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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2013

Inter-slice bidirectional registration-based segmentation of the prostate gland in MR and CT image sequences

Purpose: Accurate segmentation and volume estimation of the prostate gland in magnetic resonance (MR) and computed tomography (CT) images are necessary steps in diagnosis, treatment, and monitoring of prostate cancer. This paper presents an algorithm for the prostate gland volume estimation based on the semiautomated segmentation of individual slices in T2-weighted MR and CT image sequences. Methods: The proposedInter-Slice Bidirectional Registration-based Segmentation (iBRS) algorithm relies on interslice image registration of volume data to segment the prostate gland without the use of an anatomical atlas. It requires the user to mark only three slices in a given volume dataset, i.e., the first, middle, and last slices. Next, the proposed algorithm uses a registration algorithm to autosegment the remaining slices. We conducted comprehensive experiments to measure the performance of the proposed algorithm using three registration methods (i.e., rigid, affine, and nonrigid techniques). Results: The results with the proposed technique were compared with manual marking using prostate MR and CT images from 117 patients. Manual marking was performed by an expert user for all 117 patients. The median accuracies for individual slices measured using the Dice similarity coefficient (DSC) were 92% and 91% for MR and CT images, respectively. The iBRS algorithm was also evaluated regarding user variability, which confirmed that the algorithm was robust to interuser variability when marking the prostate gland. Conclusions: The proposed algorithm exploits the interslice data redundancy of the images in a volume dataset of MR and CT images and eliminates the need for an atlas, minimizing the computational cost while producing highly accurate results which are robust to interuser variability.

62 RADIOLOGY AND NUCLEAR MEDICINE↗
DOE OSTI2018

Dispersion-Based Fresh-Slice Scheme for Free-Electron Lasers

The fresh-slice technique improved the performance of several self-amplified spontaneous emission free-electron laser schemes by granting selective control on the temporal lasing slice without spoiling the other electron bunch slices. So far, the implementation has required a special insertion device to create the beam yaw, called a dechirper. Finally, we demonstrate a novel scheme to enable fresh-slice operation based on electron energy chirp and orbit dispersion that can be implemented at any free-electron laser facility without additional hardware.

47 OTHER INSTRUMENTATION↗
NASA NTRS1982

Overview of a new slicing method: Fixed Abrasive Slicing Technique (FAST)

The fixed abrasive slicing technique (FAST) was developed to slice silicon ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10 cm diameter and 19 wafers/cm from 15 cm diameter ingots. This was achieved with a combination of machine development and wire-blade development programs. Correlation was established between cutting effectiveness and high surface speeds. A high speed slicer was designed and fabricated for FAST slicing. Wirepack life of slicing three 10 cm diameter ingots was established. Electroforming techniques were developed to control widths and prolong life of wire-blades. Economic analysis indicates that the projected add-on price of FAST slicing is compatible with the DOE price allocation to meet the 1986 cost goals.

Schmid, F.↗
NASA NTRS1982

Part 2: Multi-wire slicing. Fixed Abrasive Slicing Technique (FAST)

The Fixed Abrasive Slicing Techniques (FAST) is a new slicing technique that was developed to slice ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10cm diameter and 19 wafers/cm from 15 cm diameter ingots. Over 99% yield (222 out of a possible 224) was demonstrated during slicing of a 10 cm diameter ingots at 25 wafers/cm. The average thickness of wafers was 0.249 mm and the kerf was 0.151 mm. Slicing rates as high as 0.14 mm/min were also demonstrated for 10 cm diameter ingots.

Source record↗
NASA NTRS1979

Silicon ingot casting: Heat exchanger method. Multi-wire slicing: Fixed abrasive slicing technique, phase 3

In the area of ingot casting the proof of concept of heat exchanger method (HEM) was established. It was also established that HEM cast silicon yielded solar cell performance comparable to Czochralski grown material. Solar cells with conversion efficiencies of up to 15% were fabricated. It was shown that square cross-section ingots can be cast. In the area of crystal slicing, it was established that silicon can be sliced efficiently with the fixed abrasive slicing technique approach. This concept was carried forward to 10 cm diameter workpiece.

Schmid, F.↗
NASA NTRS1982

Silicon slicing by fixed abrasive slicing technique

One of the major cost factors in silicon ingot technology adaptation for terrestrial photovoltaic application is in slicing boules into wafers. The most developed industrial practice is the Internal Diameter (ID) slicing. This method utilizes diamond cutting. The diamond stands up for long periods, hence, the cost of expendable materials is low. However, the ID technology as practiced today has poor material utilization. The Multiblade Slurry (MBS) method has low equipment and labor costs but its expendable material costs are high. Recently Multiwire Slurry (MWS) technology has shown very good material utilization, but its expendable material costs are even higher than MBS. The multiwire Fixed Abrasive Slicing Technique (FAST) still in advanced development stage, combines the low expendable material costs of ID method, the low labor and equipment costs of MBS and high material utilization of MWS.

Schmid, F.↗
DOE OSTI2018

Fresh Slice Self-Seeding and Fresh Slice Harmonic Lasing at LCLS

We present results from the successful demonstration of fresh slice self-seeding at the Linac Coherent Light Source (LCLS).* The performance is compared with SASE and regular self-seeding at photon energy of 5.5 keV, resulting in a relative average brightness increase of a factor of 12 and a factor of 2 respectively. Following this proof-of-principle we discuss the forthcoming plans to use the same technique** for fresh slice harmonic lasing in an upcoming experiment. The demonstration of fresh slice harmonic lasing provides an attractive solution for future XFELs aiming to achieve high efficiency, high brightness X-ray pulses at high photon energies (>12 keV).***

Amann, J.W.↗
DOE OSTI2015

Large grain CBMM Nb ingot slices: An ideal test bed for exploring the microstructure-electromagnetic property relationships relevant to SRF

High purity (RRR > 200), large grain (> 5-10 cm) niobium ingot slices have been successfully used to fabricate radio frequency (RF) cavities for particle accelerators. They offer significantly reduced fabrication cost by eliminating processing steps and furthermore they provide the opportunity to study the influence of individual grain boundaries in SRF Nb. Here we summarize our measurements of grain boundary (GB) effects on the superconducting properties of large grain high purity niobium sheet manufactured by CBMM. We show by magneto-optical (MO) imaging that GBs allow premature flux penetration, but only when they are oriented close to the direction of the magnetic field. However, even low angle GBs produced by minor deformations commensurate with half-cell forming produce localized flux penetration. The transport properties of grain boundaries were investigated by direct transport across them and evidence for preferential vortex flow along the GBs of SRF Nb was observed for the first time. Using transmission electron microscopy (TEM) and micro crystallographic analysis with electron backscattered diffraction (EBSD), we were able to quantitatively characterize surface substructures that can lead to localized thermal breakdown of superconductivity. Important to these studies was the development of sample preparation techniques that made the cutout single, bi-crystal and tri-crystal Nb coupons as representative as possible of the surface properties of cavities manufactured by standard techniques.

36 MATERIALS SCIENCE↗
DOE OSTI2018

Deterministic Design of High Precision Slicing Machine Final Report CRADA No. T-160-91-1-C (Advanced manufacturing initiative final report. Deterministic design of high precision slicing machine)

The project is designed to merge the expertise of LLNL and a US slicing machine builder in the development and production of a family of ultra-precise, slicing/grinding machines. The project will lead to the joint development of a modular family of slicers which are easily configured to a given accuracy and size. The slicers can then be profitably produced and marketed for similar precision machining applications. This project is directed towards maintaining a competitive edge for US manufacturers in the area of high precision slicing and grinding machines.

36 MATERIALS SCIENCE↗
NASA NTRS1981

Silicon Ingot Casting - Heat Exchanger Method (HEM). Multi-Wire Slicing - Fixed Abrasive Slicing Technique (Fast). Phase 4 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-Cost Solar Array Project

The crystallinity of large HEM silicon ingots as a function of heat flow conditions is investigated. A balanced heat flow at the bottom of the ingot restricts spurious nucleation to the edge of the melted-back seed in contact with the crucible. Homogeneous resistivity distribution over all the ingot has been achieved. The positioning of diamonds electroplated on wirepacks used to slice silicon crystals is considered. The electroplating of diamonds on only the cutting edge is described and the improved slicing performance of these wires evaluated. An economic analysis of value added costs of HEM ingot casting and band saw sectioning indicates the projected add on cost of HEM is well below the 1986 allocation.

Schmid, F.↗
NASA NTRS1982

Wire blade development for Fixed Abrasive Slicing Technique (FAST) slicing

A low cost, effective slicing method is essential to make ingot technology viable for photovoltaics in terrestrial applications. The fixed abrasive slicing technique (FAST) combines the advantages of the three commercially developed techniques. In its development stage FAST demonstrated cutting effectiveness of 10 cm and 15 cm diameter workpieces. Wire blade development is still the critical element for commercialization of FAST technology. Both impregnated and electroplated wire blades have been developed; techniques have been developed to fix diamonds only in the cutting edge of the wire. Electroplated wires show the most near term promise and this approach is emphasized. With plated wires it has been possible to control the size and shape of the electroplating, it is expected that this feature reduces kerf and prolongs the life of the wirepack.

Khattak, C. P.↗
DOE OSTI2015

Crossed-beam DC slice imaging of fluorine atom reactions with linear alkanes

We report the reaction dynamics of F atom with selected alkanes studied by crossed beam scattering with DC slice ion imaging. The target alkanes are propane, n-butane, and n-pentane. The product alkyl radicals are probed by 157 nm single photon ionization following reaction at a collision energy of ∼10 kcal mol{sup −1}. The analyzed data are compared with the corresponding theoretical studies. Reduced translational energy distributions for each system show similar trends with little of the reaction exoergicity appearing in translation. However, the pentane reaction shows a somewhat smaller fraction of available energy in translation than the other two, suggesting greater energy channeled into pentyl internal degrees of freedom. The center-of-mass angular distributions all show backscattering as well as sharp forward scattering that decreases in relative intensity with the size of the molecule. Possible reasons for these trends are discussed.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
NASA NTRS1979

Silicon Ingot Casting - Heat Exchanger Method Multi-wire Slicing - Fixed Abrasive Slicing Technique. Phase 3 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-cost Solar Array Project

Several 20 cm diameter silicon ingots, up to 6.3 kg. were cast with good crystallinity. The graphite heat zone can be purified by heating it to high temperatures in vacuum. This is important in reducing costs and purification of large parts. Electroplated wires with 45 um synthetic diamonds and 30 um natural diamonds showed good cutting efficiency and lifetime. During slicing of a 10 cm x 10 cm workpiece, jerky motion occurred in the feed and rocking mechanisms. This problem is corrected and modifications were made to reduce the weight of the bladeheat by 50%.

Schmid, F.↗
NASA NTRS1979

Silicon Ingot Casting: Heat Exchanger Method. Multi-wire Slicing: Fixed Abrasine Slicing Technique, Phase 3

Ingot casting was scaled up to 16 cm by 16 cm square cross section size and ingots weighing up to 8.1 kg were cast. The high degree of crystallinity was maintained in the large ingot. For large sizes, the nonuniformity of heat treatment causes chipping of the surface of the ingot. Progress was made in the development of a uniform graded structure in the silica crucibles. The high speed slicer blade-head weight was reduced to 37 pounds, allowing surface speeds of up to 500 feet per minute. Slicing of 10 cm diameter workpieces at these speeds increased the through-put of the machine to 0.145 mm/min.

Schmid, F.↗