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DOE OSTI2020

Materials Data on SnPb by Materials Project

SnPb crystallizes in the hexagonal P-6m2 space group. The structure is three-dimensional. Pb is bonded to six equivalent Pb and six equivalent Sn atoms to form PbSn6Pb6 cuboctahedra that share corners with twelve equivalent SnPb6 cuboctahedra, corners with eighteen equivalent PbSn6Pb6 cuboctahedra, edges with six equivalent PbSn6Pb6 cuboctahedra, edges with twelve equivalent SnPb6 cuboctahedra, and faces with eight equivalent PbSn6Pb6 cuboctahedra. All Pb–Pb bond lengths are 3.48 Å. All Pb–Sn bond lengths are 3.49 Å. Sn is bonded to six equivalent Pb atoms to form distorted SnPb6 cuboctahedra that share corners with twelve equivalent PbSn6Pb6 cuboctahedra, corners with twelve equivalent SnPb6 cuboctahedra, edges with six equivalent SnPb6 cuboctahedra, edges with twelve equivalent PbSn6Pb6 cuboctahedra, and faces with two equivalent SnPb6 cuboctahedra.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Materials Data on La2(SnPb)3 by Materials Project

La2(PbSn)3 crystallizes in the orthorhombic Pmmm space group. The structure is three-dimensional. La is bonded to six Pb and six Sn atoms to form LaSn6Pb6 cuboctahedra that share corners with twelve equivalent LaSn6Pb6 cuboctahedra, edges with four equivalent SnLa4Pb8 cuboctahedra, edges with twelve PbLa4Sn6Pb2 cuboctahedra, faces with two equivalent SnLa4Pb8 cuboctahedra, faces with six equivalent LaSn6Pb6 cuboctahedra, and faces with six PbLa4Sn6Pb2 cuboctahedra. There are four shorter (3.49 Å) and two longer (3.50 Å) La–Pb bond lengths. There are a spread of La–Sn bond distances ranging from 3.42–3.48 Å. There are two inequivalent Pb sites. In the first Pb site, Pb is bonded to four equivalent La, two equivalent Pb, and six Sn atoms to form distorted PbLa4Sn6Pb2 cuboctahedra that share corners with twelve equivalent PbLa4Sn6Pb2 cuboctahedra, edges with four equivalent PbLa4Sn4Pb4 cuboctahedra, edges with four equivalent SnLa4Pb8 cuboctahedra, edges with eight equivalent LaSn6Pb6 cuboctahedra, faces with two equivalent SnLa4Pb8 cuboctahedra, faces with four equivalent LaSn6Pb6 cuboctahedra, and faces with eight PbLa4Sn6Pb2 cuboctahedra. Both Pb–Pb bond lengths are 3.46 Å. There are a spread of Pb–Sn bond distances ranging from 3.43–3.48 Å. In the second Pb site, Pb is bonded to four equivalent La, four equivalent Pb, and four equivalent Sn atoms to form distorted PbLa4Sn4Pb4 cuboctahedra that share corners with four equivalent PbLa4Sn4Pb4 cuboctahedra, edges with eight equivalent LaSn6Pb6 cuboctahedra, edges with eight equivalent PbLa4Sn6Pb2 cuboctahedra, faces with four equivalent LaSn6Pb6 cuboctahedra, faces with four equivalent SnLa4Pb8 cuboctahedra, and faces with eight PbLa4Sn6Pb2 cuboctahedra. All Pb–Sn bond lengths are 3.49 Å. There are three inequivalent Sn sites. In the first Sn site, Sn is bonded in a 8-coordinate geometry to four equivalent La and four equivalent Pb atoms. In the second Sn site, Sn is bonded to four equivalent La and eight Pb atoms to form SnLa4Pb8 cuboctahedra that share corners with four equivalent SnLa4Pb8 cuboctahedra, edges with eight equivalent LaSn6Pb6 cuboctahedra, edges with eight equivalent PbLa4Sn6Pb2 cuboctahedra, faces with four equivalent LaSn6Pb6 cuboctahedra, faces with four equivalent SnLa4Pb8 cuboctahedra, and faces with eight PbLa4Sn6Pb2 cuboctahedra. In the third Sn site, Sn is bonded in a 8-coordinate geometry to four equivalent La and four equivalent Pb atoms.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Materials Data on U2(SnPb)3 by Materials Project

U2(PbSn)3 crystallizes in the orthorhombic Pmmm space group. The structure is three-dimensional. U is bonded to six Pb and six Sn atoms to form USn6Pb6 cuboctahedra that share corners with twelve equivalent USn6Pb6 cuboctahedra, edges with twelve PbU4Sn6Pb2 cuboctahedra, edges with twelve SnU4Sn4Pb4 cuboctahedra, faces with six equivalent USn6Pb6 cuboctahedra, faces with six PbU4Sn6Pb2 cuboctahedra, and faces with six SnU4Sn4Pb4 cuboctahedra. There are four shorter (3.32 Å) and two longer (3.37 Å) U–Pb bond lengths. There are a spread of U–Sn bond distances ranging from 3.30–3.36 Å. There are two inequivalent Pb sites. In the first Pb site, Pb is bonded to four equivalent U, two equivalent Pb, and six Sn atoms to form distorted PbU4Sn6Pb2 cuboctahedra that share corners with twelve equivalent PbU4Sn6Pb2 cuboctahedra, edges with four equivalent PbU4Sn4Pb4 cuboctahedra, edges with eight equivalent USn6Pb6 cuboctahedra, edges with twelve SnU4Sn4Pb4 cuboctahedra, faces with four equivalent USn6Pb6 cuboctahedra, faces with six SnU4Sn4Pb4 cuboctahedra, and faces with eight PbU4Sn6Pb2 cuboctahedra. Both Pb–Pb bond lengths are 3.35 Å. There are a spread of Pb–Sn bond distances ranging from 3.31–3.36 Å. In the second Pb site, Pb is bonded to four equivalent U, four equivalent Pb, and four equivalent Sn atoms to form distorted PbU4Sn4Pb4 cuboctahedra that share corners with four equivalent PbU4Sn4Pb4 cuboctahedra, corners with eight equivalent SnU4Sn4Pb4 cuboctahedra, edges with eight equivalent USn6Pb6 cuboctahedra, edges with eight equivalent PbU4Sn6Pb2 cuboctahedra, edges with eight equivalent SnU4Sn4Pb4 cuboctahedra, faces with four equivalent USn6Pb6 cuboctahedra, faces with six SnU4Sn4Pb4 cuboctahedra, and faces with eight PbU4Sn6Pb2 cuboctahedra. All Pb–Sn bond lengths are 3.32 Å. There are three inequivalent Sn sites. In the first Sn site, Sn is bonded to four equivalent U, four equivalent Pb, and four equivalent Sn atoms to form distorted SnU4Sn4Pb4 cuboctahedra that share corners with four equivalent SnU4Sn4Pb4 cuboctahedra, corners with eight equivalent PbU4Sn4Pb4 cuboctahedra, edges with eight equivalent USn6Pb6 cuboctahedra, edges with eight equivalent PbU4Sn6Pb2 cuboctahedra, edges with eight equivalent SnU4Pb8 cuboctahedra, faces with four equivalent USn6Pb6 cuboctahedra, faces with six PbU4Sn6Pb2 cuboctahedra, and faces with eight SnU4Sn4Pb4 cuboctahedra. All Sn–Sn bond lengths are 3.32 Å. In the second Sn site, Sn is bonded to four equivalent U and eight Pb atoms to form SnU4Pb8 cuboctahedra that share corners with twelve SnU4Pb8 cuboctahedra, edges with eight equivalent USn6Pb6 cuboctahedra, edges with eight equivalent PbU4Sn6Pb2 cuboctahedra, edges with eight equivalent SnU4Sn4Pb4 cuboctahedra, faces with four equivalent USn6Pb6 cuboctahedra, faces with six SnU4Pb8 cuboctahedra, and faces with eight PbU4Sn6Pb2 cuboctahedra. In the third Sn site, Sn is bonded to four equivalent U, four equivalent Pb, and four equivalent Sn atoms to form distorted SnU4Sn4Pb4 cuboctahedra that share corners with twelve SnU4Pb8 cuboctahedra, edges with eight equivalent USn6Pb6 cuboctahedra, edges with sixteen PbU4Sn6Pb2 cuboctahedra, faces with four equivalent USn6Pb6 cuboctahedra, faces with four equivalent PbU4Sn6Pb2 cuboctahedra, and faces with ten SnU4Sn4Pb4 cuboctahedra.

36 MATERIALS SCIENCE↗

DOE OSTI2021

Thermomechanical fatigue resistance of low temperature solder for multiwire interconnects in photovoltaic modules

Novel interconnect technologies leveraging low melting temperature solders, such as multiwire interconnects, are being deployed in photovoltaic (PV) modules for improved reliability through interconnect redundancy and lower thermal loads during interconnection and lamination. However, the equivalency of standardized accelerated testing to field conditions has not yet been established for these emerging technologies. In this study, the thermomechanical fatigue resistance of low temperature solder alloys is investigated and compared to that of conventional SnPb to assess the acceleration behavior of these alloys. While InSn is shown to have sufficient thermomechanical fatigue resistance on the order of that of SnPb, these results indicate Sn–Bi alloys may have poor thermomechanical fatigue resistance at field conditions. The results also show that Sn–Bi alloys have thermal cycling acceleration factors of less than one. This indicates that the standardized accelerated thermal cycling test, such as that in IEC 61215, will produce misleading results for Sn–Bi alloys and that unique testing is required for this PV module architecture. Though accelerated thermal cycling may be a meaningful qualification test for SnPb solder joints, these results suggest that mechanical loading may be a more appropriate test for Sn–Bi multiwire interconnects. This is due to the distinct processing and geometry of multiwire interconnects which may allow for mechanical, rather than strictly metallurgical interconnections.

14 SOLAR ENERGY↗

DOE OSTI2026

Causes of Degradation of Organ Pipes with Very Low Lead Content

This study investigates the causes of degradation in organ pipes with low lead content. Using light This study investigates the causes of degradation in organ pipes with low lead content. Using light optical microscopy, SEM/EDS, and TEM/EDS, intermetallic Cu6Sn5, FeSn2, Sn4As3, and Pb particles were observed in the structure of SnPb alloys. Degradation of the low-Pb organ metal, which is primarily caused by the selective corrosion of lead occurring due to the effect of volatile organic compounds (VOCs). Another factor leading to degradation is the structural transformation of tin occurring at low temperatures (tin pest). TEM/EDS allowed the unique observation of α-tin particles found in a β-tin matrix at room temperature. The presence of particles of α‑tin in historical organ pipes has not previously been reported, and it is the first presented observation of all.

alloy SnPb↗