Dynamic mechanical properties of epoxies' beta- transition mechanism
Beta transition mechanism dynamic mechanical properties in bisphenol-A based epoxy resins prepared with different curatives
Cuddihy, E.↗
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Analytical investigations employing dynamic mechanical properties
Dynamic mechanical spectroscopy has emerged as an effective laboratory method for analytical investigations of polymers. These methods were applied in investigating the property changes of silicone poppets implanted in artificial heart valves, and for exploring the cause of hardening of certain solid propellants. As a research activity, the property-structure relations which lead to the ability to superimpose dynamic data for epoxy resins were investigated.
Cuddihy, E. F.↗
Development of test methodology for dynamic mechanical analysis instrumentation
Dynamic mechanical analysis instrumentation was used for the development of specific test methodology in the determination of engineering parameters of selected materials, esp. plastics and elastomers, over a broad range of temperature with selected environment. The methodology for routine procedures was established with specific attention given to sample geometry, sample size, and mounting techniques. The basic software of the duPont 1090 thermal analyzer was used for data reduction which simplify the theoretical interpretation. Clamps were developed which allowed 'relative' damping during the cure cycle to be measured for the fiber-glass supported resin. The correlation of fracture energy 'toughness' (or impact strength) with the low temperature (glassy) relaxation responses for a 'rubber-modified' epoxy system was negative in result because the low-temperature dispersion mode (-80 C) of the modifier coincided with that of the epoxy matrix, making quantitative comparison unrealistic.
Allen, V. R.↗
A review of dynamic mechanical characterization of high temperature PMR polyimides and composites
This paper reviews the applications of dynamic mechanical characterization for high-temperature PMR polyimides and their graphite-fiber-reinforced composites. This characterization technique provides insights into the processability, performance, and structure property relationships of the polyimides and composites. The dynamic mechanical properties of various molding powders, commercially obtained prepregs, neat resins, and as-fabricated as well as aged composites are presented. Some applied aspects of the dynamic mechanical data are discussed.
Pater, Ruth H.↗
Dynamic mechanical analysis of fiber reinforced composites
Dynamic mechanical and thermal properties were determined for unidirectional epoxy/glass composites at various fiber orientation angles. Resonant frequency and relative logarithmic decrement were measured as functions of temperature. In low angle and longitudinal specimens a transition was observed above the resin glass transition temperature which was manifested mechanically as an additional damping peak and thermally as a change in the coefficient of thermal expansion. The new transition was attributed to a heterogeneous resin matrix induced by the fiber. The temperature span of the glass-rubber relaxation was found to broaden with decreasing orientation angle, reflecting the growth of fiber contribution and exhibiting behavior similar to that of Young's modulus. The change in resonant frequency through the glass transition was greatest for samples of intermediate fiber angle, demonstrating behavior similar to that of the longitudinal shear modulus.
Reed, K. E.↗
Dynamic mechanical analysis of fiber reinforced composites
Dynamic mechanical and thermal properties were determined for unidirectional epoxy/glass composites at various fiber orientation angles. Resonant frequency and relative logarithmic decrement were measured as functions of temperature. In low angle and longitudinal specimens a transition was observed above the resin glass transition temperature which was manifested mechanically as an additional damping peak and thermally as a change in the coefficient of thermal expansion. The new transition was attributed to a heterogeneous resin matrix induced by the fiber. The temperature span of the glass-rubber relaxation was found to broaden with decreasing orientation angle, reflecting the growth of fiber contribution and exhibiting behavior similar to that of Young's modulus. The change in resonant frequency through the glass transition was greatest for samples of intermediate fiber angle, demonstrating behavior similar to that of the longitudinal shear modulus.
Reed, K. E.↗
A MEMS dynamic mechanical analyzer for in situ viscoelastic characterization of 3D printed nanostructures
Cellular metamaterial structures with sub-micron features have shown the ability to become excellent energy absorbing materials for impact mitigation due to the enhanced mechanical properties of materials at the nanoscale. However, in order to optimize the design of these energy absorbing metamaterial structures we need to be able to measure the dynamic properties of the sub-micron features such as storage and loss moduli and the loss factor. Therefore, at scale testing is required to capture the scale, temperature, and strain rate dependent material properties of these nanoscale materials. This study presents the design, fabrication, and calibration of a MEMS-based dynamic mechanical analyzer (DMA) that can be directly integrated with the two photon lithography (TPL) process commonly used to fabricate metamaterial structures with nanoscale features. The MEMS-based DMA consists of a chevron style thermal actuator used to generate a tensile load on the structure and two differential capacitive sensors on each side of the structure used to measure load and displacement. This design demonstrated 1.5 ± 0.75 nm displacement resolution and 104 ± 52 nN load resolution, respectively. Dynamic mechanical analysis was successfully conducted on a single nanowire feature printed between the load and displacement stages of the MEMS device with testing frequencies ranging between 0.01–10 Hz and testing temperatures ranging between 22 °C–47 °C. These initial tests on an exemplar TPL part demonstrate that the printed nanowire behaves as a viscoelastic material wherein the transition from glassy to viscous behavior has already set in at the room temperature.
42 ENGINEERING↗
Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading
Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.
atomic force microscopy↗
Influence of high-strain-rate compression and subsequent heat treatment on (TiNbZr) 89 (AlTa) 11 refractory high-entropy alloys: Dynamic-mechanical behavior and microstructural changes
This study explored the dynamic-mechanical behavior of a novel low-density (TiNbZr) 89 (AlTa) 11 refractory high-entropy alloy (RHEA) across strain rates ranging from 1.0×10 3 to 3.5×10 3 s –1 . A significant increase in the yield and ultimate compressive strengths with rising strain rates up to 3.0×10 3 s –1 was observed and attributed to enhanced dislocation activities and stress-induced microstructural transformations. The formation of the B2 phase and Zr 5 Al 3 precipitates was found to be crucial in bolstering the alloy strength at high strain rates. Beyond strain rates of 3.0×10 3 s –1 , a decrease in strength occurred due to thermal softening and strain localization. Microstructural analyses at 3.5×10 3 s –1 revealed grain refinement, the development of micro shear bands, and dislocation tangles, which were indicative of dynamic recrystallization. Besides, the findings also revealed that the post-dynamic compression heat treatment further enhanced the hardness and microstructural stability of the alloy. These results highlight the potential of the (TiNbZr) 89 (AlTa) 11 RHEA for applications requiring materials with high strength-to-weight ratios, particularly in dynamically loaded environments. It is expected that the results of this study will further advance our fundamental understanding of the behavior of RHEAs under extreme conditions, thereby opening new avenues for material innovation.
36 MATERIALS SCIENCE↗
Reliability Implications of Solder in Multiwire Modules under Dynamic Mechanical Loading: Preprint
Two generations of multiwire modules were studied under dynamic mechanical loading (DML). The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the state-of-the-art module did not demonstrate degradation under DML. The degradation in the earlier module was attributed to damage at the solder-gridline interfaces. Atomic force microscopy scratch testing estimated the wear resistance of each solder alloy to assess susceptibility to degradation. Bi-based alloys appear to be more wear resistant than In-based alloys, consistent with the DML results. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.
41 EE - Solar Energy Technologies Office (EE-4S)↗
Dynamic mechanical properties of N-phenylnadimide modified PMR polyimide composites
Temperature-frequency dependence of alpha, beta, and gamma transitions was determined using a Rheometrics dynamic spectrometer on a series of unidirectional Celion 6000/N-phenylnadimide (PN) modified PMR polyimide composites. The objective was to see if any correlations exist between crosslinked network structure and dynamic mechanical properties. Variation in crosslinked network structures was achieved by altering the polyimide formulation through addition of various quantities of PN into the standard PMR-15 composition. As a control, PMR-15 composite system exhibited well-defined alpha, beta, and gamma transitions in the regions of 360, 100, and -120 C, respectively. Their activation energies were estimated to be 232, 60, and 14 kcal/mole, respectively. Increasing the amount of PN concentration caused lowering of the activation energies of the three relaxations, a decrease of the glass transition temperature, and increasing intensities of the three damping peaks, compared to the control PMR-15 counterpart. These dynamic mechanical responses were in agreement with formation of a more flexible copolymer from PN and PMR-15 prepolymer.
Pater, Ruth H.↗
Dynamic Mechanical Properties of N-Phenylnadimide Modified PMR Polyimide Composites
The rheological behavior of newly developd Celion 6000/N-phenylnadimide modified PMR polyimide and PMR-15 composites was investigated. The dynamic mechanical properties were correlated with the structure of N-phenylnadimide modified PMR polyimides. The storage modulus (G'), loss modulus (G''), and loss tangent (tan delta) of four composite systems were measured over a temperature range from -150 to 400 C. Three well defined peaks were seen in the regions of 360, 100, and -120 C, corresponding to the alpha, beta, and gamma relaxations, respectively, of the matrix resins. The activation energies of the alpha, beta, and gamma relaxations were estimated to be 232, 60, and 14 kcal/mole, respectively, for PMR-15. Addition of N-phenylnadimide to the PMR-15 composition lowered the glass transition temperature and the activation energies of PMR-15 polyimide. The dynamic mechanical data appear to be consistent with the formation of a copolymer from N-phenylnadimide and a PMR-15 prepolymer.
Pater, R. H.↗
Dynamic-mechanical response of graphite/epoxy composite laminates and neat resin
Dynamic mechanical measurement results are presented for the case of carbon fiber-reinforced, epoxy matrix composite laminates subjected to loading perpendicular to the lamination plane, as well as for neat epoxy resin under the same conditions, where temperatures ranged between 20 and 200 C and deformation levels lie within the linear viscoelastic region. In-phase and out-of-phase stiffnesses are found to become superposed, forming master curves that cover a 12-decade frequency range. The application of a master curve scaling procedure shows that the in-phase stiffness has the same shape, and out-of-phase stiffness has the same dispersion, for all laminates irrespective of stacking sequence and are, in turn, nearly identical to those for the neat epoxy resin. An empirical function is found for the relaxation modulus which, when converted to a dynamic modulus, yields good overall agreement for both of the dynamic stiffness components as a function of frequency.
Yang, P.↗
Dynamic mechanical analysis of polymeric materials
Polymeric materials exhibit mechanical behavior which is dependent on temperature. Dynamic mechanical analysis measures the mechanical damping and resonant frequency of a material over a temperature range. Values of the dynamic loss modulus, storage modulus, and loss tangent can be calculated from these data. The glass transition temperature and onset temperature are obtained from curves of the dynamic moduli versus temperature.
Kern, Kristen T.↗
Dynamic mechanical analysis and organization/storage of data for polymetric materials
Dynamic mechanical analysis was performed on a variety of temperature resistant polymers and composite resin matrices. Data on glass transition temperatures and degree of cure attained were derived. In addition a laboratory based computer system was installed and data base set up to allow entry of composite data. The laboratory CPU termed TYCHO is based on a DEC PDP 11/44 CPU with a Datatrieve relational data base. The function of TYCHO is integration of chemical laboratory analytical instrumentation and storage of chemical structures for modeling of new polymeric structures and compounds
Rosenberg, M.↗
Solid propellant dynamic mechanical properties and blast effects.
Explosive proclivities of composite propellants related to dynamic mechanical properties
Amster, A. B.↗
Dynamic mechanical characterization of cure of a polyimide-graphite fiber composite (PMR 15/Celion 6000)
Dynamic mechanical studies of thermosetting PMR 15 polyimide/Celion 6000 composites were used to characterize cure behavior. Variation in composite shear modulus with cure time for laminates partially cured under 3.45 MPa pressure was compared with that of laminates fully cured under pressure to select a partially cured system whose behavior corresponded with that of the pressure-cured composites. An empirical kinetic model was developed that relates relative composite shear moduli to cure time and temperature. This model, coupled with standard statistical techniques, was used in the determination of an overall activation energy, E = 145 kj/mole (35 kcal/mole) and order of reaction, n, for the cure reaction(s). The empirical relationship defining dynamic modulus as a function of time and temperature remained linear well into the glassy region. Changes in dynamic glass-transition temperature and in the breadth of the transition peaks with cure time are discussed. Shear modulus and damping were found to be more sensitive measures of relative extent of cure than Fourier transform infrared spectroscopy.
Hurwitz, F. I.↗
Dynamic mechanical behavior of stress- graphitized and boron-doped pyrolytic carbon.
Stress graphitizing and boron codeposition effect on dynamic mechanical properties of pyrolytic carbon, noting increase in internal friction and dynamic modulus
Kline, D. E.↗