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At least 19 records

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Sood, Bhanu↗

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗

An Overview of Printed Circuit Board Risks and Supplier Capability

This NESC Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗

An Overview of Printed Circuit Board Risks and Supplier Capability (Reuse Document ID 20205007963)

This HDPUG Webinar provides the audience a snapshot of quality variations in printed circuit boards, as assessed, using experiences in processing and risk analysis of PCB structural integrity coupons. The presentation will focus on PCB quality metrics, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across suppliers, the associated root cause(s) behind these non-conformance, suggestions of mitigation plans and most importantly – the relation of these non-conformances to end item reliability. The statistical trends will then be matched with the current state of the domestic PCB supplier base, its key challenges and opportunities. The presentation further discusses the methods applied at GSFC for evaluating candidate PCB technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

printed cricuit boards, supplier capability, risk ↗

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC (Professional Development Course) starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs (Printed Circuit Boards), PCBAs (Printed Circuit Board Assembly) and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA (Failure Modes and Effects Analysis), fishbone (Cause-And-Effect Diagram), FTA (Fault Tree Analysis)), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Attendees will Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM (Confocal Scanning Electron Microscopy) etc.) -Destructive analysis (DPA (Destructive Physical Analysis), Decap (Decapsulation), FIB (Focused Ion Beam) etc.) -Materials characterization (XRF (X-Ray Fluorescence) , EDS (Error Detection Sequential), TMA/DSC (Thermal Mechanical Analysis/Differential Scanning Calorimetry) etc.)

PCB quality↗

Printed Circuit Board Quality Assurance

PCB Assurance Summary: PCB assurance actives are informed by risk in context of the Project. Lessons are being applied across Projects for continuous improvements. Newer component technologies, smaller/high pitch devices: tighter and more demanding PCB designs: Identifying new research areas. New materials, designs, structures and test methods.

Reliability↗

Printed Wiring Board Technology Infusion and Supplier Capability Overview

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at QLF 2018 provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

PCB fabrication↗

A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed Circuit Boards↗

Field Harmonic Measurement of High-Gradient Permanent Magnet Quadrupoles for NSLS- II Upgrade

The National Synchrotron Light Source II (NSLS-II) is preparing for a major upgrade based on a new lattice concept, known as “Complex Bend,” to replace its existing double bend achromat (DBA) lattice. Here, this novel lattice will use high-gradient permanent magnet quadrupoles (PMQs) with small apertures in the range of 16–22 mm. A prototype complex bend branch with PMQs has been installed in the NSLS-II linac to evaluate the lattice's performance. An accurate and precise magnetic measurement system is required for field harmonic characterization and magnetic tuning of these PMQs. As part of this project a Rotating-Coil bench, based on a Printed Circuit Board (PCB) coil with a 12 mm diameter, has been configured to measure nine PMQs with bore diameter of 12.7 mm. This PCB coil has an active length of 270 mm, and is able to measure fields up to the 15th harmonic of the main field at a reference radius of 5 mm, while maintaining field quality levels within 10 ppm of the main field. This article presents the PCB coil setup, the harmonic measurement results and their temperature dependencies and repeatability. Simulation results on compensation of undesired multipoles using “IDBuilder”, a genetic algorithm-based optimizer code for magnetic tuning is included for field harmonic corrections.

36 MATERIALS SCIENCE↗

A New PCB Rotating Coil at NSLS-II

Several R&D projects are underway at NSLS-II towards an upgrade of its storage ring with a new lattice that will use high field magnets with small bores of 16-22 mm. A large fraction of the high field magnets are expected to be of permanent magnet technology that will require precise magnetic measurements and field harmonics corrections. A new magnetic measurement bench has been built based on a printed circuit board (PCB) coil of 12 mm diameter and 270 mm active length. This PCB coil has the capabil-ity of measuring field quality to a level of 10 ppm of the main field up to the 15th harmonic with a sensitivity between 0.01 m2 and 0.02 m2 at the reference radius of 5 mm. This paper will describe the main features of the rotating coil bench and discuss the measurement results of a permanent-magnet Halbach quadrupole of 12.7 mm bore diameter.

43 PARTICLE ACCELERATORS↗

Characterization of ambient polychlorinated biphenyl background conditions in surface waters of the Pajarito Plateau, New Mexico

Abstract This study presents the development of polychlorinated biphenyl (PCB) background threshold values (BTVs) that statistically characterize ambient background conditions for surface waters in undeveloped and developed landscapes of the Pajarito Plateau in the Rio Grande Basin of New Mexico. Between 2009 and 2018, surface water data were collected at 45 locations under a variety of flow conditions and regimes. A total of 163 samples were collected, with roughly 1/3 of samples and locations being in undeveloped areas (n = 53 from 17 locations), and the remainder being in developed areas (n = 110 from 28 locations). While there are areas on the Pajarito Plateau where PCB point sources are known or likely to have contributed to PCBs in soils, PCB BTVs calculated for undeveloped portions of watersheds (upstream of areas where PCB point sources are known or likely to have contributed to PCBs in soils, and therefore not affected by PCB sources within the watershed) are well above New Mexico's human health organism-only (HH-OO) water quality criterion (0.64 ng/L). Background threshold values are even higher in developed areas upstream of managed soil sites, suggesting that in developed areas, both diffuse ambient PCB sources (e.g., atmospheric deposition) and localized urban sources (e.g., building materials, paints, and electrical equipment) contribute to PCBs in those watersheds. These findings indicate that New Mexico's current HH-OO water quality criterion for PCBs cannot practicably be met due to ambient conditions. It is also impracticable to meet the US Environmental Protection Agency (EPA) criterion continuous concentration (CCC) of 14 ng/L in developed background areas, where the BTV is approximately 1.5 times the CCC. Integr Environ Assess Manag 2023;19:1307–1319. © 2022 SETAC

54 ENVIRONMENTAL SCIENCES↗

Application of Flex-QA Arrays in HTS Magnet Testing

Flexible PCB quench antennas have been very useful in providing high-quality high-resolution data in low temperature superconducting magnet tests. Similar multi-sensor arrays have been employed recently to cover a high temperature superconductor magnet tested at FNAL. In the present work, data taking conditions and magnet features to support the analysis framework are discussed. Then observations made during complete magnet powering cycles are described and analysis of quench antenna data are presented. Based on results, improvements to instrumentation and data taking are debated. Views on the future of flexible quench antenna sensors for HTS magnet diagnostics and operational support are shared.

43 PARTICLE ACCELERATORS↗

Application of Flex-QA Arrays in HTS Magnet Testing

Flexible PCB quench antennas have been very useful in providing high-quality high-resolution data in low temperature superconducting magnet tests. Similar multi-sensor arrays have been employed recently to cover a high temperature superconductor magnet tested at FNAL. In the present work, data taking conditions and magnet features to support the analysis framework are discussed. Then observations made during complete magnet powering cycles are described and analysis of quench antenna data are presented. Based on results, improvements to instrumentation and data taking are debated. Views on the future of flexible quench antenna sensors for HTS magnet diagnostics and operational support are shared.

Stoynev, S.↗

Remedial effectiveness of a pond biomanipulation: Habitat value and concentrations of polychlorinated biphenyls in fish

The fish and plant communities in a pond contaminated with polychlorinated biphenyls (PCBs) in East Tennessee, USA, were manipulated to reduce ecological and human-health risk associated with exposure to the chemical contaminants. We evaluated the success of the remedial action using a habitat valuation approach, as well as measuring PCB concentrations in fish. Risk reduction objectives included: alter the fish community to favor fish that do not resuspend, bioaccumulate, or biomagnify PCBs; stabilize contaminated sediments to improve water quality; and stabilize shoreline soils and enhance riparian habitat. Fish targeted for removal included gizzard shad, largemouth bass, and nonnative carp. Reduced PCB concentrations in fish have characterized the new bluegill-dominated community, although a weir-overtopping event led to the need for additional removals of gizzard shad and largemouth bass. Sunfish abundance is high, as was intended. Moreover, amphibian and waterbird diversities have increased in the years following biomanipulation, possibly owing to improvements in the riparian zone and increased structural (vegetation) complexity in both the aquatic and terrestrial environment. Thus, the remedial action has improved aspects of habitat value, and PCB concentrations in sunfish have dropped below the remediation level (risk-based target value) for this pond (1 µg/g in fish fillets or 2.3 µg/g in whole body fish).

63 RADIATION, THERMAL, AND OTHER ENVIRON. POLLUTAN↗

Operational and Performance Monitoring of East Tennessee Technology Park Ponds—2023 Results

Performance and operational monitoring are regulatory requirements associated with a non–time-critical removal action for three surface water bodies at the East Tennessee Technology Park (ETTP) in Oak Ridge, Tennessee: the K-1007-P1 Pond, the K-901-A Pond, and the K-720 Slough. This progress report summarizes the monitoring activities and results from fiscal year (FY) 2023. The goal of ecological enhancement of the K-1007-P1 and K-901-A Ponds is to reduce risk from polychlorinated biphenyl (PCB) contamination in fish to humans and wildlife. Lowering PCB concentrations in the water column and in the food that fish eat is expected to decrease PCB bioaccumulation in fish. Performance monitoring of the K-1007-P1 Pond focuses on annual PCB trends in water, clams, and fish. PCBs in fish also are sampled annually at the K-720 Slough. Operational monitoring ensures that ecological enhancement measures—including water quality, plant community, fish community, and wildlife actions—have been implemented as intended. Monitoring provides the information necessary to determine whether modifications are needed to attain the design end state (i.e., a heavily vegetated, clearwater pond dominated by sunfish with significantly diminished or at least downwardly trending PCB levels in fish). In FY 2023, fish removal efforts and vegetation planting primarily focused on the K-901-A Pond. These actions were implemented to help push the systems toward the desired end state. Descriptions of the various monitoring activities and preliminary 2023 results are provided in the following sections. An update on fish and plant management actions in FY 2023 is also included in this report. A summary of the more detailed information in this report will be presented as required in the upcoming Remediation Effectiveness Report.

54 ENVIRONMENTAL SCIENCES↗

Operational and Performance Monitoring of East Tennessee Technology Park Ponds—2025 Results

Performance and operational monitoring are regulatory requirements associated with a non–time-critical removal action for three surface water bodies at the East Tennessee Technology Park (ETTP) in Oak Ridge, Tennessee (Figure 1): the K-1007-P1 Pond, the K-901-A Pond, and the K-720 Slough. This progress report summarizes the monitoring activities and results from FY 2025. The goal of ecological enhancement of the K-1007-P1 and K-901-A Ponds is to reduce risk from polychlorinated biphenyl (PCB) contamination in fish to humans and wildlife. Lowering PCB concentrations in the water column and in the food that fish eat is expected to decrease PCB bioaccumulation in fish. Performance monitoring of the K-1007-P1 Pond focuses on annual PCB trends in water, clams, and fish. PCBs in fish also are sampled annually at the K-720 Slough. Operational monitoring ensures that ecological enhancement measures—including water quality, plant community, fish community, and wildlife actions—have been implemented as intended. Monitoring provides the information necessary to determine whether modifications are needed to attain the design end state (i.e., a heavily vegetated, clearwater pond dominated by sunfish with significantly diminished or at least downwardly trending PCB levels in fish). In FY 2025, fish removal efforts and vegetation planting primarily focused on the K-901-A Pond. These actions were implemented to help push the systems toward the desired end state. Descriptions of the various monitoring activities and preliminary 2025 results are provided in the following sections. An update on fish and plant management actions in FY 2025 is also included in this report. A summary of the more detailed information in this report will be presented as required in the upcoming Remediation Effectiveness Report.

54 ENVIRONMENTAL SCIENCES↗