Cu-Ni diffusion - Electron microprobe study of effects of voids and discontinuities
Cu-Ni diffusion couples voids and edges effect on concentration gradients measurement by electron probe microanalysis
Lewis, B. W.↗
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ac susceptibility of thermally annealed and neutron irradiated Cu-Ni alloys
Thermal annealing and high-flux neutron irradiation are used to vary the degree of short-range atomic order in Cu-Ni alloys of composition 40, 50, and 60 at. pct Ni. The magnetic state is measured by ac magnetic susceptibility measurements. It is shown that annealing at 350 C causes significant changes in the susceptibility of all the samples. In the 50 and 60 at. pct Ni samples, the transition is broadened and extended to higher temperatures, while the 40 at. pct Ni sample changes from a paramagnetic system to a weakly ferromagnetic system. The neutron irradiation, in contrast to the thermal treatment, causes the development of smaller size cluster formations. The irradiated 60 at. pct Ni sample exhibits no change in the shape of its susceptibility curve from that of the quenched sample, whereas, the 40 pct alloy is changed, by irradiation, from a paramagnetic system to a spin-glass system.
Catchings, R. M., III↗
Surface Segregation in Cu-Ni Alloys
Monte Carlo simulation is used to calculate the composition profiles of surface segregation of Cu-Ni alloys. The method of Bozzolo, Ferrante, and Smith is used to compute the energetics of these systems as a function of temperature, crystal face, and bulk concentration. The predictions are compared with other theoretical and experimental results.
Good, Brian↗
Development of Hybrid Sensor Arrays for Sensor Arrays for Simultaneous Measurement of Pressure and Shear Stress Distribution
This document reports on the progress in developing hybrid sensors for the simultaneous measurement of pressure and shear stress. The key feature for the success of the proposed hybrid sensor array is the ability to deposit Cu-Ni alloy with proper composition (55 - 45) on a silicon wafer to form a strain gage. This alloy strain gage replaces the normally used Si strain gages in MEMS, which are highly nonlinear and temperature dependent. The copper nickel, with proper composition (55 - 45), was successfully deposited on a silicon wafer with a few trials during this period of the project. Pictures of the Cu-Ni alloy strain gage and the x-ray spectra indicating the composition are shown. The planned tests are also reviewed.
Source record↗
Pendulum impact resistance of tungsten-fiber metal-matrix composites
Impact strength of Cu, Cu-Ni alloy and superalloy matrices reinforced with W fibers, studying temperature, heat treatment and fiber content and toughness effects
Petrasek, D. W.↗
A study of the adhesion of copper to nickel
Bulk and surface diffusion roles in clean and contaminated Cu-Ni surfaces adhesion
Lewis, B. W.↗
The origin and evolution of sulfur in an Archean volcano-sedimentary basin, Deer Lake area, Minnesota
Rocks of the Deer Lake area, northcentral Minnesota, consist of Archean (age greater than 2.6 billion years) metasediments and metavolcanics intruded by mafic layered sills. Geologic and sulfur isotopic data suggest that sulfides in the sediments are bacteriogenic, having formed in response to the activity of sulfate reducing bacteria during diagenesis. Deposition of the sediments appears to have occurred in a deep marine basin with restricted circulation of sea water. The bulk of the sulfur in the igneous rocks is of deep seated origin, but basal contacts of the sills show evidence of assimilation of biogenic sulfur from the intruded sediments. This assimilation of biogenic sulfur is the primary geochemical control of local Cu-Ni sulfide mineralization.
Nicol, D. L.↗
Surface Segregation in Ternary Alloys
Surface segregation profiles of binary (Cu-Ni, Au-Ni, Cu-Au) and ternary (Cu-Au-Ni) alloys are determined via Monte Carlo-Metropolis computer simulations using the BFS method for alloys for the calculation of the energetics. The behavior of Cu or Au in Ni is contrasted with their behavior when both are present. The interaction between Cu and Au and its effect on the segregation profiles for Cu-Au-Ni alloys is discussed.
Good, Brian↗