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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Semiselective Optoelectronic Sensors for Monitoring Microbes

Sensor systems are under development for use in real-time detection and quantitation of microbes in water without need for sampling. These systems include arrays of optical sensors; miniature, portable electronic data-acquisition circuits; and optoelectronic interfaces between the sensor arrays and data-acquisition circuits. These systems are intended for original use in long-term, inline monitoring of waterborne micro-organisms in water-reclamation systems aboard future spacecraft. They could also be adapted to similar terrestrial uses with respect to municipal water supplies, stored drinking water, and swimming water; for detecting low-level biological contamination in biotechnological, semiconductor, and pharmaceutical process streams; and in verifying the safety of foods and beverages. In addition, they could be adapted to monitoring of airborne microbes and of surfaces (e.g., to detect and/or quantitate biofilms). The designs of the sensors in these systems are based partly on those of sensors developed previously for monitoring airborne biological materials. The designs exploit molecular- recognition and fluorescence-spectroscopy techniques, such that in the presence of micro-organisms of interest, fluorescence signals change and the changes can be measured. These systems are characterized as semiselective because they respond to classes of micro-organisms and can be used to discriminate among the classes. This semiselectivity is a major aspect of the design: It is important to distinguish between (1) the principle of detection and quantitation of classes of micro-organisms by use of these sensors and (2) the principle of detection and quantitation of individual microbiological species by means of prior immuno-diagnostic and/or molecular-biology techniques. Detection of classes (in contradistinction to species) is particularly valuable when the exact nature of a contaminant is unknown.

Tabacco, Mary Beth↗
NASA NTRS2012

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Chen, Liang-Yu↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS2007

Infrared Imaging System for Studying Brain Function

A proposed special-purpose infrared imaging system would be a compact, portable, less-expensive alternative to functional magnetic resonance imaging (fMRI) systems heretofore used to study brain function. Whereas a typical fMRI system fills a large room, and must be magnetically isolated, this system would fit into a bicycle helmet. The system would include an assembly that would be mounted inside the padding in a modified bicycle helmet or other suitable headgear. The assembly would include newly designed infrared photodetectors and data-acquisition circuits on integrated-circuit chips on low-thermal-conductivity supports in evacuated housings (see figure) arranged in multiple rows and columns that would define image coordinates. Each housing would be spring-loaded against the wearer s head. The chips would be cooled by a small Stirling Engine mounted contiguous to, but thermally isolated from, the portions of the assembly in thermal contact with the wearer s head. Flexible wires or cables for transmitting data from the aforementioned chips would be routed to an integrated, multichannel transmitter and thence through the top of the assembly to a patch antenna on the outside of the helmet. The multiple streams of data from the infrared-detector chips would be sent to a remote site, where they would be processed, by software, into a three-dimensional display of evoked potentials that would represent firing neuronal bundles and thereby indicate locations of neuronal activity associated with mental or physical activity. The 3D images will be analogous to current fMRI images. The data would also be made available, in real-time, for comparison with data in local or internationally accessible relational databases that already exist in universities and research centers. Hence, this system could be used in research on, and for the diagnosis of response from the wearer s brain to physiological, psychological, and environmental changes in real time. The images would also be stored in a relational database for comparison with corresponding responses previously observed in other subjects.

Mintz, Frederick↗
NASA NTRS1992

Heterojunction bipolar transistor technology for data acquisition and communication

Heterojunction Bipolar Transistor (HBT) technology has emerged as one of the most promising technologies for ultrahigh-speed integrated circuits. HBT circuits for digital and analog applications, data conversion, and power amplification have been realized, with speed performance well above 20 GHz. At Rockwell, a baseline AlGaAs/GaAs HBT technology has been established in a manufacturing facility. This paper describes the HBT technology, transistor characteristics, and HBT circuits for data acquisition and communication.

Wang, C.↗
NASA NTRS2007

Wireless Data-Acquisition System for Testing Rocket Engines

A prototype wireless data-acquisition system has been developed as a potential replacement for a wired data-acquisition system heretofore used in testing rocket engines. The traditional use of wires to connect sensors, signal-conditioning circuits, and data acquisition circuitry is time-consuming and prone to error, especially when, as is often the case, many sensors are used in a test. The system includes one master and multiple slave nodes. The master node communicates with a computer via an Ethernet connection. The slave nodes are powered by rechargeable batteries and are packaged in weatherproof enclosures. The master unit and each of the slave units are equipped with a time-modulated ultra-wide-band (TMUWB) radio transceiver, which spreads its RF energy over several gigahertz by transmitting extremely low-power and super-narrow pulses. In this prototype system, each slave node can be connected to as many as six sensors: two sensors can be connected directly to analog-to-digital converters (ADCs) in the slave node and four sensors can be connected indirectly to the ADCs via signal conditioners. The maximum sampling rate for streaming data from any given sensor is about 5 kHz. The bandwidth of one channel of the TM-UWB radio communication system is sufficient to accommodate streaming of data from five slave nodes when they are fully loaded with data collected through all possible sensor connections. TM-UWB radios have a much higher spatial capacity than traditional sinusoidal wave-based radios. Hence, this TM-UWB wireless data-acquisition can be scaled to cover denser sensor setups for rocket engine test stands. Another advantage of TM-UWB radios is that it will not interfere with existing wireless transmission. The maximum radio-communication range between the master node and a slave node for this prototype system is about 50 ft (15 m) when the master and slave transceivers are equipped with small dipole antennas. The range can be increased by changing to larger antennas and/or greater transmission power. The battery life of a slave node ranges from about six hours during operation at full capacity to as long as three days when the system is in a "sleep" mode used to conserve battery charge during times between setup and rocket-engine testing. Batteries can be added to prolong operational lifetimes. The radio transceiver dominates the power consumption.

Lin, Chujen↗
NASA NTRS1996

Ampoule Failure System

An ampoule failure system for use in material processing furnaces comprising a containment cartridge and an ampoule failure sensor. The containment cartridge contains an ampoule of toxic material therein and is positioned within a furnace for processing. An ampoule failure probe is positioned in the containment cartridge adjacent the ampoule for detecting a potential harmful release of toxic material therefrom during processing. The failure probe is spaced a predetermined distance from the ampoule and is chemically chosen so as to undergo a timely chemical reaction with the toxic material upon the harmful release thereof. The ampoule failure system further comprises a data acquisition system which is positioned externally of the furnace and is electrically connected to the ampoule failure probe so as to form a communicating electrical circuit. The data acquisition system includes an automatic shutdown device for shutting down the furnace upon the harmful release of toxic material. It also includes a resistance measuring device for measuring the resistance of the failure probe during processing. The chemical reaction causes a step increase in resistance of the failure probe whereupon the automatic shutdown device will responsively shut down the furnace.

Watring, Dale A.↗
NASA NTRS1986

1985 Nuclear Science Symposium, 32nd, and 1985 Symposium on Nuclear Power Systems, 17th, San Francisco, CA, October 23-25, 1985, Proceedings

The present conference ranges over topics in high energy physics instrumentation, detectors, nuclear medical applications, health physics and environmental monitoring, reactor instrumentation, nuclear spacecraft instrumentation, the 'Fastbus' data acquisition system, circuits and systems for nuclear research facilities, and the development status of nuclear power systems. Specific attention is given to CCD high precision detectors, a drift chamber preamplifier, a Cerenkov ring imaging detector, novel scintillation glasses and scintillating fibers, a modular multidrift vertex detector, radial wire drift chambers, liquid argon polarimeters, a multianode photomultiplier, the reliability of planar silicon detectors, the design and manufacture of wedge and strip anodes, ultrafast triode photodetectors, photomultiplier tubes, a barium fluoride plastic scintillator, a fine grained neutron hodoscope, the stability of low leakage silicon photodiodes for crystal calorimeters, and X-ray proportional counters. Also considered are positron emission tomography, single photon emission computed tomography, nuclear magnetic resonance imaging, Geiger-Muller detectors, nuclear plant safeguards, a 32-bit Fastbus computer, an advanced light water reactor, and nuclear plant maintenance.

Source record↗
NASA NTRS1993

An optical motion measuring system for laterally oscillated fatigue tests

This paper describes an optical system developed for materials testing laboratories at NASA Langley Research Center (LaRC) for high resolution monitoring of the transverse displacement and angular rotation of a test specimen installed in an axial-tension bending machine (ATB) during fatigue tests. It consists of a small laser, optics, a motorized mirror, three photodiodes, electronic detection and counting circuits, a data acquisition system, and a personal computer. A 3-inch by 5-inch rectangular plate attached to the upper grip of the test machine serves as a target base for the optical system. The personal computer automates the fatigue test procedure, controls data acquisition, performs data reduction, and provides user displays. The data acquisition system also monitors signals from up to 16 strain gages mounted on the test specimen. The motion measuring system is designed to continuously monitor and correlate the amplitude of the oscillatory motion with the strain gage signals in order to detect the onset of failure of the composite test specimen. A prototype system has been developed and tested which exceeds the design specifications of +/- 0.01 inch displacement accuracy, and +/- 0.25 deg angular accuracy at a sampling rate of 100 samples per second.

Tripp, John S.↗
NASA NTRS1967

Advanced transducers Final report

Design of digital adapter with limit storage for transducers for use in multichannel digital data acquisition system

INTEGRATED CIRCUIT↗
NASA NTRS1971

Precision calibration and reference voltage source for data acquisition systems

Hybrid integrated circuit operational amplifiers, which have inherent characteristics of low quiescent power dissipation and extended operational lifetime with high reliability, are source for digital systems. Amplifiers are coupled to Zener reference diode in current control and buffer configuration.

Source record↗
NASA NTRS1990

Data-Acquisition Board For IBM PS/2 Computer

Circuit board containing microprocessors designed to control acquisition of data by IBM PS/2 computer. Plugged into one of 16-bit slots on mother board of computer. Controls transfer of data from as many as 48 discrete channels to Micro Channel Interface. With expansion of software, board recognizes and filters specified kinds of signal patterns, possibly to detect errors.

Hoang, Phuong-Dung T.↗
NASA NTRS1987

1986 Nuclear Science Symposium, 33rd, and 1986 Symposium on Nuclear Power Systems, 18th, Washington, DC, Oct. 29-31, 1986, Proceedings

Papers are presented on space, low-energy physics, and general nuclear science instrumentations. Topics discussed include data acquisition systems and circuits, nuclear medicine imaging and tomography, and nuclear radiation detectors. Consideration is given to high-energy physics instrumentation, reactor systems and safeguards, health physics instrumentation, and nuclear power systems.

Stubblefield, F. W.↗
NASA NTRS2003

Integrated Electrode Arrays for Neuro-Prosthetic Implants

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Brandon, Erik↗
NASA NTRS1995

Maximum Acceleration Recording Circuit

Coarsely digitized maximum levels recorded in blown fuses. Circuit feeds power to accelerometer and makes nonvolatile record of maximum level to which output of accelerometer rises during measurement interval. In comparison with inertia-type single-preset-trip-point mechanical maximum-acceleration-recording devices, circuit weighs less, occupies less space, and records accelerations within narrower bands of uncertainty. In comparison with prior electronic data-acquisition systems designed for same purpose, circuit simpler, less bulky, consumes less power, costs and analysis of data recorded in magnetic or electronic memory devices. Circuit used, for example, to record accelerations to which commodities subjected during transportation on trucks.

Bozeman, Richard J., Jr.↗
NASA NTRS2000

An Integrated MEMS Sensor Cluster System for Aerospace Applications

Efforts to reduce viscous drag on airfoils could results in a considerable saving for the operation of flight vehicles including those of space transportation. This reduction of viscous drag effort requires measurement and active control of boundary layer flow property on an airfoil. Measurement of viscous drag of the boundary layer flow over an airfoil with minimal flow disturbance is achievable with newly developed MEMS sensor clusters. These sensor clusters provide information that can be used to actively control actuators to obtain desired flow properties or design a vehicle to satisfy particular boundary layer flow criteria. A series of MEMS sensor clusters has been developed with a data acquisition and control module for local measurements of shear stress, pressure, and temperature on an airfoil. The sensor cluster consists of two shear stress sensors, two pressure sensors, and two temperature sensors on a surface area of 1.24 mm x 1.86 mm. Each sensor is 300 microns square and is placed on a flexible polyimide sheet. The shear stress sensor is a polysilicon hot-film resistor, which is insulated by a vacuum cavity of 200 x 200 x 2 microns. The pressure sensors are silicon piezoresistive type, and the temperature sensors are also hot film polysilicon resistors. The total size of the cluster including sensors and electrical leads is 1 Omm x 1 Omm x 0.1 mm. A typical sensitivity of shear stress sensor is 150 mV/Pascal, the pressure sensors are an absolute type with a measurement range from 9 to 36 psia with 0.8mV/V/psi sensitivity, and the temperature sensors have a measurement resolution of 0.1 degree C. The sensor clusters are interfaced to a data acquisition and control module that consists of two custom ASICs (Application Specific Integrated Circuits) and a micro-controller. The data acquisition and control module transfers data to a host PC that configures and controls a total of three sensor clusters. Functionality of the entire system has been tested in the laboratory, and preliminary test results are presented.

Kahng, Seun↗
NASA NTRS1973

Binary selectable detector holdoff circuit: Design, testing, and application

A very high speed switching circuit, part of a laser radar data acquisition system, has been designed and tested. The primary function of this circuit was to provide computer controlled switching of photodiode detector preamplifier power supply voltages, typically less than plus or minus 20 volts, in approximately 10 nanoseconds. Thus, in actual use, detector and/or detector preamplifier damage can be avoided as a result of sudden extremely large values of backscattered radiation being detected, such as might be due to short range, very thin atmospheric dust layers. Switching of the power supply voltages was chosen over direct switching the photodiode detector input to the preamplifier, based on system noise considerations. Also, the circuit provides a synchronized trigger pulse output for triggering devices such as the Biomation Model 8100 100 MHz analog to digital converter.

Kadrmas, K. A.↗