Optoelectronic Component Testing Overview
Explore the source record for details and available documents.
SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Explore the source record for details and available documents.
Many space and some terrestrial applications would benefit from the availability of low-temperature electronics. Exploration missions to the outer planets, Earth-orbiting and deep-space probes, and communications satellites are examples of space applications which operate in low-temperature environments. Space probes deployed near Pluto must operate in temperatures as low as -229 C. Figure 1 depicts the average temperature of a space probe warmed by the sun for various locations throughout the solar system. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. The development of electrical power systems capable of extremely low-temperature operation represents a key element of some advanced space power systems. The Low-Temperature Power Electronics Program at NASA Lewis Research Center focuses on the design, fabrication, and characterization of low-temperature power systems and the development of supporting technologies for low-temperature operations such as dielectric and insulating materials, power components, optoelectronic components, and packaging and integration of devices, components, and systems.
Radiation effects in photonic and microelectronic components can impact the performance of high-speed digital optical data link in a variety of ways. This segment of the short course focuses on radiation effects in digital optical data links operating in the MHz to GHz regime. (Some of the information is applicable to frequencies above and below this regime) The three basic component level effects that should be considered are Total Ionizing Dose (TID), Displacement Damage Dose (DDD) and Single Event Effects (SEE). In some cases the system performance degradation can be quantified from component level tests, while in others a more holistic characterization approach must be taken. In Section 2.0 of this segment of the Short Course we will give a brief overview of the space radiation environment follow by a summary of the basic space radiation effects important for microelectronics and photonics listed above. The last part of this section will give an example of a typical mission radiation environment requirements. Section 3.0 gives an overview of intra-satellite digital optical data link systems. It contains a discussion of the digital optical data link and it's components. Also, we discuss some of the important system performance metrics that are impacted by radiation effects degradation of optical and optoelectronic component performance. Section 4.0 discusses radiation effects in optical and optoelectronic components. While each component effect will be discussed, the focus of this section is on degradation of passive optical components and SEE in photodiodes (other mechanisms are covered in segment II of this short course entitled "Photonic Devices with Complex and Multiple Failure Modes"). Section 5.0 will focus on optical data link system response to the space radiation environment. System level SEE ground testing will be discussed. Then we give a discussion of system level assessment of data link performance when operating in the space radiation environment.
The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.
The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components and optical systems along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.
The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.
Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.
Fiber optic links are being considered to transmit digital and analog signals in phased array antenna feed networks in space communications systems. The radiating elements in these arrays will be GaAs monolithic microwave integrated circuits (MMIC's) in numbers ranging from a few hundred to several thousand. If such optical interconnects are to be practical it appears essential that the associated components, including detectors, be monolithically integrated on the same chip as the microwave circuitry. The general issue of monolithic integration of microwave and optoelectronic components is addressed from the point of view of fabrication technology and compatibility. Particular attention is given to the fabrication technology of various types of GaAs optical detectors that are designed to operate at a wavelength of 830 nm.
Fiber optic links are being considered to transmit digital and analog signals in phased array antenna feed networks in space communications systems. The radiating elements in these arrays will be GaAs monolithic microwave integrated circuits (MMIC's) in numbers ranging from a few hundred to several thousand. If such optical interconnects are to be practical it appears essential that the associated components, including detectors, be monolithically integrated on the same chip as the microwave circuitry. The general issue of monolithic integration of microwave and optoelectronic components is addressed from the point of view of fabrication technology and compatibility. Particular attention is given to the fabrication technology of various types of GaAs optical detectors that are designed to operate at a wavelength of 830 nm.
For the past 25 years, the National Aeronautics and Space Administration (NASA) Goddard Space Flight Center’s Photonics Group in the Engineering Directorate has been substantially contributing to the flight design, development, production, testing and integration of many science and navigational instruments. The group has an extensive background in screening, qualifying, development and integration of commercial components for spaceflight applications. They have been willing to communicate lessons learned in packaging, part construction, materials selection, testing, and other facets of the design and production process critical to implementation for high-reliability systems. Summarized here is the last ten years of instrumentation development lessons learned and data collected from the subsystems down to the optoelectronic component level.
Sensors and computers control approach and coupling. Proposed optoelectronic system with no moving parts automatically controls approach of two spacecraft as they closed from distance of about 1 km to within few cm. System concept modified for use on Earth in robotic assembly, to control docking of large ships, or to guide placement of large structural components. Optoelectronic docking system automatically controls approach of active vehicle or mechanism to passive vehicle or object. Maneuvers of approaching vehicle controlled in response to optoelectronically sensed relative position of approached vehicle.
The Photonics group top level processes regarding development and qualification of space flight hardware for optoelectronic components and optical systems along with our contributions and successes with LIDAR systems, space flight reliability heritage, and our testing capabilities are conveyed with this power point presentation.
The present conference considers topics encompassing the fields of satellite communications technology, optical subsystems, transmitters and receivers, subsystems for pointing and tracking, onboard processing- and component-related technologies, fiber-optic distribution networks, and reliability-related considerations. Attention is given to lightwave technology in microwave systems, the status of CO2 laser technology and homodyne receiver concepts for communication satellite optical links, laser Doppler measurement techniques for spacecraft, fiber-optic gyros for space applications, integrated acoustooptic device modules for communication, signal processing and computing, radiation-hardened optoelectronic components, and radiation effects on fiber-optics.
Understanding the limits of spatio-temporal carrier dynamics, especially in III-V semiconductors, is key to designing ultrafast and ultra-small optoelectronic components. However, identifying such limits and the properties controlling them has been elusive. Here, using scanning ultrafast electron microscopy (SUEM), in bulk n-GaAs and p-InAs, we simultaneously measure picosecond carrier dynamics along with three related quantities: sub-surface band bending, above-surface vacuum potentials, and surface trap densities. We make two surprising observations. First, we uncover a negative-time contrast in secondary electrons resulting from an interplay among these quantities. Second, despite dopant concentrations and surface state densities differing by many orders of magnitude between the two materials, their carrier dynamics, measured by photo-excited band bending and filling of surface states, occur at a seemingly common timescale of about 100 ps. This observation may indicate fundamental kinetic limits tied to a multitude of material and surface properties of optoelectronic III-V semiconductors, and highlights the need for techniques that simultaneously measure electro-optical kinetic properties.
We demonstrate trapping of individual rubidium (Rb) and cesium (Cs) atoms in an interleaved array of bright tweezers and dark bottle-beam traps, using a microfabricated optical element illuminated by a single-laser beam and a 4f system with spatial filtering. Our approach exploits the opposite-sign dynamic polarizabilities of Rb and Cs, ensuring that each species is exclusively trapped in either bright or dark sites. The passive optical mask creates optimal trap depths for both species using three transmittance levels while minimizing the optical phase difference, implemented using a variable-thickness absorbing layer of amorphous germanium. This trapping architecture achieves atom loading rates close to 50% while reducing system complexity compared to conventional methods using active optoelectronic components and/or multiple-laser wavelengths.
Signals transmitted between units at different ground potentials. Analog amplifier electrically isolates input from output through use of optoelectronic components. Analog isolation amplifier uses dual-transistor optoisolator, preventing transmission of common-mode voltage from input to output. Circuit useful in spacecraft electronic systems.
Experimental flat-plate coupling transmits digital data signals and electrical power across small gap between two modules. Split transformer and optoelectronic components transmit electrical power and digital signals across small gap. Coupling concept useful substitute for electrical connectors in equipment assembled by robots, remote manipulators, or humans working in protective clothing or otherwise restricted in dexterity. Offers higher reliability due to one overall alignment mechanism as opposed to multiple pin/socket alignment requirements.
The present F-O rotation sensors (FORS) are all-solid state devices for measuring rotations and rotation rates in inertial space that may reach the 0.003 deg/hr (1-sigma) accuracies required for NASA's Saturn-orbiting Cassini mission. Attention is presently given to the mission, inertial reference unit, and FORS instrument optoelectronic component requirements envisioned for such spacecraft applications.