Metallurgical aspects in failed electrical and electronic devices
Electrical and electronic semiconductor device failures from metallurgical viewpoint
Babecki, A. J.↗
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Results for “Electronic devices”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Wide temperature range electronic device with lead attachment
A electronic device including lead attachment structure which permits operation of the devices over a wide temperature range is reported. The device comprises a core conductor having a thin coating of metal thereon whereby only a limited amount of coating material is available to form an alloy which bonds the core conductor to the device electrode, the electrode composition thus being affected only in the region adjacent to the lead.
Farrell, R.↗
Simulation of Ultra-Small Electronic Devices: The Classical-Quantum Transition Region
Concern is increasing about how quantum effects will impact electronic device operation as down-scaling continues along the SIA Roadmap through 2010. This document describes part of a new semiconductor device modeling (SDM) program at NAS to investigate these concerns by utilizing advanced NAS and third-party numerical computation software to rapidly implement and investigate electronic device models including quantum effects. This SDM project will investigate quantum effects in devices in the classical-quantum transition region, especially sub-0.1 mm MOSFETs. Specific tasks planned for this project include the use of quantum corrections to the classical drift-diffusion and hydrodynamic models of electron transport, arid the use of nominally quantum models including significant scattering.
Biegel, Bryan A.↗
Development of medical electronic devices in the APL space department
Several electronic devices for automatically correcting specific defects in a body's physiologic regulation and allowing approximately normal functioning are described. A self-injurious behavior inhibiting system (SIBIS) is fastened to the arm of a person with chronic self-injurious behavior patterns. An electric shock is delivered into the arm whenever the device senses above-threshold acceleration of the head such as occur with head-bangers. Sounding a buzzer tone with the shock eventually allows transference of the aversive stimulus to the buzzer so shocks are no longer necessary. A programmable implantable medication system features a solenoid pump placed beneath the skin and refueled by hypodermic needle. The pump functions are programmable and can deliver insulin, chemotherapy mixes and/or pain killers according to a preset schedule or on patient demand. Finally, an automatic implantible defibrillator has four electrodes attached directly to the heart for sensing electrical impulses or emitting them in response to cardiac fibrillation.
Newman, A. L.↗
More Abstracts on Effects of Radiation on Electronic Devices
Second volume of bibliography summarizes literature on radiation effects on new electronic devices. Includes those of protons, electrons, neutrons, gamma rays, and cosmic rays at energies up to about 20 GeV. Volume contains 219 abstracts from unclassified sources. Organized into four sections: dose-rate effects, new technology, post-irradiaton effects, and test environments.
Bouquet, Frank L.↗
Multiphonon relaxation in laser materials and applications to the design of quantum electronic devices.
Multiphonon orbit lattice relaxation of excited states of rare earth ions in crystals, using results to design quantum electronic devices
Moos, H. W.↗
Fullerene Derived Molecular Electronic Devices
The carbon Nanotube junctions have recently emerged as excellent candidates for use as the building blocks in the formation of nanoscale electronic devices. While the simple joint of two dissimilar tubes can be generated by the introduction of a pair of heptagon-pentagon defects in an otherwise perfect hexagonal grapheme sheet, more complex joints require other mechanisms. In this work we explore structural and electronic properties of complex 3-point junctions of carbon nanotubes using a generalized tight-binding molecular-dynamics scheme.
Menon, Madhu↗
Testing Electronic Devices for Single-Event Upset
Report prepared describes equipment and summarizes both pretest and onsite procedures for testing of digital electronic devices for susceptibility to single-event upset. Term "single-event upset" denotes variety of temporary or permanent bit flips or latchup induced by single particles of ionizing radiation. Vacuum chamber houses device under test while exposed to ion beam. Vacuum chamber and associated equipment must be brought to ion-beam facility for test.
Nichols, D. K.↗
X-Ray-Diffraction Tests Of Irradiated Electronic Devices: II
Report describes research on use of x-ray diffraction to measure stresses in metal conductors of complementary metal oxide/semiconductor (CMOS) integrated circuits exposed to ionizing radiation. Expanding upon report summarized in "X-Ray-Diffraction Tests Of Irradiated Electronic Devices: I" (NPO-18803), presenting data further suggesting relationship between electrical performances of circuits and stresses and strains in metal conductors.
Shaw, David C.↗
Electronic devices for hydrogen leak and fire detection.
Electronic hydrogen leak and fire detector systems installed on Saturn S-IVB static test firing stands, discussing installation and operational problems
STATIC TESTING↗
Testing methods and techniques: Testing electrical and electronic devices: A compilation
The methods, techniques, and devices used in testing various electrical and electronic apparatus are presented. The items described range from semiconductor package leak detectors to automatic circuit analyzer and antenna simulators for system checkout. In many cases the approaches can result in considerable cost savings and improved quality control. The testing of various electronic components, assemblies, and systems; the testing of various electrical devices; and the testing of cables and connectors are explained.
Source record↗
Automatic cross-sectioning and monitoring system locates defects in electronic devices
System consists of motorized grinding and lapping apparatus, sample holder, and electronic control circuit. Low power microscope examines device to pinpoint location of circuit defect, and monitor displays output signal when defect is located exactly.
Jacobs, G.↗
Analytic procedures for determining dimensional redundancies in electronic devices
Methods for ascertaining dimensional redundancies in mathematical functions related to electronic phenomena and for removal of redundancies are presented. Two computer programs, one to determine a complete B-matrix and the other to optimize the matrix, are discussed. Three subroutines are analyzed.
Herskowitz, G. J.↗
Electronic device aspects of neural network memories
The basic issues related to the electronic implementation of the neural network model (NNM) for content addressable memories are examined. A brief introduction to the principles of the NNM is followed by an analysis of the information storage of the neural network in the form of a binary connection matrix and the recall capability of such matrix memories based on a hardware simulation study. In addition, materials and device architecture issues involved in the future realization of such networks in VLSI-compatible ultrahigh-density memories are considered. A possible space application of such devices would be in the area of large-scale information storage without mechanical devices.
Lambe, J.↗
Electrical and electronic devices and components: A compilation
Components and techniques which may be useful in the electronics industry are described. Topics discussed include transducer technology, printed-circuit technology, solid state devices, MOS transistors, Gunn device, microwave antennas, and position indicators.
Source record↗
Hermetically sealable package for hybrid solid-state electronic devices and the like
A light-weight, inexpensively fabricated, hermetically sealable, repairable package for small electronic or electromechanical units, having multiple connections, is described. A molded ring frame of polyamide-imide plastic (Torlon) is attached along one edge to a base plate formed of a highly heat conducting material, such as aluminum or copper. Bores are placed through a base plate within the area of the edge surface of ring frame which result in an attachment of the ring frame to the base plate during molding. Electrical leads are molded into the ring frame. The leads are L-shaped gold-plated copper wires imbedded within widened portions of the side wall of the ring frame. Within the plastic ring frame wall the leads are bent (typically, though not necessarily at 90 deg) so that they project into the interior volume of the ring frame for connection to the solid state devices.
Miller, Wilson N.↗
Automatic arc welding of propulsion system tubing in close proximity to sensitive electronic devices
The planned final assembly of the Galileo spacecraft propulsion system tubing, which involves welding in close proximity to sensitive electronics, raised significant concerns about the effects of electromagnetic coupling of weld energy on CMOS and other sensitive integrated circuits. A test program was established to assess the potential of an orbital arc welder and an RF-induction brazing machine to damage sensitive electronic equipment. Test parameters were varied to assess the effectiveness of typical transient suppression practices such as grounding, bonding, and shielding. A technique was developed to calibrate the hazard levels at the victim-circuit location; this technique is described along with the results and conclusions of the test program.
Lumsden, J. M.↗
Electronic device simulates respiration rate and depth
An oscillator circuit and a thermistor, in close proximity to a light bulb, periodically alter the heat output of the bulb by varying the voltage across its filament. Use of this simulator permits checkout tests on pneumographs.
Thomas, J. A.↗