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NASA NTRS1978

Development of Low Cost Contacts to Silicon Solar Cells

Commercial electroless Cu solutions were used. Satisfactory adhesion (and fairly good cell performance) resulted from the use of thin layers of barrier metals such as Au, Cr or Pd. In these tests, photoresist masks were used to contact silicon P-type slices with diffused N+ and alloyed P+ surfaces; and electrolytic Cu solution was used to build up the contact thickness to provide good cell behavior. In addition some cells with evaporated Cr-Cu contacts were also made (along with evaporated Ti-Pd-Ag contacts as controls), with the intention of subjecting cells to gradually increasing heat-treatments, to determine whether Cu causes the cells to be inherently unstable.

Iles, P. A.↗

DOE OSTI2020

Materials Data on Cr3Cu by Materials Project

Cu1Cr3 is Uranium Silicide structured and crystallizes in the cubic Pm-3m space group. The structure is three-dimensional. Cr is bonded to eight equivalent Cr and four equivalent Cu atoms to form CrCr8Cu4 cuboctahedra that share corners with twelve equivalent CrCr8Cu4 cuboctahedra, edges with eight equivalent CuCr12 cuboctahedra, edges with sixteen equivalent CrCr8Cu4 cuboctahedra, faces with four equivalent CuCr12 cuboctahedra, and faces with fourteen equivalent CrCr8Cu4 cuboctahedra. All Cr–Cr bond lengths are 2.55 Å. All Cr–Cu bond lengths are 2.55 Å. Cu is bonded to twelve equivalent Cr atoms to form CuCr12 cuboctahedra that share corners with twelve equivalent CuCr12 cuboctahedra, edges with twenty-four equivalent CrCr8Cu4 cuboctahedra, faces with six equivalent CuCr12 cuboctahedra, and faces with twelve equivalent CrCr8Cu4 cuboctahedra.

36 MATERIALS SCIENCE↗