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At least 19 records

Heat resistant substrates and battery separators made therefrom

A flexible substrate having a caustic resistant support and at least one membrane comprising a solid polymeric matrix containing a network of interconnected pores and interdispersed inorganic filler particles with a ratio of filler: polymer in the polymeric matrix of between about 1:1 to 5:1, is made by coating at least one side of the support with a filler:coating formulation mixture of inorganic filler particles and a caustic resistant, water insoluble polymer dissolved in an organic solvent, and removing the solvent from the mixture to provide a porous network within the polymeric matrix.

Langer, Alois↗

High-Temperature Insulating Gap Filler

New inorganic, ceramic filler for gaps between refractory ceramic tiles offers high resistance to heat and erosion. Consists of ceramic-fiber fabric precoated with silica and further coated with silica containing small amount of silicon carbide powder to increase thermal emittance. Developed as replacement for organic filler used on thermal-protection system of Space Shuttle. Promises to serve for many missions and to reduce cost and delay of refurbishing aerospace craft. Used as sealing material in furnaces or as heat shield for sensitive components in automobiles, aircraft, and home appliances.

Toombs, Gordon R.↗

Composite Solid Electrolyte Containing Li+- Conducting Fibers

Improved composite solid polymer electrolytes (CSPEs) are being developed for use in lithium-ion power cells. The matrix components of these composites, like those of some prior CSPEs, are high-molecular-weight dielectric polymers [generally based on polyethylene oxide (PEO)]. The filler components of these composites are continuous, highly-Li(+)-conductive, inorganic fibers. PEO-based polymers alone would be suitable for use as solid electrolytes, were it not for the fact that their room-temperature Li(+)-ion conductivities lie in the range between 10(exp -6) and 10(exp -8) S/cm, too low for practical applications. In a prior approach to formulating a CSPE, one utilizes nonconductive nanoscale inorganic filler particles to increase the interfacial stability of the conductive phase. The filler particles also trap some electrolyte impurities. The achievable increase in conductivity is limited by the nonconductive nature of the filler particles.

Appleby, A. John↗

Engineered Interfaces in Extruded Polyphenylsulfone-Boron Nitride Composite Insulation

Improving matrix-filler interactions is critical for optimizing dielectric performance in composite insulation; however, the technique used to introduce inorganic fillers into an organic matrix varies in its ability to satisfactorily reduce the size of cavities and interfaces. This study reports effects from changing the filler incorporation strategy on the rheology, dielectric performance and thermal conductivity of extruded polyphenylsulfone (PPSU) – hexagonal boron nitride (hBN) composite insulation. Depending on the technique used to introduce BN into the host matrix, the viscosity, torque, and melt viscosity temperature of the polymer were reduced, enabling better mixing, heat transfer, and smaller voids. This corresponded to an increase in dielectric strength compared to other formulations at either a similar or lower filler loading. On the other hand, the thermal conductivity in these specimens shifted further away from the thermal conductivity target of 1 W/m·K, which was an indication of a larger separation distance between the particles in samples with smaller interfaces. A trade-off between dielectric strength and thermal conductivity may exist when maximizing thermal conduction without sacrificing dielectric strength.

Polyphenylsulfone↗

Engineered Interfaces in Extruded Polyphenylsulfone- Boron Nitride Composite Insulation

Improving matrix-filler interactions is critical for optimizing dielectric performance in composite insulation; however, the technique used to an introduce inorganic filler into organic matrices varies in its ability to satisfactorily reduce the size of cavities and interfaces. This study reports how sample rheology influenced the dielectric performance and thermal conductivity of extruded polyphenylsulfone (PPSU) – hexagonal boron nitride (BN) composite insulation through changing the BN incorporation strategy. Depending on the technique used to introduce BN into the host matrix, the low melt viscosity, torque, and melt viscosity temperature of the polymer were reduced, enabling better mixing, heat transfer, and smaller voids. This corresponded to an increase in dielectric strength compared to other formulations; however, the thermal conductivity shifted further away from the thermal conductivity target of 1 W/m·K target, which was an indication of a larger separation distance between the particles in samples with smaller interfaces. A trade-off between dielectric strength and thermal conductivity may exist when maximizing thermal conduction without sacrificing dielectric strength.

polyphenylsulfone↗

XPS analysis of the effect of fillers on PTFE transfer film development in sliding contacts

The development of transfer films atop steel counterfaces in contact with unfilled and bronze-filled PTFE has been studied using X-ray photoelectron spectroscopy. The sliding apparatus was contained within the vacuum of the analytical system, so the effects of the native oxide, hydrocarbon, and adsorbed gaseous surface layers of the steel upon the PTFE transfer behavior could be studied in situ. For both the filled and the unfilled PTFE, cleaner surfaces promoted greater amounts of transfer. Metal fluorides, which formed at the transfer film/counterface interface, were found solely in cases where the native oxide had been removed to expose the metallic surface prior to sliding. These fluorides also were found at clean metal/PTFE interfaces formed in the absence of frictional contact. A fraction of these fluorides resulted from irradiation damage inherent in XPS analysis. PTFE transfer films were found to build up with repeated sliding passes, by a process in which strands of transfer filled in the remaining counterface area. Under these reported test conditions, the transfer process is not expected to continue atop previously deposited transfer films. The bronze-filled composite generated greater amounts of transfer than the unfilled PTFE. The results are discussed relative to the observed increase in wear resistance imparted to PTFE by a broad range of inorganic fillers.

Blanchet, T. A.↗

Functioning of inorganic/organic battery separators in silver-zinc cells

The results of three experimental studies related to the inorganic/organic battery separator operating mechanism are described: saponification of the plasticizer, resistivity of the simulated separators, and zincate diffusion through the separators. The inorganic/organic separator appears to be a particular example of a general class of ionic conducting films composed of inorganic fillers and/or substrates bonded together by an organic polymer containing an incompatible plasticizer that may be leached by the electrolyte. The I/O separator functions as a microporous film of varying tortuosity with essentially no specific chemical inhibition to zincate diffusion.

Philipp, W. H.↗

Evaluation of Inorganic/Organic Separators

Thirty-six (36) experimental 40AH sealed silver-zinc cells were constructed during phase I of this two (2) phase program. These cells were divided into six (6) groups of six (6) cells each. Each group of six (6) cells was evenly divided into two batches of three (3) cells each. Groups 1 through 4 each featured a different inorganic filler material in the slurry used to coat the separator substrate. Groups 5 and 6 featured an alternate method of separator bag construction. With the exception of the various separator materials, the parts and processes used to produce these thirty-six (36) cells were the same as those used to make the HR40-7 cell. The two (2) batches of cells in each cell group differed only in the lots of solutions and other separator slurry components used. Each cell was given two formation charge/discharge cycles prior to being shipped to NASA Lewis Research Center. Phase II of the program consisted of constructing another thirty-six (36) 40AH experimental cells in six (6) groups of six (6) cells each. Each group was distinguished by the type of precoated separator material used to fabricate separator bags. A new method of separator bag construction was used in this phase of the program. These cells were given two (2) formation cycles and shipped to NASA Lewis Research Center.

Donnel, C. P., III↗

Fire-resistant wood composites

Hot pressed wood panels made with modified novolak resins have burnthrough time of 450 s as compared to 280 s for products using conventional novolak resins. Incorporation of inorganic filler reduces flame spread index of panels from more than 200 to 60 or 70.

Sawko, P. M.↗

Structural wood panels with improved fire resistance

Structural wood paneling or other molded wood compositions consisting of finely divided wood chips, flour, or strands are bound together and hot pressed with a modified novolac resin which is the cured product of a prepolymer made from an aralkyl ether or halide with a phenol and a hardening agent such as hexamethylene tetramine. The fire resistance of these articles is further improved by incorporating in the binder certain inorganic fillers, especially a mixture of ammonium oxalate and ammonium phosphate.

Sawko, P. M.↗

Responses of Dielectrics to Space Radiation

Nature, extent, and possible prevention of radiation damage discussed. Report summarizes likely effects of high-energy radiation in outer space on variety of commercially-available dielectric materials used in spacecraft. Effects reported on basis of recent Galileo tests, unpublished tests involving proton or electron irradiation, and published information. In general, organic materials with carbon or inorganic fillers most resistant to radiation.

Bouquet, F. L.↗

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗

Initial Results of the MISSE-Flight Facility Polymers and Composites Experiment 1-4 (PCE 1-4)

Spacecraft in low Earth orbit (LEO) are subjected to harsh environmental conditions, including radiation (cosmic rays, ultraviolet (UV), x-ray and charged particle radiation), micrometeoroids and orbital debris, temperature extremes, thermal cycling, and atomic oxygen (AO). These environmental exposures can result in erosion, embrittlement and optical property degradation of susceptible materials threatening spacecraft performance and durability. To increase our understanding of effects such as AO erosion and radiation induced embrittlement of spacecraft materials, NASA Glenn Research Center has developed a series of experiments that are flown as part of the Materials International Space Station Experiment (MISSE) missions on the exterior of the International Space Station (ISS). These experiments have provided critical space environmental durability data such as AO erosion data of polymers and composites, and radiation induced mechanical property degradation of spacecraft insulation materials, after long term space exposure. In continuing these studies, four Glenn experiments with 365 flight samples have been flown on ISS’s external MISSE-Flight Facility (MISSE-FF). These experiments are the Polymers and Composites Experiment-1 (PCE-1) flown as part of the inaugural MISSE-9 mission, the PCE-2 flown as part of the MISSE-10 mission, the PCE-3 flown as part of the MISSE-12 and MISSE-15 missions, and the PCE-4 flown as part of the MISSE-13 mission. The primary objective of the PCE 1-4 experiments is to determine the AO and radiation durability of spacecraft polymers and composites. In addition, each experiment has a wide variety of spacecraft materials and hence they each have numerous additional sample objectives. Each of the PCE 1-4 is designed to examine the consequences of AO interactions including AO erosion yield (Ey) and optical and thermal property characterization. Several polymers were flown in both ram and zenith flight orientations to determine the effect of varying solar to AO ratios on Ey. Common spacecraft materials including Teflon FEP, white Tedlar and Upilex-S were included on multiple MISSE missions so erosion dependence on environment exposure can be determined. The PCE-1 includes epoxy composite samples with varying ZnO levels to determine the effect of inorganic filler level on AO durability. And, a variety of samples were flown to characterize AO scattering and AO undercutting processes. All four PCE experiments include samples to provide better insight into radiation durability of polymers and composites. The MISSE-9 PCE-1 includes Teflon FEP tensile samples flown in the wake and zenith direction so variations in radiation exposure from the different flight directions can provide insight into radiation induced embrittlement of Teflon FEP. Teflon FEP tensile samples were also flown in the wake direction as part of the MISSE-13 PCE-4. In addition, shape memory alloys, shape memory composites, melanin based composites, stressed and unstressed gossamer sun shield materials, coated and uncoated docking seal samples, and new solar cell cover slides were flown for space radiation durability and/or shielding assessment. This paper provides an overview of Glenn’s PCE 1-4 MISSE-FF experiments and provides initial post-flight observations and results.

atomic oxygen↗

Fire-and smoke-retardant polyesters and elastomers

Test results indicate that most effective fire-and smoke-retardant fillers are inorganic hydrates and carbonates that release water and/or carbon dioxide. Most effective filler tested was hydrated sodium silicate. Effectiveness is due to high water content and formation of viscous molten glass when heated. Glass tends to inhibit polymer combustion and to promote formation of char residue.

Chung, S. Y.↗

Inorganic-organic separators for alkaline batteries

A flexible separator is reported for use between the electrodes of Ni-Cd and Ni-Zn batteries using alkaline electrolytes. The separator was made by coating a porous substrate with a battery separator composition. The coating material included a rubber-based resin copolymer, a plasticizer and inorganic and organic fillers which comprised 55% by volume or less of the coating as finally dried. One or more of the filler materials, whether organic or inorganic, is preferably active with the alkaline electrolyte to produce pores in the separator coating. The plasticizer was an organic material which is hydrolyzed by the alkaline electrolyte to improve conductivity of the separator coating.

Sheibley, D. W.↗

Making Thermoplastics Flame-Resistant

Inorganic hydrate-salt filler coated with elastomer containing acidic groups imparts flame and smoke retardancy to thermoplastics while preventing degradation of impact resistance that results from high filler loadings in thermoplastic.

Mueller, W. A.↗

Factors influence flexibility resistivity and zinc dendrite penetration rate of inorganic separators for alkaline batteries

Developmental work resulted in a formulation which can improve the flexibility of the inorganic-organic-type separator for silver-zinc and nickel-zinc alkaline batteries. The effects of various fillers and reactive organic additives on separator volume resistivity are described. The effects of various inert fillers on the zinc dendrite penetration rate of the separator are shown. Conclusions regarding the operating mechanism of the separator are presented.

Sheibley, D. W.↗