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Persistence of crystal orientations across sub-micron-scale "super-grains" in self-organized Cu-W nanocomposites

We use precession electron diffraction to investigate the crystallographic character of copper (Cu)-tungsten (W) nanocomposites fabricated via physical vapor co-deposition at 400 oC. We observe sub-micron-scale regions, where apparently disconnected Cu and W grains have near identical crystallographic orientations. This persistence of grain orientations suggests Cu and W grains within these regions are interconnected in 3-D when they first form and may be considered as intercalated, sub-micron-scale "super-grains". Indeed, atom probe tomography provides direct evidence of 3-D interconnectivity of W domains. Our findings shed light on the structure and self organization mechanisms of nanocomposites formed by spontaneous phase separation of co-deposited metals.

Yadav, Digvijay↗

Outgassing of implanted He via short circuit transport along phase and grain boundaries in vapor co-deposited Cu-W nanocomposites

We investigate the response of physical vapor co-deposited copper (Cu)-tungsten (W) nanocomposites to helium (He) implantation. Nuclear reaction analysis (NRA) reveals that a substantial fraction of He implanted into these materials escapes during implantation. Analysis of nanocomposite microstructure shows that the He loss is likely due to its transport out of the material by diffusion along phase and grain boundaries. Lastly, our findings suggest that solid-state interfaces such as phase and grain boundaries are short circuit diffusion pathways for transport of He.

36 MATERIALS SCIENCE↗

Materials Data on Cu3W by Materials Project

WCu3 is alpha bismuth trifluoride structured and crystallizes in the cubic Fm-3m space group. The structure is three-dimensional. W is bonded in a distorted body-centered cubic geometry to fourteen Cu atoms. There are eight shorter (2.56 Å) and six longer (2.96 Å) W–Cu bond lengths. There are two inequivalent Cu sites. In the first Cu site, Cu is bonded to four equivalent W and four equivalent Cu atoms to form a mixture of distorted face, edge, and corner-sharing CuCu4W4 tetrahedra. All Cu–Cu bond lengths are 2.56 Å. In the second Cu site, Cu is bonded in a 8-coordinate geometry to six equivalent W and eight equivalent Cu atoms.

36 MATERIALS SCIENCE↗