Reliability Handbook for Silicon Monolithic Microcircuits. Volume 1 - Application of Monolithic Microcircuits
Reliability handbook for silicon monolithic microcircuits - applications
Weger, W. C.↗
SEARCH · Engineering Papers
Results for “MICROCIRCUIT”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Reliability handbook for silicon monolithic microcircuits. Volume 2 - Failure mechanisms of monolithic microcircuits
Reliability handbook for silicon monolithic microcircuits - failure mechanisms
Shurtleff, W. O.↗
Reliability Handbook for Silicon Monolithic Microcircuits. Volume 3 - Failure Analysis of Monolithic Microcircuits
Reliability handbook for failure analysis of silicon integrated microcircuits
Workman, W. L.↗
Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits
The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail.
Perkins, K. L.↗
Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages
The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure.
Perkins, K. L.↗
Holder for Tinning Microcircuit Leads
Heat-sinking tool holds microcircuits for lead tinning while protecting circuits from heat of tinning solder. Microcircuit holder dips leads in molten solder. Holder shields microcircuit from solder heat while leads immersed and absorbs heat conducted through leads. Thus keeps microcircuit relatively cool. Application tool was developed for requires tinning not closer than 0.02 in. (0.5 mm) from package body or its glass seals.
Gilbert, G. G.↗
PEM-INST-001: Instructions for Plastic Encapsulated Microcircuit (PEM) Selection, Screening, and Qualification
Potential users of plastic encapsulated microcircuits (PEMs) need to be reminded that unlike the military system of producing robust high-reliability microcircuits that are designed to perform acceptably in a variety of harsh environments, PEMs are primarily designed for use in benign environments where equipment is easily accessed for repair or replacement. The methods of analysis applied to military products to demonstrate high reliability cannot always be applied to PEMs. This makes it difficult for users to characterize PEMs for two reasons: 1. Due to the major differences in design and construction, the standard test practices used to ensure that military devices are robust and have high reliability often cannot be applied to PEMs that have a smaller operating temperature range and are typically more frail and susceptible to moisture absorption. In contrast, high-reliability military microcircuits usually utilize large, robust, high-temperature packages that are hermetically sealed. 2. Unlike the military high-reliability system, users of PEMs have little visibility into commercial manufacturers proprietary design, materials, die traceability, and production processes and procedures. There is no central authority that monitors PEM commercial product for quality, and there are no controls in place that can be imposed across all commercial manufacturers to provide confidence to high-reliability users that a common acceptable level of quality exists for all PEMs manufacturers. Consequently, there is no guaranteed control over the type of reliability that is built into commercial product, and there is no guarantee that different lots from the same manufacturer are equally acceptable. And regarding application, there is no guarantee that commercial products intended for use in benign environments will provide acceptable performance and reliability in harsh space environments. The qualification and screening processes contained in this document are intended to detect poor-quality lots and screen out early random failures from use in space flight hardware. However, since it cannot be guaranteed that quality was designed and built into PEMs that are appropriate for space applications, users cannot screen in quality that may not exist. It must be understood that due to the variety of materials, processes, and technologies used to design and produce PEMs, this test process may not accelerate and detect all failure mechanisms. While the tests herein will increase user confidence that PEMs with otherwise unknown reliability can be used in space environments, such testing may not guarantee the same level of reliability offered by military microcircuits. PEMs should only be used where due to performance needs there are no alternatives in the military high-reliability market, and projects are willing to accept higher risk.
Teverovsky, Alexander↗
An Approach to Reliability Testing of Microcircuits at Cryogenic Conditions
This viewgraph presentation reviews an approach to testing microcircuits at cryogenic temperatures. Standard testing procedures are not adequate to test microcircuits that are to operate at cryogenic temperatures. It is therefore necessary to perform analysis of operation conditions and reliability conditions for planning qualification testing of microcircuits at cryogenic temperatures. The major degradations for microcircuits operating at low temperatures depend on the number of switching cycles rather than on the duration of part operation. Therefore instead of accelerating degradation of the parts by increasing the level of stress, the possibility of which is very limited at cryogenic temperatures, the reliability testing can be based on the number of switching cycles.
Teverovsky, Alexander↗
Establishment of quality, reliability and design standards for low, medium, and high power microwave hybrid microcircuits
Quality, reliability, and design standards for microwave hybrid microcircuits were established. The MSFC Standard 85M03926 for hybrid microcircuits was reviewed and modifications were generated for use with microwave hybrid microcircuits. The results for reliability tests of microwave thin film capacitors, transistors, and microwave circuits are presented. Twenty-two microwave receivers were tested for 13,500 unit hours. The result of 111,121 module burn-in and operating hours for an integrated solid state transceiver module is reported.
Robinson, E. A.↗
Electromagnetic radiation screening of microcircuits for long life applications
The utility of X-rays as a stimulus for screening high reliability semiconductor microcircuits was studied. The theory of the interaction of X-rays with semiconductor materials and devices was considered. Experimental measurements of photovoltages, photocurrents, and effects on specified parameters were made on discrete devices and on microcircuits. The test specimens included discrete devices with certain types of identified flaws and symptoms of flaws, and microcircuits exhibiting deviant electrical behavior. With a necessarily limited sample of test specimens, no useful correlation could be found between the X-ray-induced electrical response and the known or suspected presence of flaws.
Brammer, W. G.↗
Microcircuit failure analysis using the SEM
The scanning electron microscope adds a new dimension to the knowledge that can be obtained from a failed microcircuit. When used with conventional techniques, SEM assists and clarifies the analysis, but it does not replace light microscopy. The most advantageous features for microcircuit analysis are long working distances and great depth of field. Manufacturer related failure modes of microcircuits are metallization defects, poor bonding, surface and particle contamination, and design and fabrication faults. User related failure modes are caused by abuse, such as overstress. The Physics of Failure Procedure followed by the Astrionics Laboratory in failure analysis is described, which is designed to obtain maximum information available from each step.
Nicolas, D. P.↗
Accelerated test techniques for micro-circuits: Evaluation of high temperature (473 k - 573 K) accelerated life test techniques as effective microcircuit screening methods
The application of high temperature accelerated test techniques was shown to be an effective method of microcircuit defect screening. Comprehensive microcircuit evaluations and a series of high temperature (473 K to 573 K) life tests demonstrated that a freak or early failure population of surface contaminated devices could be completely screened in thirty two hours of test at an ambient temperature of 523 K. Equivalent screening at 398 K, as prescribed by current Military and NASA specifications, would have required in excess of 1,500 hours of test. All testing was accomplished with a Texas Instruments' 54L10, low power triple-3 input NAND gate manufactured with a titanium- tungsten (Ti-W), Gold (Au) metallization system. A number of design and/or manufacturing anomalies were also noted with the Ti-W, Au metallization system. Further study of the exact nature and cause(s) of these anomalies is recommended prior to the use of microcircuits with Ti-W, Au metallization in long life/high reliability applications. Photomicrographs of tested circuits are included.
Johnson, G. M.↗
Evaluation testing of solid encapsulated microcircuits for space applications
Epoxy encapsulated microcircuits were subjected to various thermal, vibration, thermal cycling, and reduced barometric pressure stress tests to obtain electrical, environmental, and failure data. Analyses of the data were employed to derive information on environmental and operating design limits to determine the capability of encapsulated microcircuits to perform in space applications and environments. Seven different part types (four TTL, two CMOS, one linear) from five different manufacturers were subjected to single, multiple, and combinational environmental stress levels to determine: (1) what failure mechanisms are unique to encapsulated microcircuits; (2) how believable are suppliers claims of improved reliability, (3) what stress tests and screens can be used to identify potential early failure, and (4) what stress tests and screens should be avoided to prevent unwanted life degradation.
Robinson, D. D.↗
Scanning microscopy in microcircuit failure analysis
A three-phase microcircuit failure analysis procedure is presented. In the first phase, the device is nondestructively tested and the data obtained is correlated with the circumstances surrounding the failure event. The device is then subjected to a limited nondestructive analysis dominated by optical and scanning electron microscopy (SEM). Knowing that microcircuits usually fail from manufacturing defects or misuse, the analyst looks for one of the probable mechanisms. The SEM has two special operating modes that provide unique data for nondestructive analysis: voltage contrast and conductive current. These are used with other SEM modes and surface analysis techniques to analyze complicated microcircuits. The last phase includes the destructive procedures. The end product of these analyses is a corrective action that will yield a highly reliable system.
Nicolas, D. P.↗
Temporal learning in the cerebellum: The microcircuit model
The cerebellum is that part of the brain which coordinates motor reflex behavior. To perform effectively, it must learn to generate specific motor commands at the proper times. We propose a fundamental circuit, called the MicroCircuit, which is the minimal ensemble of neurons both necessary and sufficient to learn timing. We describe how learning takes place in the MicroCircuit, which then explains the global behavior of the cerebellum as coordinated MicroCircuit behavior.
Miles, Coe F.↗
Custom microcircuits
The goals of this program are to develop custom microcircuit technology, also known as Application Specific Integrated Circuit (ASIC) technology, for use in flight and ground programs. Supporting this effort are activities to investigate the effects of the space environment, and particularly ionizing radiation, on microcircuits and to develop a space qualification methodology. Another aspect of the program emphasizes innovative applications of custom microcircuit technology to image and signal processing and communications.
Source record↗
Decline in Radiation Hardened Microcircuit Infrastructure
Two areas of radiation hardened microcircuit infrastructure will be discussed: 1) The availability and performance of radiation hardened microcircuits, and, and 2) The access to radiation test facilities primarily for proton single event effects (SEE) testing. Other areas not discussed, but are a concern include: The challenge for maintaining radiation effects tool access for assurance purposes, and, the access to radiation test facilities primarily for heavy ion single event effects (SEE) testing. Status and implications will be discussed for each area.
performance of radiation hardened microcircuits↗
Specification guidelines for hybrid microcircuits
Guidelines establishing manufacturing and control procedures for hybrid microcircuits used in aerospace programs may have possible commercial and industrial applications. Guidelines encompass parts, materials, and process controls, as well as assembly, packaging methods, screening, and inspection procedures for procurement of custom packaged, high reliability microcircuits.
Caruso, S. V.↗