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Evaluation of Anodized and Electroplated Radioactive Check Sources for Radiological Monitoring Instruments
Radioactive check sources are often used for source checking calibrated instruments to confirm accurate readings are obtained from radiological monitoring instruments. Because of the importance of check sources and their application, PNNL conducted a study to evaluate the effectiveness and accuracy of active sources produced using different construction methods. Eleven, randomly selected check sources of both anodized (five) and electroplated (six) construction were evaluated, along with their calculated decay curves, to determine how well they withstand consistent, multi-year use in the field. Results show that the anodized and electroplated check sources evaluated hold up well enough to continue their use, regardless of wear and tear sustained over years of use. This report provides the source information, empirical data for the 11 anodized and electroplated check sources and their representative decay curves, and it documents the conclusion that anodized and electroplated check sources are reliable for routine use in the field over multiple years.
Electroplated AU for conformal coating of high aspect ratio silicon structures
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Electroplated Au for conformal coating of high aspect ratio silicon structures
A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.
Devices for Thermal Conductivity Measurements of Electroplated Bi for X-ray TES Absorbers
Electroplated bismuth (Bi) is commonly used in transition-edge sensors (TESs) for X-rays because of its high stopping power and low heat capacity (Collan in Phys Rev B 1:2888, 1970, Yan in Appl Phys Lett 111:192602, 2017). Electroplated Bi is usually grown on top of another metal that acts as seed layer, typically gold (Au), making it challenging to extrapolate its thermoelectric properties. In this work, we present four-wire resistance measurement structures that allow us to measure resistance as a function of temperature of electroplated Bi independently of Au. The results show that the thermal conductivity of the Bi at 3 K is high enough to ensure the correct thermalization of X-ray photons when used as an absorber for TESs.
Copper-nickel electroplating of 3D-printed acrylonitrile butadiene styrene for interference and radiation shielding applications
Here, in this study, electromagnetic and radiation shielding structures were fabricated by 3D printing acrylonitrile butadiene styrene (ABS) structures via fused filament fabrication and electroplating with copper (Cu) and nickel (Ni) metals. Prior to electroplating, the printed ABS materials were made conductive by surface electrodeposition of polypyrrole (PPy). ABS adsorbs the pyrrole monomer, which subsequently polymerizes via oxidation forming conductive PPy layer on the printed structures. The successful anchoring of PPy layer can be attributed to its hydrogen bonding and electrostatic interactions with ABS. Thermal analysis, optical, and electron microscopy equipped with energy dispersive X-ray were employed to characterize the printed shielding structures, while the interference and radiation shielding effectiveness were evaluated using a spectrum analyzer and dosimeter, respectively. The interference shielding was found to be effective at 60 ± 5 dB over relatively small frequency range. Shielding was also apparent against gamma and X-ray ionizing rays, but more significantly effective against beta rays. Furthermore, the Cu/Ni coating was able to reduce any heat-induced dimensional changes for the 3D printed ABS substrate without compromising the mechanical integrity.
Brazing of Martensitic Stainless Steel to Copper Using Electroplated Copper and Silver Coatings
Brazing of 3 mm thick sheets of low-carbon martensitic stainless steel and Cu-Cr-Zr-Ti alloy was attempted using electroplated coatings of Cu and Ag. Ni coating of 5 µm thick was provided on the MSS base metal to enhance the wettability. Brazing experiments were carried out at 985 °C for a holding of 15 min. Detailed microstructural studies, hardness, lap-shear, tensile, and pressure tests were carried out on the brazed joints. The reaction between the Cu and Ag coatings lead to the formation of in situ braze metal. The microstructure of the braze metal was found to consist of Cu-rich primary alpha (α{sub P}) and Ag-rich eutectic mixture (β + α{sub E}). In lap-shear tests, the brazed joints produced with an overlap of 9 and 6 mm were found to fail in copper base metal, while the joints produced with an overlap of 3 mm failed in the braze metal exhibiting a lap-shear strength of 147 MPa. In tensile tests, the butt brazed joints were found to fail in copper base metal as well with an average tensile strength of 213 MPa. The braze metal hardness was found to be higher than the hardness of the copper base metal. In pressure tests, the brazed panels were found to survive a pressure of 750 bar without undergoing any damage. These results show that electroplated coatings of Cu and Ag can be advantageously utilized for brazing of large, complex-shaped parts such as thrust chambers in space industry.
In-situ synchrotron X-ray study on microstructure and stress evolutions of electroplated copper upon self-annealing
Background: The self-annealing behavior of electroplated copper (Cu) at room temperature is gaining attention in the microelectronics industry due to its significant impact on reliability issues such as substrate warpage and electrical resistivity. Methods: In this study, in-situ analysis of the microstructure transition and stress relaxation of the electroplated copper upon self-annealing was conducted via synchrotron white X-ray nanodiffraction (beamline 21A, Taiwan Photon Source) and grazing-incidence X-ray diffraction (beamline 17B1, Taiwan Light Source). Significant Findings: Remarkable relaxations of deviatoric stress and absolute strain component along the [002] direction were closely related to the Cu grain growth and crystallographic reorientation at the early stage of selfannealing, and a complete stress/strain relaxation can be achieved with the cessation of microstructure transition. In conclusion, the in-situ synchrotron X-ray studies provided an insight into Cu self-annealing mechanism, offering valuable information for improving Cu interconnect reliability.
Iodine Capture with Copper-Electroplated Nickel Foams
This work explores the use of Ni0 foam scaffolds for Cu0 coatings for use as sorbents for iodine. The Cu0 electroplating was performed from aqueous copper(II) sulfate (CuSO4) solutions under different conditions to achieve a range of Cu0-layer thicknesses (4.89 ± 1.05 μm–57.32 ± 3.95 μm) with 900 A·m–2 current densities and coating times of 15–180 min. The thickest coatings resulted in Cu0-plated Ni0 foams with >89 mass % Cu0 in the final product. Iodine capture experiments showed very high Cu0 utilizations of 91.9–97.3 mass % at iodine loadings of 839–1774 mg·g–1 through the formation of CuI (marshite; space group F-43m). No evidence was found of iodine reactions taking place with the Ni0 scaffold, so it remained in iodine-loaded Cu-electroplated Ni foams as structural support to provide mechanical rigidity to the foams during the iodine loading process. Hot pressing of these materials can be used to create a CuI/Ni ceramic-metal composite waste form for disposal as demonstrated with spark plasma sintering.
Thermal Conductivity of Electroplated Copper Onto Bulk Niobium at Cryogenic Temperatures
Superconducting radio-frequency (SRF) cavities made of high-purity bulk niobium are widely used in modern particle accelerators. The development of metallic outer coatings with high thermal conductivity would have a beneficial impact in terms of improved thermal stability, reduced material cost and for the development of conduction-cooled, cryogen-free SRF cavities. Several high-purity, fine-grain Nb samples have been coated with 2-4 mm thick copper by electroplating. Measurements of the thermal conductivity of the bimetallic Nb/Cu samples in the range 2 ? 7 K showed values of the order of 1 kW/(m K) at 4.3 K. Very good adhesion between copper and niobium was achieved by depositing a thin Cu layer by cold spray on the niobium, prior to electroplating the bulk Cu layer.
Thermal Conductivity of Electroplated Copper Onto Bulk Niobium at Cryogenic Temperatures
Superconducting radio-frequency (SRF) cavities made of high-purity bulk niobium are widely used in modern particle accelerators. The development of metallic outer coatings with high thermal conductivity would have a beneficial impact in terms of improved thermal stability, reduced material cost and for the development of conduction-cooled, cryogen-free SRF cavities. Several high-purity, fine-grain Nb samples have been coated with 2-4 mm thick copper by electroplating. Measurements of the thermal conductivity of the bimetallic Nb/Cu samples in the range 2 ? 7 K showed values of the order of 1 kW/(m K) at 4.3 K. Very good adhesion between copper and niobium was achieved by depositing a thin Cu layer by cold spray on the niobium, prior to electroplating the bulk Cu layer.
Low-temperature electroplating of zirconium: Ionic mixture methods
Non-aqueous ionic mixture electroplating allows for room-temperature or near-room-temperature applications of thin metal films, typically metals for which aqueous solvents cannot be used. While there are many methods of plating zirconium, each has disadvantages that ionic liquid plating could correct. However, ionic liquid plating requires further research and development, as a new class of solvents were only developed a few years ago. Current ionic liquids cost several thousand dollars per liter, yet produce films with less than 90% surface coverage as well as deposition of salt species that enable interdiffusion through the Zr. Film coverage needs to be increased while maintaining approximate room temperatures and lower solvent costs. Current ionic liquid technology has suffered from poor surface wetting and limited Zr diffusivity leading to dendrite formation which inhibits total surface coverage. Zr electroplating can be improved by application of room-temperature ionic mixtures as the plating medium. We have successfully demonstrated the capability to plate high-quality metallic zirconium layers using deep eutectic solvents (DES) and DES-ionic liquid (IL) mixtures. Plating thicknesses of up to 6 microns have been achieved, and the coatings are conformal to the substrate and not dendritic, with low contamination from the plating solution. Our current method uses the DES ethaline (a 1:2 ratio of choline chloride and ethylene glycol) to complex zirconium (IV) ions (present via the addition of ZrF4). We pulse plate the Zr from a bath with an overabundance of LiF, in accordance with prior literature. We have also had success in mixing the DES with ILs, such as Triethylsulfonium bis(trifluoromethylsulfonyl)imide, 1-Butyl-3-methylpyridinium bis(trifluormethylsulfonyl)imide, Methyl-trioctylammonium bis(trifluoromethylsulfonyl)imide, and Diethylmethyl(2-methoxyethyl)ammonium bis(trifluoromethylsulfonyl)imide.
Non-permeable substrate carrier for electroplating
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
An Investigation of the Effect of Sintering Conditions on the Mechanical Behavior of Electroplated Nickel Foams
This study investigates the effect of sintering temperature on the compression strength of nickel foams in an inert atmosphere. The nickel foams were produced by the electrodeposition technique on polyurethane foam substrate. As-plated Ni foams were sintered at 873 K, 1073 K, and 1273 K (600 °C, 800 °C, and 1000 °C) in order to eliminate polyurethane and to enhance ductility at a controlled atmosphere. A compression test was used to determine the mechanical behavior. The morphology of produced foams was analyzed by scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and X-ray diffraction (XRD) techniques. Quantitative EDS analysis implied that carbon diffuses into nickel structure during the polyurethane decomposition. The amount of carbon in nickel foam increases with heat treatment temperature. The results also reveal that the oxygen impurity arisen from polymer vapors can diffuse into the nickel structure at elevated sintering temperature [i.e., 1273 K (1000 °C)]. The compression curve of as-plated foam showed brittle behavior due to the electroplating condition. The sintering process in the neutral atmosphere could create ductile foams, although the strength of the foams decreases with an increase in the sintering temperature.
Structural and Mechanical Properties of the ZrC/Ni-Nanodiamond Coating Synthesized by the PVD and Electroplating Processes for the Cutting Knifes
In this work, combined gradient ZrC/Ni-nanodiamond ultradispersed diamonds (UDD) coatings were synthesized on the surface of knife blades made of hard alloy WC-2 wt.% Co by electroplating and cathode arc evaporation PVD techniques to increase the durability period of a wood-cutting milling tool. The microstructure, phase and elemental composition, microhardness, and adhesion strength of the coatings were investigated. Ni-UDD layer is not mixed with the ZrC coating and hard alloy substrate. Cobalt is present in Ni-UDD layer after deposition of ZrC. The ZrC/Ni-nanodiamond coating consists of separate phases of zirconium carbide (ZrC), α-Ni, and Ni-UDD. The maximum value of microhardness of the Ni-nanodiamond coating is 5.9 GPa. The microhardness value of the ZrC/Ni-nanodiamond coatings is 25 ± 6 GPa, which corresponds to the microhardness of the hard alloy substrate and ZrC coating. The obtained high values of the critical loads on the scratch track of the ZrC/Ni-nanodiamond coating in 24 N prove a sufficiently high value of the adhesion strength of the bottom Ni-UDD layer with WC-Co substrate. Pilot testing of ZrC/Ni-nanodiamond-coated cutting tools proved their increasing durability period to be 1.5-1.6 times higher than that of bare tools, when milling laminated chipboard.
High capacity 3D structured tin-based electroplated Li-ion battery anodes
3D structured porous electrodes have been considered as a possible solution for accommodating the volume change of alloying lithium ion battery anode materials during cycling. However, lab-scale porous electrodes tend to be thin, and the loading of the activity materials is also small, the combination of which results in electrodes with impractically low areal and volumetric capacities. In this work, we develop a high areal and volumetric capacity 3D-structured Sn/C anode by using a two steps electroplating process. An electrode with a 20% v/v Sn loading exhibits a high volumetric/areal capacity of similar to 879 mA h/cm 3 /6.59 mA h/cm 2 after 100 cycles at 0.5 C and a good rate performance of about 750 mA h/cm 3 and 5.5 mA h/cm 2 (delithiation) at 10 C in a half-cell configuration. The 3D Sn/C anode also shows good compatibility with a commercial LCO cathode in a full cell configuration.
Electroplating Titanium from Ionic Mixtures
Titanium & Zirconium metal films have been electroplated by a near-ambient scalable process for high value-add/lower volume applications. The films have been commercially tested as bonding layers
Titanium Electroplating from Deep Eutectic Solvent Ethaline: Progress Report
This fiscal year we investigated the kinetic mechanism of electroplating of titanium on stainless steel substrates, as well as the influence of additives on the brightness and smoothness of this plating, as related to the FY24 LD-TCF proposal.