Parallel gap welding Kovar ribbons to copper conductor printed wiring boards
Parallel gap welding Kovar ribbons to copper conductor printed wiring boards
Mc Daniel, G. E.↗
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Parallel-gap welding for joints between copper conductors and Kovar
Welding technique produces more reliable joints than soldering. Investigation used different sizes of copper conductors and component lead ribbons, corrosion protection platings, and melting points of metals being joined. Optimum combination is gold-plated component lead ribbons and solder-plated copper conductors.
Mc Daniel, G. E.↗
Borosilicate glass-to-Kovar tube bonding
Two-micron-diameter inlet leak, useful in mass spectrometry applications, minimizes gas sample distortion that occurs between sample and leak, is easily joined to spectrometer inlet system, and withstands unusual gas pressures and temperatures.
Harris, R. F.↗
Bonding Kovar pins to an alumina substrate
Assemblies for cryogenic applications are shockproof and vibrationproof.
Bennett, G. D.↗
Arcing in space structures in low Earth orbit
This report describes results of an experimental and theoretical program to investigate arcing of structures containing dielectric and conducting materials when they are biased negatively with respect to a plasma. An argon ion source generated Ar(+) ions of directed energy 20 to 40 eV and density approximately 10(exp 7) cm(exp -3) that impinged upon samples containing a dielectric material on top of a negatively biased Kovar plate. Arcing events were studied for bias voltages between -300 and -1000V with respect to the ion beam. The samples were Dow Corning 93-500 adhesive on Kovar, fused silica cover slips bonded on Kovar, and silicon solar cells mounted on Kovar. Measurements of discharge current, Kovar plate voltage, and radiation from the arc versus time were carried out. Microsecond duration exposure images and optical spectra in the 0.24 to 0.40 micron band were also acquired during arcing events. Arcing events were found to be associated with exposed adhesive and means were found to eliminate arcing altogether. The charging of a silica cover plate and the fields around the plate were calculated using a particle-in-cell code. Models were developed to explain the ignition of the arc and the physical processes occurring during the discharge.
Upschulte, B. L.↗
Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2
Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.
Perkins, K. L.↗
New Alloy for Glass-to-Metal Seals
Coefficient of thermal expansion approximates that of glass more closely. Alloy composed of about 60 percent iron, 40 percent nickel, and traces of six other elements. Developed as replacement for Kovar Fe/Ni/Co alloy in ferrule-and-tube assembly, new alloy has same strength, solderability, and compatibility with fuel as does Kovar. Used in glass-to-metal seals without excessive residual stresses. Potential for other applications in which low thermal expansion important; mechanical measuring devices and precise sliding parts that must function over wide temperature ranges.
Schmuck, A. J.↗
Characterization of Kova-Pyrex Anodically Bonded Samples: A New Packaging Approach for MEMS Devices
The ability to anodically bond Kovar to Pyrex 7740 significantly expands the packaging approaches available for MEMS devices. This technique greatly simplifies and reliably interconnects micropropulsion MEMS components (thrusters, valves) with the attached propellant system.
anodic bonding packaging Pyrex Kovar↗
Monthly progress report no. 6, apr. 10 - may 10, 1965
Leak testing and welding gold plated Kovar covers to precision flat packs
GOLD PLATE↗
Multichip packaging with thermal insulation
Thermal insulation technique permits low and high power electronic chips to operate in the same package without thermal cross-coupling. An alumina glass shield thermally isolates the low power chip from the high power chip while Kovar substrate acts as a heat sink to remove heat from the high power chip.
Mc Inturff, R. G.↗
Study program of NASA/GSFC weld quality monitor system
The Weld Quality Monitor has provided online control through the application of linear transducers. The electronic systems must be upgraded to increase confidence level required in production. The Weld Quality Monitor has been used with a recent model solid state power supply to evaluate ability to differentiate between sound and defective weld joints. The Weld Quality Monitor has been evaluated on Dumet and Kovar to interconnect materials Nickel and Alloy 180 in weld joints used on microelectronic module fabrication. Distinct separation was achieved between low strength welds and sound welds by the Quality Monitor. Evaluation performed indicates a drift level at less than 2 percent on a series of 50 consecutive welds. Operation under shop conditions identified need for controlled electrode impact. This was achieved with pneumatic actuation.
Hutchinson, W. R.↗
Energy pulse bonding
To eliminate many of the present termination problems a technique called energy pulse bonding (EPB) was developed. The process demonstrated the capability of: (1) joining conductors without prior removal of insulations, (2) joining conductors without danger of brittle intermetallics, (3) increased joint temperature capability, (4) simultaneous formation of several bonds, (5) capability of higher joint density, and (6) a production oriented process. The following metals were successfully bonded in the solid state: copper, beryllium copper, phosphor bronze, aluminum, brass, and Kovar.
Smith, G. C.↗
Application of diffusion bonding to electronic interconnection of flatpack leads
Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.
Korb, R. W.↗
Indium sealing techniques.
Gold films are used as an alloying flux to form 5-micron-thick indium film seals at temperatures below 300 C. Pyrex was sealed to quartz, ULE, CER-VIT, Irtran 2, Ge, GaAs, Invar, Kovar, Al, and Cu. The seals can also be used as current feedthroughs and graded seals.
Hochuli, U.↗
Thermoelastic analysis of solar cell arrays and their material properties
Announced report discusses experimental test program in which five different solar cell array designs were evaluated by subjecting them to 60 thermal cycles from minus 190 deg to 0.0 deg. Results indicate that solder-coated cells combined with Kovar n-interconnectors and p-interconnectors are more durable under thermal loading than other configurations.
Salama, M. A.↗
Properties criteria for components and materials used in lightweight solar arrays
The present work describes the characteristics and design criteria for components and materials used in lightweight substrate solar arrays. This includes descriptions of wraparound-electrode solar cells, cell covers, and cell interconnects. Cell cover systems briefly discussed are fused silica, cerium stabilized glass, microsheet, FEP (tape, heat laminated, and spray on), and ESB 7070 glass integral covers. The majority of solar arrays orbited have used either silver, Kovar, copper, or molybdenum as interconnect metals. Data are presented comparing the Young's modulus E, ultimate tensile strength, coefficient of expansion, thermal conductivity, and percent elongation of these and other interconnect candidate materials. Guidelines for the use of end tab wraparound cells are listed.
Lott, D. R.↗
Solar cell welded interconnection development program
Parallel gap welding and ultrasonic bonding techniques were developed for joining selected interconnect materials (silver, aluminum, copper, silver plated molybdenum and Kovar) to silver-titanium and aluminum contact cells. All process variables have been evaluated leading to establishment of optimum solar cell, interconnect, electrodes and equipment criteria for obtainment of consistent high quality welds. Applicability of nondestructive testing of solar cell welds has been studied. A pre-weld monitoring system is being built and will be utilized in the numerically controlled parallel gap weld station.
Katzeff, J. S.↗
Solar cell electrical connections
Study was conducted to find best methods of attaching pure silver and silver plated Kovar (trademark) interconnect ribbons to silicon solar cells with titanium-silver solderless contacts. Investigations include thermocompression bonding, parallel-gap welding, and ultrasonic welding.
Rauschenbach, H. S.↗