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NASA NTRS1994

Status of flexible CIS research at ISET

Polycrystalline thin film solar cells fabricated on light-weight, flexible substrates are very attractive for space applications. In this work CulnSe2 (CIS) based thin film devices were processed on metallic foil substrates using the selenization technique. CIS deposition method involved reaction of electron-bean evaporated Cu-In precursor layers with a selenizing atmosphere at around 400 C. Several metallic foils such as Mo, Ti, Al, Ni, and Cu were evaluated as possible substrates for these devices. Solar cells with AM1.5 efficiencies of 9.0-9.34 percent and good mechanical integrity were demonstrated on Mo and Ti foils. Monolithic integration of these devices was also demonstrated up to 4 in x 4 in size.

Basol, B. M.↗

DOE OSTI2020

Materials Data on In7Cu10 by Materials Project

Cu10In7 crystallizes in the monoclinic C2/m space group. The structure is three-dimensional. there are seven inequivalent Cu sites. In the first Cu site, Cu is bonded in a 11-coordinate geometry to seven Cu and four In atoms. There are a spread of Cu–Cu bond distances ranging from 2.55–2.72 Å. There are three shorter (2.73 Å) and one longer (2.76 Å) Cu–In bond lengths. In the second Cu site, Cu is bonded to six Cu and six In atoms to form corner-sharing CuIn6Cu6 cuboctahedra. There are a spread of Cu–Cu bond distances ranging from 2.57–2.78 Å. There are a spread of Cu–In bond distances ranging from 2.90–3.04 Å. In the third Cu site, Cu is bonded in a 10-coordinate geometry to four Cu and six In atoms. There are two shorter (2.75 Å) and two longer (2.76 Å) Cu–Cu bond lengths. There are a spread of Cu–In bond distances ranging from 2.68–2.70 Å. In the fourth Cu site, Cu is bonded in a 11-coordinate geometry to six Cu and five In atoms. There are one shorter (2.66 Å) and two longer (2.77 Å) Cu–Cu bond lengths. There are a spread of Cu–In bond distances ranging from 2.63–2.86 Å. In the fifth Cu site, Cu is bonded in a 11-coordinate geometry to five Cu and six In atoms. There are a spread of Cu–Cu bond distances ranging from 2.71–2.78 Å. There are a spread of Cu–In bond distances ranging from 2.64–3.11 Å. In the sixth Cu site, Cu is bonded in a 11-coordinate geometry to five Cu and six In atoms. The Cu–Cu bond length is 2.67 Å. There are a spread of Cu–In bond distances ranging from 2.66–3.02 Å. In the seventh Cu site, Cu is bonded in a 11-coordinate geometry to five Cu and six In atoms. The Cu–Cu bond length is 2.70 Å. There are a spread of Cu–In bond distances ranging from 2.71–2.85 Å. There are five inequivalent In sites. In the first In site, In is bonded in a 9-coordinate geometry to seven Cu and one In atom. The In–In bond length is 3.10 Å. In the second In site, In is bonded in a 8-coordinate geometry to eight Cu atoms. In the third In site, In is bonded in a 9-coordinate geometry to eight Cu and one In atom. In the fourth In site, In is bonded in a 11-coordinate geometry to ten Cu and one In atom. The In–In bond length is 3.10 Å. In the fifth In site, In is bonded in a 8-coordinate geometry to eight Cu and one In atom.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Materials Data on In3Cu by Materials Project

CuIn3 crystallizes in the hexagonal P6_3/mmc space group. The structure is one-dimensional and consists of two CuIn3 ribbons oriented in the (0, 0, 1) direction. Cu is bonded in a 6-coordinate geometry to six equivalent In atoms. All Cu–In bond lengths are 2.90 Å. In is bonded in a 2-coordinate geometry to two equivalent Cu atoms.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Materials Data on InCu by Materials Project

CuIn crystallizes in the orthorhombic Cmcm space group. The structure is three-dimensional. Cu is bonded in a body-centered cubic geometry to two equivalent Cu and six equivalent In atoms. Both Cu–Cu bond lengths are 2.54 Å. All Cu–In bond lengths are 2.73 Å. In is bonded in a 6-coordinate geometry to six equivalent Cu atoms.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Materials Data on In2Cu by Materials Project

CuIn2 crystallizes in the hexagonal P6_3/mmc space group. The structure is three-dimensional. Cu is bonded in a 3-coordinate geometry to nine In atoms. There are three shorter (2.71 Å) and six longer (3.21 Å) Cu–In bond lengths. There are two inequivalent In sites. In the first In site, In is bonded in a trigonal planar geometry to three equivalent Cu and six equivalent In atoms. All In–In bond lengths are 3.21 Å. In the second In site, In is bonded in a 12-coordinate geometry to six equivalent Cu and eight In atoms. Both In–In bond lengths are 3.45 Å.

36 MATERIALS SCIENCE↗