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All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Materials Data on DyCl3 by Materials Project

DyCl3 crystallizes in the orthorhombic Cmcm space group. The structure is two-dimensional and consists of two DyCl3 sheets oriented in the (0, 1, 0) direction. Dy3+ is bonded in a 8-coordinate geometry to eight Cl1- atoms. There are a spread of Dy–Cl bond distances ranging from 2.65–2.94 Å. There are two inequivalent Cl1- sites. In the first Cl1- site, Cl1- is bonded in a distorted trigonal non-coplanar geometry to three equivalent Dy3+ atoms. In the second Cl1- site, Cl1- is bonded in an L-shaped geometry to two equivalent Dy3+ atoms.

36 MATERIALS SCIENCE↗
DOE OSTI2022

Synthesis of dysprosium oxychloride (DyOCl)

Dysprosium oxychloride, DyOCl, was synthesized using a simple dehydration method with DyCl3·6H2O. X-ray powder diffraction data was used to determine the crystal structure. The DyOCl compound is isostructural to the matlockite (PbFCl) crystal structure and crystallizes in the tetragonal P4/nmm (#129) space group. The crystal structure contains the alternating cationic layers of (DyO)n and anionic layers of nCl– along the c-axis. The structural data including unit cell, volume, and density of DyOCl were compared to other REOCl data from Inorganic Crystal Structure Database (ICSD) and our previous study on TbOCl. Fourier-transform infrared spectroscopy (FTIR) was performed, and the vibrations of DyOCl possibly from Dy–O and Dy–Cl were observed at 543 and 744 cm-1. Scanning electron microscopy analysis (SEM) showed irregularly shaped crystals.

Chong, Saehwa↗
NASA NTRS1991

A process for preparing an assembly of an article and a polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes to temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion containing additive was added to the solution. Examples of this additive are: TbCl3, DyCl3, ErCl3, TmCl3, Al(C5H7O2)3, and Er2S3. The polyamic acid solution was imidized and is combined with the article to form the assembly.

Stoakley, Diane M.↗
NASA NTRS1994

Process for preparing an assembly of an article and a polyimide which resists dimensional change, delamination and debonding when exposed to changes in temperature

An assembly of an article and a polyimide composition is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A polyamic acid solution which yields a polyimide having a low coefficient of thermal expansion (CTE) was prepared. Equimolar quantities of an aromatic diamine and an aromatic dianhydride were reacted in a solvent medium to form a polyamic acid solution. A metal ion-containing additive was added to the solution. Examples of this additive are: TbCl3, DyCl3, ErCl3, TmCl3, Al(C5H7O2)3, and Er2S3. The polyamic acid solution was imidized and is combined with the article to form the assembly.

Stoakley, Diane M.↗