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Toward Large Field-of-view X-ray Spectrometers with Magnetic Microcalorimeters

A future X-ray telescope mission like Lynx, a X-ray flagship mission concept, requires a large field of view, high energy resolution, and high spatial resolution. The Magnetic Microcalorimeter (MMC) detectors we are developing for such a mission feature a 5-arcminute field of view, approximately 100,000 pixels, each spanning 0.5–1 arcsecond. These detectors require the readout of 8,000 sensors. Three different array types have been designed to meet scientific goals, two of which utilize thermal multiplexing to reduce the number of readout channels in a scheme called “Hydra.” We are currently fabricating detectors on a recently completed buried wiring wafer with connections to every sensor. The sensors are read out using a microwave multiplexer (μMUX) with flux ramp modulation. A single μMUX can read out approximately 1,000 sensors with only two feed lines. We will report on the test of the first two-dimensional μMUX chip, consisting of 78 resonators. μMUX chips that pass screening will be directly bonded to MMC array chips using indium bump bonding. In parallel, we have tested a kinetic inductance traveling wave parametric amplifier (KI-TWPA) to amplify signals at low temperatures. The KI-TWPA exhibits extremely low internal noise, approaching the standard quantum limit. Since the energy resolution of an MMC is primarily limited by the readout system, the KI-TWPA is an ideal amplifier for MMCs with μMUX readout. We recently measured the readout noise of a μMUX with a KI-TWPA, demonstrating its capability for reading out MMC arrays. We present the design and fabrication of the latest MMC detectors, along with its readout performance.

Magntic Microcalorimeters

Optimization of X-ray Absorbers for High-Resolution TES Detectors in NewATHENA X-IFU

NewATHENA’s X-ray Integral Field Unit (X-IFU) uses a large-format array of Transition Edge Sensor (TES) microcalorimeters coupled with absorbers made of gold and bismuth providing 4 eV FWHM resolution up to 7 keV in the 0.2- 12 keV band. X-ray absorbers must be thick enough for photon absorption, maintain low heat capacity for energy resolution, and have good thermalization properties. The X-IFU requires total Quantum Efficiency (QE) of 96%, 87%, and 63% at 1, 7, and 9.5 keV, respectively. Optimal thicknesses are 1.05 µm gold and 5.5 µm bismuth to achieve 0.731 pJ/K at 90 mK and 87% QE at 7 keV. While typical TES absorbers are 3-4 µm thick, producing the required 5.5 µm Bi absorbers via standard electroplating creates enlarged grains and surface roughness. The increased roughness and grain size variability produced with our standard recipe have resulted in instances of 1) low energy spectral tails 2) spectral broadening of the energy resolution and 3) thermal shorts between pixels when a large grain bridges the gap between absorbers. In this study, we have introduced a new fabrication process and altered the morphology of the thick Bi through changes in the electroplating process. The process changes are intended to address all three issues as well as reduce particulate contamination observed on the finished detector arrays.

Absorber