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Sensor Chip Assembly (SCA) Test Report

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

WFIRST SCA TEST REPORT

SCA Test Report: H4RG-20828 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report, H4RG-20829 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan R Miko

SCA Test Report: H4RG-20833 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 90 K (1.0V bias voltage) and 95 K (0.5V bias voltage) are also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report: H4RG-20849 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. For all cases, the frame time used is 2.764 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report: H4RG-21224 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below.The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report: H4RG-21225 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test,the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report: H4RG-21317 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report: H4RG-21319 WFIRST

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 µm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report H4RG-21813: Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-P ROC-09220_WFIRST-SCA-ATP_-.docx.A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary ( Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report H4RG-21814: Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-P ROC-09220_WFIRST-SCA-ATP_-.docx.A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary ( Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Test Report H4RG-21815: Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm.This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCA-ATP_-.docx.A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

Design and Testing of Space Telemetry SCA Waveform

A Software Communications Architecture (SCA) Waveform for space telemetry is being developed at the NASA Glenn Research Center (GRC). The space telemetry waveform is implemented in a laboratory testbed consisting of general purpose processors, field programmable gate arrays (FPGAs), analog-to-digital converters (ADCs), and digital-to-analog converters (DACs). The radio hardware is integrated with an SCA Core Framework and other software development tools. The waveform design is described from both the bottom-up signal processing and top-down software component perspectives. Simulations and model-based design techniques used for signal processing subsystems are presented. Testing with legacy hardware-based modems verifies proper design implementation and dynamic waveform operations. The waveform development is part of an effort by NASA to define an open architecture for space based reconfigurable transceivers. Use of the SCA as a reference has increased understanding of software defined radio architectures. However, since space requirements put a premium on size, mass, and power, the SCA may be impractical for today s space ready technology. Specific requirements for an SCA waveform and other lessons learned from this development are discussed.

Mortensen, Dale J.

SCA Test Report H4RG-21645 Roman Space Telescope

This report summarizes the measured performance for the Sensor Chip Assembly (SCA), which is identified in Table 1. The SCA architecture is a substrate-removed HgCdTe detector with an area of 4096x4096 pixels (with a reference pixel area of four pixels deep around all four sides, available to substitute corresponding image pixels) and a pixel pitch of 10 μm. This SCA has been tested at the Goddard Space Flight Center (GSFC/NASA) Detector Characterization Laboratory (DCL). Teledyne (the vendor) classifies its detectors into different grades based on testing performed at its facility. The classification of this SCA and the tested dates are included in Table 1 below. The tests performed on this array are derived from the document WFIRST-PROC-09220_WFIRST-SCAATP_-.docx. A summary of the test parameters, requirements, and test results is presented in Table 2. The details of each test are subsequently described in the report. In the Summary (Table 2), SCA results are reported at an operating temperature of 95K, and 1.0 V bias voltage. In the detailed section of each test, the results for 95 K and 0.5V bias voltage is also reported. The data for the result reported in this document was acquired in pixel reset mode. For all cases, the frame time used is 2.830 seconds. Reference pixel correction was applied to every raw frame.

Laddawan Miko

SCA Waveform Development for Space Telemetry

The NASA Glenn Research Center is investigating and developing suitable reconfigurable radio architectures for future NASA missions. This effort is examining software-based open-architectures for space based transceivers, as well as common hardware platform architectures. The Joint Tactical Radio System's (JTRS) Software Communications Architecture (SCA) is a candidate for the software approach, but may need modifications or adaptations for use in space. An in-house SCA compliant waveform development focuses on increasing understanding of software defined radio architectures and more specifically the JTRS SCA. Space requirements put a premium on size, mass, and power. This waveform development effort is key to evaluating tradeoffs with the SCA for space applications. Existing NASA telemetry links, as well as Space Exploration Initiative scenarios, are the basis for defining the waveform requirements. Modeling and simulations are being developed to determine signal processing requirements associated with a waveform and a mission-specific computational burden. Implementation of the waveform on a laboratory software defined radio platform is proceeding in an iterative fashion. Parallel top-down and bottom-up design approaches are employed.

Mortensen, Dale J.

A Thermal Review of the Sample Cartridge Assembly (SCA) Gravitational Effect of Distortion in Sintering (GEDS) Experiment Flight Processing

NASA’s Sample Cartridge Assembly (SCA) first flight experiment, Gravitational Effect of Distortion in Sintering (GEDS), was processed on the International Space Station (ISS) between 2019 and 2020. The SCA was heated in the European Space Agency’s (ESA) Low Gradient Furnace (LGF) that is housed inside the Material Science Research Rack (MSRR) located in the U.S. Laboratory Module. This summary will give a review of the design and flight experiment development for the GEDS SCA. It describes flight processing and the role of thermal engineering support. Lessons learned and future Principle Investigators (PI) will be discussed.

Micro-gravity Science

A Thermal Review of the Sample Cartridge Assembly (SCA) Gravitational Effect of Distortion in Sintering (GEDS) Experiment Flight Processing

NASA’s Sample Cartridge Assembly (SCA) first flight experiment, Gravitational Effect of Distortion in Sintering (GEDS), was processed on the International Space Station (ISS) between 2019 and 2020. The SCA was heated in the European Space Agency’s (ESA) Low Gradient Furnace (LGF) that is housed inside the Material Science Research Rack (MSRR) located in the U.S. Laboratory Module. This summary will give a review of the design and flight experiment development for the GEDS SCA. It describes flight processing and the role of thermal engineering support. Lessons learned and future Principle Investigators (PI) will be discussed.

MIcro-gravity Science

SCA Tools - SCRM Value Add or Lossy Noise Machines

Software supply chain risk management (SCRM) depends upon accurate information regarding the software components that comprise any given software system. The collection of components included in a software package can be organized within a software bill of materials, or SBOM. SBOMs are ideally generated when the software components are put together, such as at compile time, but for many reasons that has not and is not always possible. For example, legacy or proprietary software packages often do not have SBOMs available to downstream consumers of that software. It’s not just end users that are affected, manufacturers themselves also must deal with this problem. To answer these questions, the market has seen the rise of several commercial software composition analysis (SCA) tools. These tools aim to peer into completed software systems, automatically identifying hidden software dependencies and looking up known vulnerabilities associated with those dependencies to enable end-users to enhance their cyber supply chain risk management processes. These tools are potentially a huge boon to end users of legacy and proprietary software – and a potential bane, depending on how accurate they are. This research asks that question – how accurate are currently available binary SCA tools – and provides answers to several other questions: What does it mean to be “accurate”? What limitations do the tools have in identifying common edge cases that take place in modern software development? Can they help you avoid a devastating supply chain attack, or is it all just noise? After researching SCA tools on the market, we identified three vendors that fit our use case and would provide analysis on compiled binaries. Using these tools, we submitted firmware for critical infrastructure devices for analysis and SBOM generation. The SBOM outputs were then cross referenced with SBOMs generated through manual analysis for comparison. In addition to the firmware samples, we also submitted edge case samples based off a popular open-source library that were specifically crafted to evaluate each tools’ ability to accurately identify components. These samples were customized to be consistent with modifications we have seen in modern software development as well as a couple that are representative of supply chain attacks.

97 MATHEMATICS AND COMPUTING