Tower Distributed Temperature-Sensing (DTS) - channel 2
Tower Distributed Temperature-Sensing (DTS) - channel 2
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Tower Distributed Temperature-Sensing (DTS) - channel 2
Tower Distributed Temperature-Sensing (DTS) - channel 3
Tower Distributed Temperature-Sensing (DTS) - channel 1
Tower Distributed Temperature-Sensing (DTS) - channel 4
Distributed temperature-sensing data collected using a Silixa-XT DTS and 50/125 MM fiber. Data are calibrated using two water baths at the surface and an iMet aloft at the end of the fiber and tether. The data are then assigned an altitude for the TBS flight. Data collected prior to Febuary 11, 2020 were collected at the SGP Central Facility (CF). Data from 2/11/20 were collected with a Sensornet Oryx DTS at the E9 site, not at the CF. Data from May 2021 were collected with a Sensornet Oryx at the CF, and with a Silixa XT at the CF. Data from July 2021 were collected at the SGP CF, EF9, and EF36 with a Silixa XT. Data from October 2021 were collected at the SGP EF36 with a Silixa XT. Data from February 2022 were collected at the CF with a Silixa XT.
The SPEED camera is being developed to study the spectral energy distributions of high redshift galaxies using the Heinrich Hertz Telescope (HHT) in Arizona. SPEED requires a small cryogenic detector array of 2x2 pixels with each pixel having four frequency bands in the 150-350 GHz range. Here we describe the development of the detector array of these high efficiency FSBs. The FSB design provides the multi-pixel multi-spectral band capability required for SPEED in a compact stackable array. The SPEED bolometers will use proximity effect superconducting transition edge sensors as their temperature-sensing element allowing for higher levels of multiplexing in future applications.
Unitary array of sensors measures temperatures at points distributed over designated area on surface. Useful in measuring surface temperatures of aerodynamic models and thermally controlled objects. Made of combination of integrated-circuit microchips and film circuitry. Temperature-sensing chips scanned at speeds approaching 10 kHz. Operating range minus 40 degrees C to 120 degrees C. Flexibility of array conforms to curved surfaces. Multiplexer eliminates numerous monitoring cables. Control of acquisition and recording of data effected by connecting array to microcomputers via suitable interface circuitry.
Electronics for Distributed Turbine Engine Control and Space Exploration Missions are expected to encounter extreme temperatures and wide thermal swings. In particular, circuits deployed in a jet engine compartment are likely to be exposed to temperatures well exceeding 150 C. To meet this requirement, efforts exist at the NASA Glenn Research Center (GRC), in support of the Fundamental Aeronautics Program/Subsonic Fixed Wing Project, to develop temperature sensors geared for use in high temperature environments. The sensor and associated circuitry need to be located in the engine compartment under distributed control architecture to simplify system design, improve reliability, and ease signal multiplexing. Several circuits were designed using commercial-off-the-shelf as well as newly-developed components to perform temperature sensing at high temperatures. The temperature-sensing circuits will be described along with the results pertaining to their performance under extreme temperature.