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At least 19 records

Recycling of Printed Circuit Boards to Recover Critical Materials

The printed circuit board (PCB), a central component of most electronic devices, represents a significant fraction of the electronic product waste stream. The complex composition of PCBs, consisting of metals, polymers, and fiberglass, requires specialized recovery steps to reclaim valuable and critical materials and the safe disposal of brominated compounds. In this review paper, we describe the current state of critical material recovery and traditional recycling technologies and identify key obstacles to large-scale implementation. Metals present at high concentrations, such as copper, lead, and iron, are conventionally recovered from PCBs using hydrometallurgical, pyrometallurgical, or electrometallurgical processes. Hydrometallurgical methods achieve high selectivity through chemical leaching but pose significant challenges for effluent and reagent recovery. Pyrometallurgical methods facilitate rapid metal separation through smelting but require substantial energy and may release harmful gases. Electrometallurgical techniques produce high-purity metals but are constrained by pretreatment requirements and the consumption of energy. The non-metallic fraction of PCB waste is recycled using thermochemical conversion, microwave-aided heating, and direct recycling of epoxy–fiberglass composites, enabling material or energy recovery. The recovered polymer from direct recycling may have reduced mechanical strength and poor compatibility with new polymer matrices, and the resulting products from the thermal conversion suffer from incomplete conversion, degradation of quality, and residual contamination, as compared to synthetic polymers. Recent process developments have focused on extracting rare earth and supply-critical materials present at lower concentrations in the waste stream. The literature on existing and emerging approaches for recycling PCB wastes is reviewed to identify sustainable, economically viable, and environmentally responsible strategies for the recovery and reuse of critical materials from waste streams.

36 MATERIALS SCIENCE

Printed circuit primary heat exchanger for power conversion in heat pipe microreactor applications

Here, in the present study, a model was developed for a recuperated air Brayton cycle for heat pipe microreactors, and the effect of the primary heat exchanger type assessed. An annular flow heat exchanger and a printed circuit heat exchanger (PCHE) were evaluated. A sub-sized diffusion bonded, PCHE test specimen was manufactured and tested with nitrogen as the working fluid to validate and improve the PCHE model. A comparison of the thermal cycle efficiency for the Brayton cycle coupled to a heat pipe microreactor using each of the two primary heat exchangers showed competitive performance for both options, with achievable cycle efficiencies of 34 % and 35 % for the annular and printed circuit heat exchangers, respectively. The impact of heat pipe length and additional reheating stages on cycle efficiency was studied. Increasing the heat pipe condenser length from 0.8 to 2.0 m resulted in an increase in cycle efficiency of 3.5 % and 3.2 % for the annular and printed circuit heat exchangers, respectively. The use of additional reheating stages showed a reduction in cycle efficiency since the heat pipe surface area limits the primary heat exchanger size and effectiveness. These results highlight the importance of the primary heat exchanger on the performance of a heat pipe microreactor. Overall, the cycle model, testing, and heat exchanger model showed the potential for the PCHE to improve the economics of a heat pipe microreactor relative to the annular flow heat exchanger, which also opens the possibility to use different heat transfer fluids such as supercritical CO 2 .

PCHE

Adhesively Bonded Copper and Polyimide for Flexible Printed Circuit Boards: A Data-Driven Degradation Study Under Accelerated Aging

The long-term durability of polyimide laminated adhesive based flexible printed circuit boards (PCBs) is critical to the microelectronics industry. The interface of the adhesive layer binding the polyimide and copper layers is particularly vulnerable since decreased bonding strength can lead to deadhesion, performance loss, and premature device failure. Here, in this study, adhesive-bonded polyimide and copper samples are subjected to 1000 h of damp heat exposure (85 °C/85%RH) to evaluate the impact of moisture and copper inclusion on the adhesive bonding performance. Significant copper diffusion through the adhesive layer is observed, which, combined with moisture uptake, is found to substantially weaken interfacial adhesion in copper-containing samples, thereby reducing device lifetime. Observed surface and bulk material changes are correlated to adhesion strength using the network structural equation modeling (netSEM) approach, resulting in a robust predictive model of performance degradation based on measurable materials properties.

Chemistry

Aerosol-Jet Printed Transferable Millimeter-Wave Circuits

Printed millimeter wave (mmW) electronics have been of high interest in the field of communications for some time now due to the potential ability to fabricate mmW systems that utilize 3-Dimension Heterogeneous Integration (3DHI) to improve performance beyond traditional systems. Here, in this paper, a method for fabricating transferable mmW structures via aerosol-jet printing (AJP) is presented. A PDMS stamp assisted liftoff procedure is developed to separate the printed part from a rigid printing support surface and apply it to an adhesive target surface. Several microstrip (MS) line structures are demonstrated to characterize the effect of stamp transfer on the RF performance of the printed circuits. The effects of printed vias on RF probe pads and shifts in the resonant frequencies of a Beatty standard line after transfer are considered and characterized using S-parameter measurements.

42 ENGINEERING

Development of a Test-Bed for Testing and Refining EarthEn’s Supercritical CO 2 Based Energy Storage System

EarthEn’s energy storage concept leverages supercritical carbon dioxide (sCO 2 ) as a working fluid and relies on compact, high-performance components operating at elevated pressures and temperatures. To accelerate component development and reduce technical risk prior to larger-scale demonstrations, Oak Ridge National Laboratory (ORNL) developed a 100 kW-scale sCO 2 test-bed under a Cooperative Research and Development Agreement with EarthEn (CRADA NO. NFE-24-10050). The objective of the work was to design and construct a flexible experimental facility capable of reproducing key thermodynamic state points and heat-transfer conditions relevant to EarthEn’s thermal energy storage (TES) cycle, with particular emphasis on enabling development and evaluation of next-generation heat exchangers and TES concepts. The test-bed consists of a closed-loop sCO 2 circulation system housed within an open-topped enclosure. In its as-installed configuration, dense-phase sCO 2 is recirculated through a printed circuit recuperator, an electrically heated section, a throttling device used to simulate turbine expansion, and a water-cooled printed circuit heat exchanger that rejects heat to the building chilled-water system before returning to the pump. The pump is driven by a variable frequency drive, enabling controlled adjustment of flow and operating point. A comprehensive instrumentation suite was integrated to support both safe operation and high-quality data collection. Installed sensors include Coriolis flow meters for sCO 2 flow rate and density, resistance temperature detectors and thermocouples distributed throughout the loop (including the heated section and key heat exchanger ports), and pressure transducers for absolute and differential pressure measurements. The facility was designed to support high-pressure (19 MPa nominal) and high-temperature (575°C nominal) operation with credited overpressure protection provided by a rupture disk. Nominal operating conditions were selected to support 100 kW-class testing while maintaining flexibility for non-heated and heated shakedown, control development, and future integration of advanced TES test sections. In parallel with facility development, a system-level thermal-hydraulic model was created using Modelica-based tools to support component sizing, anticipate performance over targeted test conditions, and establish a framework for future model calibration against experimental data. At the conclusion of the project performance period, the facility was in final assembly, and the pressure boundary was nearly completed. However, several practical challenges associated with high-pressure/high-temperature systems and specialized component procurement impacted schedule and prevented initial pump-driven operation and full commissioning within the available resources. This report documents the as-built design, operating capabilities, and instrumentation, and it summarizes key lessons learned related to heater fabrication and testing, first-of-a-kind assembly factors, specialty flange supply constraints, and fill pump corrective actions. Finally, it outlines a phased plan for future commissioning and experimental campaigns, including control and instrumentation shakedown, heater characterization, model calibration, and testing at state points representative of EarthEn’s TES cycle.

25 ENERGY STORAGE

Comparative Analysis of Heat Exchangers for High Temperature High Pressure Helium Component Testing

Helium gas loops have been designed and built to gain a better understanding of the gas thermohydraulic phenomena that take place in a helium system. Some of these loops are used for validation and testing of components for high temperature gas-cooled reactors (HTGRs). However, most of them operate at lower pressure and temperature than an HTGR. While these loops can provide valuable information about gas-cooled reactor components, the operating envelope of the experiment is constrained by the maximum operating conditions of the helium loop. In response to the lack of an experimental facility that can provide the infrastructure needed to validate and test components at nominal pressures and temperatures of HTGRS, the HElium Component Testing Out-of-pile Research (HECTOR) facility was designed at Idaho National Laboratory with the assistance of University of Idaho and Walsh Engineering. With the capability to test at temperatures up to 800°C and pressures of 8MPa, HECTOR serves as a critical tool for the advancement of HTGR technology. The facility's primary role is to provide a controlled, high-fidelity environment for the assessment of component resilience and efficiency under nominal HTGR conditions. In the quest to enhance the efficiency and performance of HECTOR, a comparative analysis of three distinct types of heat exchangers—shell and tube, offset strip fin, and printed-circuit—was conducted, focusing primarily on two critical metrics: the required surface area and pressure drop characteristics. The shell and tube heat exchanger, renowned for its robust design and widespread industrial application, was evaluated against the offset strip fin and the cuttingedge printed-circuit heat exchangers, both of which are lauded for their compactness and thermal effectiveness. This comparative study aims to provide detailed insights into the thermal management capabilities of each heat exchanger type under the conditions inherent to HECTOR, thereby facilitating an informed selection for systems demanding high operational integrity and efficiency.

22 GENERAL STUDIES OF NUCLEAR REACTORS

Ion Mobility Separations Using Cocentric Architecture

Ion mobility separations are usually performed in linear channels, which, when extended, can have a large footprint. In this work, we explored the performance of an ion mobility device with a curved architecture which can have a more compact form. The Co-centric Ion Mobility Spectrometer (CIMS) works by manipulating ions between two co-centric surfaces, each containing a serpentine track. The mobility separation inside CIMS is achieved using traveling waveforms (TWs). We initially evaluated the device using ion trajectory simulations using SIMION, which indicated that when ions traveled circularly inside CIMS, they resulted in similar resolving powers and transmitted m/z range as traveling in a straight path in structures for lossless ion manipulations (SLIM). We then performed experimental validation of CIMS in conjunction with a TOF MS. The CIMS was made of 2 flexible printed circuit board materials folded into concentric cylinders separated by a gap of 2.8 mm. The device was about 50 mm diameter × 152 mm long and provided 1.846 m of serpentine path length. Three sets of mixtures (Agilent tune mixture, tetraalkylammonium salts, and 8 peptide mixture) and four traveling waveform profiles (square, sine, triangle, and sawtooth) were used. The sawtooth TW profile produced a slightly higher resolving power for the Agilent tuning mixture and tetraalkylammonium ions. The average resolving power for Agilent tune mixture ions ranged from 37 (using sawtooth TW) to 27 (using square TW). For tetraalkylammonium ions, the average resolving powers ranged from 45 (sawtooth TW) to 31 (square TW). For the peptide mixture ions, the resolving power was similar among the four TW profiles and ranged from 51 to 56. The average percent error in TW CCS for the peptide mixture ions ranged was about 0.4%. In conclusion, the new device showed promising results for a device made of a flexible printed circuit board material, but improvements are needed to further increase the resolving power.

59 BASIC BIOLOGICAL SCIENCES

Exploring the Use of Flexible Circuit Boards to the Increase Power Density of a Rotary Triboelectric Nanogenerator

EExpansion on previous triboelectric nanogenerator (TENG) research that investigated a freestanding rotary TENG. The previous prototype used a single printed circuit board (PCB) stator with exposed copper electrodes and an arcylic rotor with vinyl-cut fluorinated ethylene propylene (FEP) wedges. The second generation prototype again used a PCB stator but used a flexible PCB rotor consisting of alternating polyamide and copper wedges. This prototype was assembled in a stacked configuration, with the intent of increasing current output. Results indicated that the internal resistance of the prototype was decreased, allowing for higher current output. However, degradation of the power output was observed, which led to decay testing of the prototypes. To overcome charge decay, a self-exciting design is suggested as further work.

42 ENGINEERING

Investigation of a Multi-Rotor Triboelectric Nanogenerator Using a Modular Flexible Circuit Board Stack

Triboelectric nanogenerators (TENGs) are a nascent class of energy harvester that are being explored for scavenging energy from small ocean waves. To date, they have been integrated in wave energy converters (WECs) designed to capture random motion caused by the perturbations of the ocean surface. Blue economy applications such as ocean observation can benefit greatly from more substantial wave-derived power, as such, the power output of existing TENG WECs must be increased several-fold to become viable. This study describes the conceptualization of a rotary TENG, and the subsequent efforts to increase its power output by stacking multiple stator and rotor pairs. In the latter part of this study, we introduce a novel means of incorporating a friction element into the design of the TENG by employing flexible printed circuit board (PCB) rotors. At rest, these flexible rotors will contact the stator, building static charges due to friction, at speed, these flexible rotors will be decoupled from the stator, reducing friction and allowing faster rotation. Initial results indicate that the power output of the flexible PCB rotor does not produce more power than a rigid, acrylic disk rotor, however the current output of the prototype is boosted, and the prototype is far more compact, allowing for a higher energy density than the rigid rotor prototype.

bench testing

Thermal Management of Wide-Bandgap Semiconductor Amplifiers Used for Plasma Heating and Control

Princeton Fusion Systems (PFS) has designed, built, and tested a Load Switch printed circuit board (PCB) to demonstrate the capabilities of 2 kV silicon carbide (SiC) cascodes in development by Qorvo towards plasma heating and control applications. Initial tests have been conducted at low power (~100 W) for validation with thermal finite element analysis (FEA) modeling performed by the National Renewable Energy Laboratory (NREL). Comparisons of experimental data with the thermal modeling results, along with considerations for operating in plasma systems, will be discussed.

CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SU