Far ultraviolet response of silicon P-N JUNCTION photodiodes
Silicon P-N junction photodiode resistivity in vacuum ultraviolet
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Silicon P-N junction photodiode resistivity in vacuum ultraviolet
Solid state ionization p-n junction detectors
Optical absorption edge shift in reverse-biased p-n junction gallium arsenide semiconductor for light modulation
Current-voltage characteristics of tunneling p-n junctions in semiconductors
Epitaxial deposition of P-type silicon into etche grooves in N-type silicon for P-N junction for complimentary MOS-FET devices
Observation of nuclear pulse height increases in silicon p-n junction radiation detectors
Effect of mechanical strain on electrical characteristics of germanium and silicon p-n junction devices
Equivalence of stress and electron-irradiation induced defects in degenerate p-n germanium junctions as indicated in similar voltage-anneal characteristics
A small silicon p-n junction wafer, when coated with uranium 235, can be used as a compact fission probe for low power flux and power mapping. Because of the inverse relation between the magnitude of a neutron-induced fission pulse and the inherent capacitance of the detecting element (capacitance is proportional to area), the size, and hence the sensitivity, of the semiconductor detector has been limited. New developments in the field of semiconductor detectors have made it possible to fabricate large area detectors which are essentially free from the capacitance effect. However, preliminary results indicate that they are much more susceptible to radiation damage than the detectors described in this report and as such may not be suitable for flux mapping. increasing the sensitivity cannot be accomplished by simply fabricating a larger detector. It has been observed that by combining the silicon p-n junction wafers in a series configuration the capacitance effect can be bypassed, and a fission probe can be made with a resultant increase in sensitivity by a factor of ten while sustaining only a minor decrease in pulse height. Analysis further indicates that for n silicon wafers in series, if n(C(sub i)) + C(sub c)/C(sub b) less than 0.1 where C(sub i) and C(sub c) are the preamplifier input and cable capacitances, respectively, and C(sub b) is the junction capacitance of a single silicon wafer, there should be no substantial reduction in pulse height due to series circuitry.
Avalanche multiplication in reverse biased indium arsenide p-n junction photodiodes operated at 300 degrees K
Strain gauge accelerometer based on anisotropic stress effect in P-N junctions using piezoelectric crystals
Solar cell resistant to radiation damage - silicon p-n junction
Increase in leakage current of reversed-biased p-n junction due to surface channeling when exposed to radiation
Moving dislocation band and p-n junction planarity with zinc as diffusant in gallium arsenide
Determination of radiation damage in silicon by measuring photovoltaic response with shallow p-n junction as function of optical wavelength
Impurity concentration effect of electron irradiation damage in photovoltaic silicon cell with shallow p-n junction
Design and performance of an experimental silicon p-n junction cell which is resistant to radiation damage and intended for space application
Well shielded ceramic capillary spark source, thermocouple radiation detector and silicon p-n junction diode testing