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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS2001

Electrically Isolating Subsystems in SOAC Technologies

Integrated circuit fabrication technology has evolved to the point that it is possible to construct complete systems, including power, data processing, and communications, on a single chip. Such System-on-a-chip (SOAC) technologies can enable drastic reductions in spacecraft size and weight, lowering the cost of missions and presenting new mission opportunities. This paper overviews some key enabling technologies unique to the needs of spacecraft for outer-planet exploration and missions requiring extreme resistance to radiation such as Europa orbiters and Europa Landers. The work is being carried out by Kansas State University (KSU) under direction of the Center for Integrated Space Microsystems (CISM) at NASA's Jet Propulsion Laboratory. Additional information is contained in the original extended abstract.

Boyd, R. M.↗
DOE OSTI2024

Density Functional Tight-Binding Models for Band Structures of Transition-Metal Alloys and Surfaces across the d -Block

First-principles electronic structure simulations are an invaluable tool for understanding chemical bonding and reactions. While machine-learning models such as interatomic potentials significantly accelerate the exploration of potential energy surfaces, electronic structure information is generally lost. Particularly in the field of heterogeneous catalysis, simulated electron band structures provide fundamental insights into catalytic reactivity. This ab initio knowledge is preserved in semiempirical methods such as density functional tight binding (DFTB), which extend the accessible computational length and time scales beyond first-principles approaches. In this paper here we present Shell-Optimized Atomic Confinement (SOAC) DFTB electronic-part-only parametrizations for bulk and surface band structures of all d-block transition metals that enable efficient predictions of electronic descriptors for large structures or high-throughput studies on complex systems outside the computational reach of density functional theory.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS2001

Miniature Free-Flying Magnetometer Utilizing System-On-A-Chip Technology

Four Free-Flying Magnetometers (FFMs), developed at the Jet Propulsion Laboratory (JPL) for the Enstrophy mission, were successfully deployed from the payload of a sounding rocket launched from Poker Flats, Alaska on February 11, 1999. The FFMs functioned successfully by synchronously measuring the vector magnetic field at 4 points separate from the payload and at relative distances up to 3 km, and communicated their data, in bursts, to the ground. This is the first time synchronized in-situ multipoint measurements of the Earth's magnetic field utilizing miniature spin-stabilized "sensorcraft" have been performed. The data they provided have enabled, for the first time, the direct measure of field-aligned current density and are enabling new science by determining the fine-scale structure of the currents in the Earth's ionosphere involved in the production of aurora. These proof-of-concept "hockey puck" (80 mm diameter, 38 mm height, 250 gram mass) FFMs were built using off-the-shelf commercial, industrial, and military grade surface-mount electronic components. Radiation-hard electronics was not required for the Enstrophy mission's short sub-orbital flight. The successful design, implementation, and flight demonstration of this 1st generation FFM design has provided a solid base for further development of a 2nd generation FFM design for planetary science applications. A reliable ultra-miniature radiation-hard 2nd-generation FFM utilizing System-On-A-Chip (SOAC) technologies is proposed. This design would be targeted for long-term planetary missions to investigate magnetospheric field configurations in regions having small-scale structure and to separate spatial and temporal variations. A fleet of short-lived (expendable) FFMs would be deployed into a targeted region to gather multiprobe vector magnetic field data. The FFMs would be ejected from a parent spacecraft at a speed of a few m/sec and would cover spatial volumes of order tens of kilometers for times of order one hour. The parent spacecraft would carry a sufficient number of FFMs for multiple deployments. Additional information is contained in the original extended abstract.

Eyre, F. B.↗
NASA NTRS2001

Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging

Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.

DAgostino, S. A.↗
NASA NTRS2001

Advanced RF Front End Technology

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.

Herman, M. I.↗
NASA NTRS2001

Ultra Low Power, Radiation Tolerant UHF Radio Technologies for In Situ Communication Applications

For future deep space missions, significant reductions in the mass and power requirements for short-range telecommunication systems will be critical in enabling a wide variety of new mission concepts. These possibilities include penetrators, gliders, miniature rovers, and sensor networks. Under joint funding from NASA's Cross Enterprise and JPL's Telecommunications and Mission technology programs, recent development activity has focused on the design of ultralow mass and power transceiver systems and subsystems suitable for operation in a flight environment. For these efforts, the functionality of the transceiver has been targeted towards a specific Mars communications scenario. However, the overall architecture is well suited to any short or medium range application where a remote probe will aperiodically communicate with a base station, possibly an orbiter, for the eventual purpose of relaying science information back to Earth. In 2001, these sponsors have been augmented with collaborative expertise and funding from JPL's Center for Integrated Space Microsystems in order to migrate existing concepts and designs to a System on a Chip (SOAC) solution. Additional information is contained in the original extended abstract.

Lay, N. E.↗
NASA NTRS2002

High-Power, High-Frequency Si-Based (SiGe) Transistors Developed

Future NASA, DOD, and commercial products will require electronic circuits that have greater functionality and versatility but occupy less space and cost less money to build and integrate than current products. System on a Chip (SOAC), a single semiconductor substrate containing circuits that perform many functions or containing an entire system, is widely recognized as the best technology for achieving low-cost, small-sized systems. Thus, a circuit technology is required that can gather, process, store, and transmit data or communications. Since silicon-integrated circuits are already used for data processing and storage and the infrastructure that supports silicon circuit fabrication is very large, it is sensible to develop communication circuits on silicon so that all the system functions can be integrated onto a single wafer. Until recently, silicon integrated circuits did not function well at the frequencies required for wireless or microwave communications, but with the introduction of small amounts of germanium into the silicon to make silicon-germanium (SiGe) transistors, silicon-based communication circuits are possible. Although microwavefrequency SiGe circuits have been demonstrated, there has been difficulty in obtaining the high power from their transistors that is required for the amplifiers of a transmitter, and many researchers have thought that this could not be done. The NASA Glenn Research Center and collaborators at the University of Michigan have developed SiGe transistors and amplifiers with state-of-the-art output power at microwave frequencies from 8 to 20 GHz. These transistors are fabricated using standard silicon processing and may be integrated with CMOS integrated circuits on a single chip. A scanning electron microscope image of a typical SiGe heterojunction bipolar transistor is shown in the preceding photomicrograph. This transistor achieved a record output power of 550 mW and an associated power-added efficiency of 33 percent at 8.4 GHz, as shown. Record performance was also demonstrated at 12.6 and 18 GHz. Developers have combined these state-of-the-art transistors with transmission lines and micromachined passive circuit components, such as inductors and capacitors, to build multistage amplifiers. Currently, a 1-W, 8.4-GHz power amplifier is being built for NASA deep space communication architectures.

Ponchak, George E.↗
NASA NTRS1999

A Low-Power High-Speed Smart Sensor Design for Space Exploration Missions

In this paper, an ultra-fast low-power smart vision system-on-a-chip design is proposed to provide effective solutions for real time machine vision applications by taking advantages of advances in integrated sensing/processing designs, electronic neural networks, advanced microprocessors, and sub-micron VLSI systemns-on-a-chip (SOAC) technology.

space↗
NASA NTRS1999

Future Avionics for X2K

The JPL X2000 program is for the delivery of advanced avionics systems, cutting edge technologies, and avionics components to spacecraft/orbiter, micro/nano-spacecraft, and in-situ missions. The objective is to develop and deliver avionics systems that will serve a multitude of future missions over the next 12 to 15 years.

DSST X2000 Micro/Nano Spacecraft Avionics distribu↗
NASA NTRS1999

Avionics Systems On A Chip for Space Exploration

The advanced miniaturization of all the on-board spacecraft functions into a highly integrated, modular, and reliable architecture is a major enabling technology for future deep-space and Earth orbiting science missions.

Avionics↗