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The design requirements are established for all external or interproject interfaces to the Network Interface Processor located in Building 30 at the Lyndon B. Johnson Space Center, Houston, Texas. In addition to external interfaces, software/hardware and special interfaces are also described.
Interface states and bulk GaAs energy levels were simultaneously investigated in GaAs MOS structures prepared by anodic oxidation. These two types of energy levels were successfully distinguished by carrying out a comparative analysis of deep level transient capacitance spectra of the MOS structures and MS structures prepared on the same samples of epitaxially grown GaAs. The identification and study of the interface states and bulk levels was also performed by investigating the transient capacitance spectra as a function of the filling pulse magnitude. It was found that in the GaAs-anodic oxide interface there are states present with a discrete energy rather than with a continuous energy distribution. The value of the capture cross section of the interface states was found to be 10 to the 14th to 10 to the 15th/sq cm, which is more accurate than the extremely large values of 10 to the -8th to 10 to the -9th/sq cm reported on the basis of conductance measurements.
Tests were performed to evaluate the operating characteristics of the interface between the Space Lab Bus Interface Unit (SL/BIU) and the Orbiter Multiplexer-Demultiplexer (MDM) serial data input-output (SIO) module. This volume contains the test equipment preparation procedures and a detailed description of the Nova/Input Output Processor Simulator (IOPS) software used during the data transfer tests to determine word error rates (WER).
Control scheme is general and performs for multiplexed and dedicated channels as well as for data-bus interfaces. Control comprises two 64-pin, dual in-line packages, each of which holds custom large-scale integrated array built with silicon-on-sapphire complementary metal-oxide semiconductor technology.
For abstract, see N75-27050.
For abstract, see N75-27050.
For abstract, see N75-27050.
Thermal Interface Materials (TIMs) are critical components in spacecraft thermal management systems, where thermal performance is strongly influenced by vacuum conditions, interface contact resistance, and layered metallic joint behavior. However, manufacturer-reported thermal conductivity values are often derived under idealized conditions and may not accurately represent performance within operational aerospace applications. To address this limitation, the Testbed for Advanced Interface Materials in Vacuum (TAIMV) was developed as a modular vacuum-compatible thermal conductivity characterization platform capable of evaluating aerospace-relevant TIM configurations under both ambient and high-vacuum environments. The testbed was derived from the ASTM C1044-16 guarded hot plate methodology and incorporates interchangeable layers of stainless steel coupon geometries, independently controlled main and guard heaters, embedded resistance temperature detectors (RTDs), thermocouples, multi-layer insulation (MLI), and a temperature-controlled cold plate to characterize through-thickness thermal gradients across layered interfaces. In the current configuration, interface compression is limited to the nominal contact pressure generated by the experimental stack assembly. Initial experimental campaigns were conducted at ambient pressure and below 1×10-5 torr for vacuum cases using multiple interface materials including Braycote 601EF and Krytox-based greases across a range of thermal operating conditions. In parallel, a coupled numerical Python thermal model was developed to predict temperature distribution throughout the stack while accounting for conduction, radiation, and parasitic heat transfer pathways and effective interface resistance effects. Experimental measurements and numerical predictions showed consistent thermal trends across multiple operating conditions and environmental states. Results also revealed measurable differences between ambient and vacuum thermal behavior, demonstrating the importance of interface resistance, parasitic heat transfer mechanisms, and stack geometry in determining effective thermal performance within layered thermal interfaces. The presented work establishes a foundation for future thermal model correlation efforts and expanded characterization of aerospace thermal interface materials under representative environmental conditions. Future work will focus on the integration of a load cell system to enable controlled pressure-dependent characterization of thermal interface materials under compressive loading. This capability will allow investigation of the influence of contact pressure on effective thermal conductivity, interface resistance, and thermal performance within layered aerospace thermal interfaces under representative operational conditions.
The General Purpose Computer (GPC) 'subsystem' of the Orbiter Data Processing System was described. Two interface areas are discussed. One is the area of GPC intraconnections and intracommunications involving the hardware/software interface between the Central Processing Unit (CPU) and the Input/Output Processor (IOP). The other is the area of GPC interconnections and intercommunications and involves the hardware/software interface between the five Orbiter GPC's. Based on the detailed GPC interface given, it is felt that the basic CPU to IOP interface and the GPC to GPC interface have the potential for trouble free operation. However, due to the complexity of the interface and the criticality of GPC synchronization to overall avionics performance, the GPC to GPC interface should be carefully evaluated when attempting to resolve test anomalies that may involve GPC timing and synchronization errors.
At l AU there is a distinct boundary (the stream interface) at the leading edge of a stream in the solar wind, characterized by an abrupt drop in density, a similar increase in temperature and a small increase in speed. It is suggested that stream interfaces form in the interplanetary medium as a consequence of the non-linear evolution of streams generated by an increase in temperature in the solar envelope. This evolution eventually leads to the formation of a reverse shock behind the interface and a forward shock ahead of it. Two instances in which both a stream interface and a reverse shock had developed at l AU are presented. Examples of flare generated shocks which passed through a stream and were observed near a stream interface are also presented. It is shown that stream interfaces are definitely not the same structures as piston boundaries. It is noted that slow shocks, like stream interfaces, always occur ahead of streams and may develop in the interplanetary medium.
The antiplane shear problem of two bonded elastic half-planes containing a crack perpendicular to the interface is considered. The cases of a semiinfinite crack terminating at the interface, a finite crack away from and terminating at the interface, two cracks one on each side of the interface, and a finite crack crossing the interface are separately investigated. The nature of the stress singularity for the crack terminating at and going through the interface is studied, and it is shown that at the irregular point on the interface, for the former the power of singularity is not -1/2 and for the latter the stresses are bounded. For a material pair of aluminum-epoxy some numerical results giving the stress intensity factors, the density functions, and the crack opening displacements are presented.
Potential interface compatibility problems associated with interfacing OFT payload elements with orbiter communications and data handling elements that would result from payload or orbit failure to meet interface requirements contained in the orbiter/cargo standard interface specification are identified. The potential interface compatibility problems can be associated with either attached payloads in the payload bay or detached payloads communicating with the orbiter via an RF link. Evaluation of the attached payload orbiter interfaces was made by investigating interface problem areas experienced between the IUS and the orbiter since similar problems could be expected for other payloads.
At 1 AU there is a distinct boundary (the stream interface) in the interaction region of a stream in the solar wind, characterized by an abrupt drop in density, a similar increase in temperature, and a small increase in speed. In some cases, this is a tangential discontinuity, in others it is probably evolving into a tangential discontinuity. It is suggested that stream interfaces form in the interplanetary medium as a consequence of the nonlinear evolution of streams generated by an increase in temperature in the solar envelope. This evolution eventually leads to the formation of a reverse shock behind the interface and a forward shock ahead of it. Two instances in which both a stream interface and a reverse shock had developed at 1 AU are presented. Examples of flare-generated shocks that passed through a stream and were observed near a stream interface are also presented. It is shown that stream interfaces are definitely not the same structures that others have identified as piston boundaries.
Benfield, et al. (1972) showed that among fixed-interface, free-interface, and hybrid substructure coupling methods, the fixed-interface methods as the most accurate and the free-interface methods are the least accurate. In the present note, a substructure coupling method is proposed which employs free-interface substructure modes supplemented by 'reduced flexibility.' Substructure coupling based on the improved substructure model is discussed, and a numerical comparison with Hou's free-interface method is given. To simplify representation of the method proposed, the substructure equations are developed first for constrained substructures, and then the equations representing substructures with rigid-body modes are given. Finally, the equations for coupling of substructures are derived. Example calculations are included.
An analysis was made of the two-dimensional interface shape of a slab ingot being cast continuously by withdrawing it from a mold. The sides of the ingot are being cooled and the upper boundary of the ingot is in contact with a pool of molten metal. The solidification interface shape was determined from the analysis of the heat flow, utilizing the condition that the solidification interface is at constant temperature and must be normal to the lines of heat flow carrying away latent heat of fusion from the interface. The analysis includes the effect of interface curvature which, for a constant rate of withdrawing the cast ingot from the mold, causes the solidification to be nonuniform along the interface. The analysis was carried out by a conformal mapping procedure.
Methods for measuring and predicting interface bond stresses and interface bond strength are described. Geometric and material variables which influence interface stress and interface bond strength are identified. The dependence of composite fracture surface characteristics on bond strength is illustrated. Parameters for selecting constituents to yield specified interface bond strength are recommended.
Shuttle interfaces required for space tug accommodation are primarily involved with supporting and servicing the tug during launch countdown, flight, and postlanding; deploying and retrieving the tug on orbit; and maintaining control over the tug when it is in or near the orbiter. Each of these interface areas was investigated to determine the best physical and operational method of accomplishing the required functions, with an overriding goal of establishing simple and flexible orbiter interface requirements suitable for tug, tug payloads, IUS and other cargo. It is concluded the orbiter payload accommodations and the MSFC baseline tug are generally interface compatible. Specific minor changes to tug and orbiter interfaces were identified to provide full compatibility. A system concept for supporting and deploying tug from orbiter is described.
The mechanism of load transfer from matrix to fiber though the interface and, as a consequence, the effects of the interface on composite structural integrity are discussed. Specifically, the present work deals with the role of interfacial bonding in composite strength, the dependence of fracture surface on interface bond strength, and methods of measuring and predicting the stress at the interface, the microresidual stress, and load condition effects on the interface bond. The possibility of designing composites with specified bond properties is examined. Many of these effects are illustrated graphically to indicate general trends and to illustrate significant points. The discussion is based on theoretical considerations and is supplemented with pertinent experimental data.