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Results for “ELECTRONIC MODULE”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

Instruction manual, optical effects module electronic controller and processor, model OEMCP

The OEM-1 electronic module is discussed; it is comprised of four subsystems: the signal processing and display; the stepper motor controls; the chopper controls; and the dc-dc invertor. The OEM-1 module controls the sample wheel so that the relative transmittance of the samples can be compared to the clear aperture position. The 3-1/2 digit digital voltmeter displays the clear aperture signal level as well as the ratio of the remaining sample positions relative to the clear aperture position. The sample wheel position is decoded so that the signals and ratios can be correlated to the data. The OEM is automatically reset to the I sub o on initial turn-on and can be reset to the '0' position by actuating a front panel switch. The sample wheel can be interrupted to change samples or induce a longer integration time if desired by a front panel command. Integration times from 1 - 50 seconds are provided at the front panel, and BCD data for external interfacing is provided.

Source record↗
NASA NTRS1984

Repairable Encapsulated Electronic Modules

Packaging technique seals electronic modules as effectively as potting in epoxy, yet permits removal of encapsulant when component change necessary. Technique encloses module in thin, rigid epoxy/fiberglass shell containing lightweight syntactic foam.

Dozois, P. C.↗
NASA NTRSDate not supplied

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics↗
NASA NTRS1965

Electronic modules easily separated from heat sink

Metal heat sink and electronic modules bonded to a thermal bridge can be easily cleaved for removal of the modules for replacement or repair. A thin film of grease between a fluorocarbon polymer film on the metal heat sink and an adhesive film on the modules acts as the cleavage plane.

Source record↗
NASA NTRS1968

Encapsulation technique eliminates thermal stresses in welded electronic modules

Encapsulation technique minimizes embedment and thermal stresses in welded electronic modules. A coating of thinned room-temperature- vulcanizing silicone rubber having a high coefficient of expansion and flexibility at low temperature, is applied first and then an encapsulating epoxy resin having a relatively low coefficient of expansion is added.

Kimmel, M.↗
NASA NTRS1967

Transducer measures embedment stresses in electronic modules

Strain gage load transducer measures axial embedment stresses in resins used for encapsulation of welded electronic modules. It simulates the geometry of an actual electronic component and can be modified in size, shape, and operating temperature.

Smith, M. H.↗
NASA NTRS1966

Packaging of electronic modules

Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

Katzin, L.↗
NASA NTRS1982

Thematic mapper flight model preshipment review data package. Volume 4: Appendix. Part E: Electronics module data

Tests to verify the as-designed performance of all circuits within the thematic mapper electronics module unit are described. Specifically, the tests involved the evaluation of the scan line corrector driver, shutter drivers function, cal lamp controller function, post amplifier function, command decoder verification unit, and the temperature and actuator controllers function.

Source record↗
DOE OSTI2026

Power Electronics Module with Integrated Ceramic Heat Exchanger

NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.

25 ENERGY STORAGE↗
NASA NTRS1980

Measurement of minority-carrier drift mobility in solar cells using a modulated electron beam

A determination of diffusivity on solar cells is here reported which utilizes a one dimensional treatment of diffusion under sinusoidal excitation. An intensity-modulated beam of a scanning electron microscope was used as a source of excitation. The beam was injected into the rear of the cell, and the modulated component of the induced terminal current was recovered phase sensitively. A Faraday cup to measure the modulated component of beam current was mounted next to the sample, and connected to the same electronics. A step up transformer and preamplifier were mounted on the sample holder. Beam currents on the order of 400-pA were used in order to minimize effects of high injection. The beam voltage was 34-kV, and the cell bias was kept at 0-V.

Othmer, S.↗