Reliability Modeling of MCMs - RELTECH Lessons Learned
The rapid development of advanced electronic packaging and interconnect technologiew, specifically MCMs, requires effective ways of evaluating the reliability of these packages...
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Test Strategies for NASAs 3-D Stack Multichip Module Space Flight Computer
Advanced packaging technologies such as 3D chip stacking, multichip modules (MCMs), and 3D stacks of MCMs provide opportunities for significant reductions in system mass, volume and power.
Test Strategies Space Flight Computer 3D chip stac↗
Mitigation Strategies for Space Radiation Health Risks
Astronauts embarking on missions beyond low Earth orbit (LEO) will be exposed to a radiation field that may increase the risks of developing cancer, cardiovascular diseases, central nervous system disorders, and immune decrements. Operational parameters will be the primary determinants of crew radiation exposure. NASA uses integrated design tools and risk models to optimize these parameters to minimize radiation exposure. NASA is also considering medical countermeasures (MCMs) to reduce radiation-associated health risks. MCMs for potential use in space-based applications can be developed from a variety of sources, including: a) population-based chemoprevention trials against targeted diseases b) drug development efforts focused on treating acute effects from accidental radiation exposures c) drug development to mitigate side effects of radiotherapy d) mechanistic studies of distinct damage caused by high charge (Z) and energy (HZE) radiation. Use of agents developed for other applications, or repurposed, is advantageous because long-term safety in humans is already established.
Huff, Janice L.↗
The Use of Metal Filled Via Holes for Improving Isolation in LTCC RF and Wireless Multichip Packages
LTCC MCMs (Low Temperature Cofired Ceramic MultiChip Module) for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package.
Ponchak, George E.↗
Advanced Interconnect Roadmap for Space Applications
This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.
Galbraith, Lissa↗
The NASA Spacecraft Transponding Modem
A new deep space transponder is being developed by the Jet Propulsion Laboratory for NASA. The Spacecraft Transponding Modem (STM) implements the standard transponder functions and the channel service functions that have previously resided in spacecraft Command/Data Subsystems. The STM uses custom ASICs, MMICs, and MCMs to reduce the active device parts count to 70, mass to I kg, and volume to 524 cc. The first STMs will be flown on missions launching in the 2003 time frame. The STM tracks an X-band uplink signal and provides both X-band and Ka-band downlinks, either coherent or non-coherent with the uplink. A NASA standard Command Detector Unit is integrated into the STM, along with a codeblock processor and a hardware command decoder. The decoded command codeblocks are output to the spacecraft command/data subsystem. Virtual Channel 0 (VC-0) (hardware) commands are processed and output as critical controller (CRC) commands. Downlink telemetry is received from the spacecraft data subsystem as telemetry frames. The STM provides the following downlink coding options: the standard CCSDS (7-1/2) convolutional coding, ReedSolomon coding with interleave depths one and five, (15-1/6) convolutional coding, and Turbo coding with rates 1/3 and 1/6. The downlink symbol rates can be linearly ramped to match the G/T curve of the receiving station, providing up to a 1 dB increase in data return. Data rates range from 5 bits per second (bps) to 24 Mbps, with three modulation modes provided: modulated subcarrier (3 different frequencies provided), biphase-L modulated direct on carrier, and Offset QPSK. Also, the capability to generate one of four non-harmonically related telemetry beacon tones is provided, to allow for a simple spacecraft status monitoring scheme for cruise phases of missions. Three ranging modes are provided: standard turn around ranging, regenerative pseudo-noise (PN) ranging, and Differential One-way Ranging (DOR) tones. The regenerative ranging provides the capability of increasing the ground received ranging SNR by up to 30 dB. Two different avionics interfaces to the command/data subsystem's data bus are provided: a MIL STD 1553B bus or an industry standard PCI interface. Digital interfaces provide the capability to control antenna selection (e.g., switching between high gain and low gain antennas) and antenna pointing (for future steered Ka-band antennas).
Berner, Jeff B.↗
High Density Packaging Technologies for RF Electronics in Small Spacecraft
This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.
Aquirre, Fernando↗
High Density Packaging Technologies for RF Electronics in Small Spacecraft
This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.
Schatzel, Donald↗
Reliable, Low-Cost Low-Weigh, Non-Hermetic Coatings for MCM Applications
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packaging MCMs cost↗
64Mb COTS DRAMs: A Variety of SEE Responses
Advanced commercial DRAMs are particularly attractive to designers for space applications needing large memory arrays due to resulting savings in mass, volume, and power.
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