Recording Leaf Movements with a Strain Gauge
Lightweight strain gauge sensing unit for recording circadian leaf movements in space environment
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High-Temperature Resistance Strain Gauges
Resistance strain gauges developed for use at high temperatures in demanding applications like testing aircraft engines and structures. Measures static strains at temperatures up to 800 degrees C. Small and highly reproducible. Readings corrected for temperature within small tolerances, provided temperatures measured simultaneously by thermocouples or other suitable devices. Connected in wheatstone bridge.
Lei, Jih-Fen↗
Nanocomposite Strain Gauges Having Small TCRs
Ceramic strain gauges in which the strain-sensitive electrically conductive strips made from nanocomposites of noble metal and indium tin oxide (ITO) are being developed for use in gas turbine engines and other power-generation systems in which gas temperatures can exceed 1,500 F (about 816 C). In general, strain gauges exhibit spurious thermally induced components of response denoted apparent strain. When temperature varies, a strain-gauge material that has a nonzero temperature coefficient of resistance (TCR) exhibits an undesired change in electrical resistance that can be mistaken for the change in resistance caused by a change in strain. It would be desirable to formulate straingauge materials having TCRs as small as possible so as to minimize apparent strain. Most metals exhibit positive TCRs, while most semiconductors, including ITO, exhibit negative TCRs. The present development is based on the idea of using the negative TCR of ITO to counter the positive TCRs of noble metals and of obtaining the benefit of the ability of both ITO and noble metals to endure high temperatures. The noble metal used in this development thus far has been platinum. Combinatorial libraries of many ceramic strain gauges containing nanocomposites of various proportions of ITO and platinum were fabricated by reactive co-sputtering from ITO and platinum targets onto alumina- and zirconia-based substrates mounted at various positions between the targets.
Gregory, Otto↗
Fiber-Optic Strain Gauge With High Resolution And Update Rate
An improved fiber-optic strain gauge is capable of measuring strains in the approximate range of 0 to 50 microstrains with a resolution of 0.1 microstrain. (To some extent, the resolution of the strain gauge can be tailored and may be extensible to 0.01 microstrain.) The total cost of the hardware components of this strain gauge is less than $100 at 2006 prices. In comparison with prior strain gauges capable of measurement of such low strains, this strain gauge is more accurate, more economical, and more robust, and it operates at a higher update rate. Strain gauges like this one are useful mainly for measuring small strains (including those associated with vibrations) in such structures as rocket test stands, buildings, oilrigs, bridges, and dams. The technology was inspired by the need to measure very small strains on structures supporting liquid oxygen tanks, as a way to measure accurately mass of liquid oxygen during rocket engine testing. This improved fiber-optic strain gauge was developed to overcome some of the deficiencies of both traditional foil strain gauges and prior fiber-optic strain gauges. Traditional foil strain gages do not have adequate signal-to-noise ratios at such small strains. Fiber-optic strain gauges have been shown to be potentially useful for measuring such small strains, but heretofore, the use of fiberoptic strain gauges has been inhibited, variously, by complexity, cost, or low update rate.
Figueroa, Fernando↗
Temperature-Compensating Inactive Strain Gauge
Thermal contribution to output of active gauge canceled. High-temperature strain gauges include both active gauge wires sensing strains and inactive gauge wires providing compensation for thermal contributions to gauge readings. Inactive-gauge approach to temperature compensation applicable to commercially available resistance-type strain gauges operating at temperatures up to 700 degrees F and to developmental strain gauges operating at temperatures up to 2,000 degrees F.
Moore, Thomas C., Sr.↗
Measurement of high temperature strain by the laser-speckle strain gauge
By using the laser-speckle strain gauge, the strain of metal at the temperature lower than 250 C is measured. The principle of the gauge is to measure the expansion or contraction of the fine structures of surface by detecting the resultant speckle displacement in an optoelectronic way, whereby the effect of rigid-body motion is automatically cancelled out with the aid of a differential detection system. A transportable apparatus was built and a comparison experiment performed with a resistance strain gauge at room temperature. It has a strain sensitivity of .00002, a gauge length smaller than 1 mm, and no upper limit in a range of strain measurement. In the measurement of high-temperature strain it is free from the need for a dummy gauge and insensitive to an electric drift effect. As examples of strain measurement at high-temperature, thermal expansion and contraction of a top of a soldering iron are measured. The interval of the measurement can be made at shortest 1.6 sec. and the change in the strain is clearly followed until the ultimate stationary temperature is reached.
Yamaguchi, I.↗
Suggested Procedures for Installing Strain Gauges on Langley Research Center Wind Tunnel Balances, Custom Force Measuring Transducers, Metallic and Composite Structural Test Articles
The character of force and strain measurement testing at LaRC is such that the types of strain gauge installations, the materials upon which the strain gauges are applied, and the test environments encountered, require many varied approaches. In 1997, a NASA Technical Memorandum (NASA TM 110327) was generated to provide the strain gauge application specialist with a listing of recommended procedures for strain gauging various transducers and test articles at LaRC. The technical memorandum offered here is an effort to keep the strain gauge user informed of new technological enhancements in strain-gauging methodology while preserving the strain-gauging guidelines set forth in the 1997 TM. This document provides detailed recommendations for strain gauging LaRC-designed balances and custom transducers, composite materials, cryogenic and high-temperature test articles, and selected non-typical or unique materials or test conditions. Additionally, one section offers details for installing Bragg-Grating type fiber-optic strain sensors for non-typical test scenarios.
Moore, Thomas C., Sr.↗
First International Symposium on Strain Gauge Balances
The first International Symposium on Strain Gauge Balances was sponsored and held at NASA Langley Research Center during October 22-25, 1996. The symposium provided an open international forum for presentation, discussion, and exchange of technical information among wind tunnel test technique specialists and strain gauge balance designers. The Symposium also served to initiate organized professional activities among the participating and relevant international technical communities. Over 130 delegates from 15 countries were in attendance. The program opened with a panel discussion, followed by technical paper sessions, and guided tours of the National Transonic Facility (NTF) wind tunnel, a local commercial balance fabrication facility, and the LaRC balance calibration laboratory. The opening panel discussion addressed "Future Trends in Balance Development and Applications." Forty-six technical papers were presented in 11 technical sessions covering the following areas: calibration, automatic calibration, data reduction, facility reports, design, accuracy and uncertainty analysis, strain gauges, instrumentation, balance design, thermal effects, finite element analysis, applications, and special balances. At the conclusion of the Symposium, a steering committee representing most of the nations and several U.S. organizations attending the Symposium was established to initiate planning for a second international balance symposium, to be held in 1999 in the UK.
John S Tripp↗
First International Symposium on Strain Gauge Balances
The first International Symposium on Strain Gauge Balances was sponsored and held at NASA Langley Research Center during October 22-25, 1996. The symposium provided an open international forum for presentation, discussion, and exchange of technical information among wind tunnel test technique specialists and strain gauge balance designers. The Symposium also served to initiate organized professional activities among the participating and relevant international technical communities. Over 130 delegates from 15 countries were in attendance. The program opened with a panel discussion, followed by technical paper sessions, and guided tours of the National Transonic Facility (NTF) wind tunnel, a local commercial balance fabrication facility, and the LaRC balance calibration laboratory. The opening panel discussion addressed "Future Trends in Balance Development and Applications." Forty-six technical papers were presented in 11 technical sessions covering the following areas: calibration, automatic calibration, data reduction, facility reports, design, accuracy and uncertainty analysis, strain gauges, instrumentation, balance design, thermal effects, finite element analysis, applications, and special balances. At the conclusion of the Symposium, a steering committee representing most of the nations and several U.S. organizations attending the Symposium was established to initiate planning for a second international balance symposium, to be held in 1999 in the UK.
Tripp, John S↗
Method of Attaching Strain Gauges to Various Materials
A method is provided to bond strain gauges to various materials. First, a tape with an adhesive backing is placed across the inside of the fixture frame. The strain gauge is flatly placed against the adhesive backing and coated with a thin, uniform layer of adhesive. The tape is then removed from the fixture frame and placed, strain gauge side down, on the material to be tested. If the material is a high reluctance material, the induction heating source is placed on the tape. If the material is a low reluctance material, a plate with a ferric side and a rubber side is placed, ferric side down, onto the tape. The induction heating source is then placed upon the rubber side. If the material is an insulator material, a ferric plate is placed on the tape. The induction heating source is then placed on the ferric plate. The inductive heating source then generates frequenty from 60 to 70 kilocycles to inductively heat either low reluctance material, ferric side, of ferric plate and provides incidental pressure of approximately five pounds per square inch to the tape for two minutes, thoroughly curing the adhesive. The induction heating source, and, if necessary, the plate or ferric plate, are then removed from the tape after one minute. The tape is then removed from the bonded strain gauge.
Schott, Timothy D.↗
Strain Gauges Indicate Differential-CTE-Induced Failures
A method of detecting mechanical failure induced by variation in temperature at an adhesive bond between two materials that have different coefficients of thermal expansion (CTEs) involves monitoring of strain-gauge readings. This method can be regarded as an exploitation of the prior observation that the readings of strain gauges commonly used in tensile and compressive testing of material specimens include features indicative of incremental failures in the specimens. In this method, one or more strain gauges are bonded to either or both of the two materials near the bond between the materials. (The adhesive used to bond the strain gauges would not ordinarily be the same as the one used to bond the two materials). Then strain-gauge readings are recorded as the temperature of the materials is varied through a range of interest. Any significant discontinuity in the slope of the resulting strain-versus-temperature curve(s) is taken to be a qualitative indication of a failure of the bond between the two materials and/or a failure within one of the materials in the vicinity of the bond. The method has been demonstrated in experiments on specimens consisting of polyacrylonitrile-fiber/epoxy-matrix laminated composite plates bonded by epoxy to smaller plates made, variously, of aluminum, titanium, and a low-CTE nickel/iron alloy. In preparation for each experiment, strain gauges were bonded, by use of cryogenic-rated adhesives, to the composite plate near the corners of the metal plate (see Figure 1). In each experiment, strain-gauge and temperature readings were taken as the specimen was cooled from room temperature to 20 K. The specimens were then returned to room temperature and ultrasonically inspected for damage in the bond region. No failure events were detectable in the strain-gauge readings from the composite/ titanium and composite/low-thermalexpansion- alloy specimens, and ultrasonic inspection of these specimens revealed no damage. However, failure events were seen in the strain-gauge readings from the composite/aluminum specimens (see Figure 2), and ultrasonic inspection confirmed that there was damage in the bond regions of these specimens.
Harris, Brian↗
Hydraulic Calibrator for Strain-Gauge Balances
Instrument for calibrating strain-gauge balances uses hydraulic actuators and load cells. Eliminates effects of nonparallelism, nonperpendicularity, and changes of cable directions upon vector sums of applied forces. Errors due to cable stretching, pulley friction, and weight inaccuracy also eliminated. New instrument rugged and transportable. Set up quickly. Developed to apply known loads to wind-tunnel models with encapsulated strain-gauge balances, also adapted for use in calibrating dynamometers, load sensors on machinery and laboratory instruments.
Skelly, Kenneth↗
Inexpensive Implementation of Many Strain Gauges
It has been proposed to develop arrays of strain gauges as arrays of ordinary metal film resistors and associated electronic readout circuitry on printed circuit boards or other suitable substrates. This proposal is a by-product of a development of instrumentation utilizing metal film resistors on printed-circuit boards to measure temperatures at multiple locations. In the course of that development, it was observed that in addition to being sensitive to temperature, the metal film resistors were also sensitive to strains in the printed-circuit boards to which they were attached. Because of the low cost of ordinary metal film resistors (typically <$0.01 apiece at 2007 prices), the proposal could enable inexpensive implementation of arrays of many (e.g., 100 or more) strain gauges, possibly concentrated in small areas. For example, such an array could be designed for use as a computer keyboard with no moving parts, as a device for sensing the shape of an object resting on a surface, or as a device for measuring strains at many points on a mirror, a fuel tank, an airplane wing, or other large object. Ordinarily, the effect of strain on resistance would be regarded as a nuisance in a temperature-measuring application, and the effect of temperature on resistance would be regarded as a nuisance in a strain-measuring application. The strain-induced changes in resistance of the metal film resistors in question are less than those of films in traditional strain gauges. The main novel aspect of present proposal lies in the use of circuitry affording sufficient sensitivity to measure strain plus means for compensating for the effect of temperature. For an array of metal film resistors used as proposed, the readout circuits would include a high-accuracy analog-to-digital converter fed by a low noise current source, amplifier chain, and an analog multiplexer chain. Corrections would be provided by use of high-accuracy calibration resistors and a temperature sensor. By use of such readout circuitry, it would be possible to read the resistances of as many as 100 fixed resistors in a time interval of 1 second at a resolution much greater than 16 bits. The readout data would be processed, along with temperature calibration data, to deduce the strain on the printed-circuit board or other substrate in the areas around the resistors. It should also be possible to also deduce the temperature from the readings.
Berkun, Andrew C.↗
The NASA Lewis Strain Gauge Laboratory: An update
Efforts continue in the development and evaluation of electrical resistance strain gauges of the thin film and small diameter wire type. Results obtained early in 1986 on some Chinese gauges and Kanthal A-1 gauges mounted on a Hastelloy-X substrate are presented. More recent efforts include: (1) the determination of the uncertainty in the ability to establish gauge factor, (2) the evaluation of sputtered gauges that were fabricated at Lewis, (3) an investigation of the efficacy of dual element temperature compensated gauges when using strain gauge alloys having large thermal coefficients of resistance, and (4) an evaluation of the practical methods of stabilizing gauges whose apparent strain is dependent on cooling rate (e.g., FeCrAl gauges).
Hobart, H. F.↗
Luminescent Tension-Indicating Orthopedic Strain Gauges for Non-Invasive Measurements Through Tissue
Strain gauges that can provide information with regard to the state of implantable devices are described. The strain gauges can exhibit luminescence that is detectable through living tissue, and the detectable luminescent emission can vary according to the strain applied to the gauge. A change in residual strain of the device can signify a loss of mechanical integrity and/or loosening of the implant, and this can be non-invasively detected either by simple visual detection of the luminescent emission or through examination of the emission with a detector such as a spectrometer or a camera.
Anker, Jeffrey↗
The dual element method of strain gauge temperature compensation
The use of a known temperature compensation technique is suggested to reduce the overall temperature sensitivity of a PdCr strain gauge system being developed for turbine engine research. The temperature compensation technique proposed for this application uses a resistance thermometer in an adjacent leg of the strain gauge bridge circuit to cancel the thermally generated resistance change of the strain gauge. Equations for calculating the required compensation resistor values and the sensitivity of the resulting strain gauge bridge to both temperature and strain are presented.
Englund, David R.↗
Recording leaf movements with a strain gauge.
Leaf movement recording system using strain gauge for testing light-dark cycle effects in connection with physical limitations of orbiting capsule
PLANT /BIOL/↗
More About High-Temperature Resistance Strain Gauges
Two reports present additional information on electrical-resistance strain gauges described in "High-Temperature Resistance Strain Gauges" (LEW-15379). For protection against oxidation at high temperatures, gauges covered, by flame spraying, with coats of alumina containing up to 1 weight percent of yttria or, perferably, containing 4 to 6 weight percent of zirconia.
Englund, D. R.↗