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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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DOE OSTI2023

PRINTED, PLANAR MICROWAVE CONNECTOR WITH MULTIPLE SIGNAL LINES

Microwave connectors with a planar geometry have been demonstrated using additive manufacturing techniques. This planar form factor is expected to enable connectors to be integrated directly with other components onto a printed circuit board. The connectors were developed with multiple signal lines that will increase the density of signal connections to PCBs, eliminating the physical constraints of single-signal COTS microwave connectors. This work developed electromagnetic models (using Ansys HFSS) of these planar connectors to predict performance and optimize connector design. Materials and printing processes were developed to fabricate the connectors based on high-temperature PEEK thermoplastics. The multiple signal connectors were designed to operate over the 1-6GHz band and are built upon the single signal printed planar geometry connector introduced in a previous paper [1].

Additive Manufacturing↗

DOE OSTI2025

Thermal Evaluation of CCS and NACS Reference Devices and Adapters

It is important for manufacturers of electric vehicle charging connectors, inlets, and adapters to understand the thermal performance of their devices. Various standards, such as SAE J1772, SAE J3400, IEC 62196, UL 2251, and UL 2252, list temperature limits that charging hardware needs to meet. However, there are currently very limited standardized reference devices against which to measure connector performance, and those that do currently exist generally serve charging currents less than 500A. This can make determining whether a charging connector meets the appropriate temperature limits difficult. Additionally, as automakers and charging station suppliers transition from the SAE J1772 CCS charging standard to SAE J3400 NACS, a number of CCS-to-NACS and NACS-to-CCS adapters are entering the market. These devices are being produced both by well-known automakers/equipment OEMs and lesser-known third-party suppliers, across a wide range of price points and construction qualities. Though SAE J3400/1 and UL 2252 lay out standards for adapter construction, performance and overtemperature response, there is no guarantee that any particular adapter will follow these standards and react to overtemperature events appropriately. This work addresses these issues by developing and evaluating a set of CCS and NACS reference inlet devices to validate the performance of charging connectors in the 500-800A range. The work also evaluates the performance of multiple NACS-to-CCS and CCS-to-NACS charging adapters with respect to UL 2252 temperature limits and SAE J3400/1 overtemperature signaling criteria.

33 ADVANCED PROPULSION SYSTEMS↗

DOE OSTI2021

Highly Integrated Wide Bandgap Power Module for Next Generation Plug-In Vehicles (Final Report)

Wide bandgap devices are key enablers for high power density traction inverters. A highly integrated wide bandgap (WBG) power module enables higher temperature operation, higher inverter efficiency and overall smaller die area with the same power delivery. However, it requires careful design of the power module to take advantage of all the superior material properties that silicon carbide (SiC) provides over conventional silicon (Si) Insulated Gate Bipolar Transistor (IGBT) based design. This project developed an efficient and densely packed SiC power module for an automotive traction inverter application. Extensive study was performed to select the best performing SiC die considering a wide range of temperature variation, suitability to integrate into target packaging, robust body diode performance and overall high electrical efficiency. Multiple design ideas were explored to achieve lower stray inductance for both power loop and signal loop, uniform current distribution, compact form factor, and very high thermal performance. The final power module package includes all six inverter switches in the same module (six-pack) with die sintered at both bottom and top surfaces utilizing high performance substrate to achieve high electrical and thermal performance. Two power module variants were developed using 900 V and 1200 V devices for operating at two different high voltage levels (> 600 V HV battery). Both power modules were comprehensively characterized, and high efficiency operation of the inverter was confirmed through analysis. Finally, a complete functional inverter was built with the 1200V power modules using other essential components (HV capacitors, gate driver board, controller board, current sensor, connectors etc.) and tested using GM’s standard test procedure. There are several challenges associated with adopting WBG devices for high voltage operation. In order to assess and mitigate those challenges, GM and subrecipients of this project have conducted multiple detailed studies. This includes phase current reconstruction using integrated Rogowski coil, device junction temperature estimation using on-state gate resistance, modeling and testing the effect of high voltage and fast switching on motor insulation and bearings, partial discharge inception voltage measurement under different environmental conditions. Findings of all these studies are summarized in this report.

33 ADVANCED PROPULSION SYSTEMS↗