compact rf deflectors: a superconducting rf-dipole, a normal conducting rf-dipole, and a normal conducting 4-rod design.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2023

DESIGNING THE SPREADERS AND SPLITTERS FOR THE FFA@CEBAF ENERGY UPGRADE

A degrader device is being built at the CEBAF injector to degrade the electron beam phase space for machine acceptance studies. The electron beam is degraded through multiple scattering in a thin target before further transport in the injector beamline for injection into CEBAF. The degraded electron beam will approximate phase space distributions expected from a bremsstrahlung-based polarized positron source as in the PEPPo method. The effort is in broader support of the Ce+BAF positron capability that is currently under study. Two options for the degrader device are considered, and simulation results are presented.

Sy, A.↗

DOE OSTI2014

Transparent heat-spreader for optoelectronic applications

An optoelectronic cooling system is equally applicable to an LED collimator or a photovoltaic solar concentrator. A transparent fluid conveys heat from the optoelectronic chip to a hollow cover over the system aperture. The cooling system can keep a solar concentrator chip at the same temperature as found for a one-sun flat-plate solar cell. Natural convection or forced circulation can operate to convey heat from the chip to the cover.

42 ENGINEERING↗