SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Circuit cuts no-load losses, without sacrificing full-load power. Phase-contro circuit includes gate-controlled semiconductor switch that cuts off applied voltage for most of ac cycle if generator idling. Switch "on" time increases when generator is in operation.
A method for automated fabrication of flexible, electrically conductive patterns on cloth substrates has been demonstrated. Products developed using this method, or related prior methods, are instances of a technology known as 'e-textiles,' in which electrically conductive patterns ar formed in, and on, textiles. For many applications, including high-speed digital circuits, antennas, and radio frequency (RF) circuits, an e-textile method should be capable of providing high surface conductivity, tight tolerances for control of characteristic impedances, and geometrically complex conductive patterns. Unlike prior methods, the present method satisfies all three of these criteria. Typical patterns can include such circuit structures as RF transmission lines, antennas, filters, and other conductive patterns equivalent to those of conventional printed circuits. The present method overcomes the limitations of the prior methods for forming the equivalent of printed circuits on cloth. A typical fabrication process according to the present method involves selecting the appropriate conductive and non-conductive fabric layers to build the e-textile circuit. The present method uses commercially available woven conductive cloth with established surface conductivity specifications. Dielectric constant, loss tangent, and thickness are some of the parameters to be considered for the non-conductive fabric layers. The circuit design of the conductive woven fabric is secured onto a non-conductive fabric layer using sewing, embroidery, and/or adhesive means. The portion of the conductive fabric that is not part of the circuit is next cut from the desired circuit using an automated machine such as a printed-circuit-board milling machine or a laser cutting machine. Fiducials can be used to align the circuit and the cutting machine. Multilayer circuits can be built starting with the inner layer and using conductive thread to make electrical connections between layers.
A new Mixed-Signal Built-in Self-test approach that is based upon the step response of a reconfigurable (or multifunction) analog block is presented in this paper. The technique requires the overlapping step response of the Circuit Under Test (CUT) for two circuit configurations. Each configuration can be realized by changing the topology of the CUT or by sampling two CUT nodes with differing step responses. The technique can effectively detect both soft and hard faults and does not require an analog-to-digital converter (ADC) and/or digital-to-analog converter( DAC). It also does not require any precision voltage sources or comparators. The approach does not require any additional analog circuits to realize the test signal generator and a two input analog multiplexer for CUT test node sampling. The paper is concluded with the application of the proposed approach to a circuit found in the work of Epstein et a1 and two ITC 97 analog benchmark circuits.
A new Mixed-Signal Built-in self-test approach that is based upon the step response of a reconfigurable (or multifunction) analog block is presented in this paper. The technique requires the overlapping step response of the Circuit Under Test (CUT) for two circuit configurations. Each configuration can be realized by changing the topology of the CUT or by sampling two CUT nodes with differing step responses. The technique can effectively detect both soft and hard faults and does not require an analog-to-digital converter (ADC) and/or digital-to-analog converter(DAC). It also does not require any precision voltage sources or comparators. This approach does not require any additional analog circuits to realize the test signal generator and sample circuits. The paper is concluded with the application of the proposed approach to a circuit found in the work of Epstein et al and two ITC 97 analog benchmark circuits.
A method of preparation of specimens of non-electropolishable materials for analysis by atom probes is being developed as a superior alternative to a prior method. In comparison with the prior method, the present method involves less processing time. Also, whereas the prior method yields irregularly shaped and sized specimens, the present developmental method offers the potential to prepare specimens of regular shape and size. The prior method is called the method of sharp shards because it involves crushing the material of interest and selecting microscopic sharp shards of the material for use as specimens. Each selected shard is oriented with its sharp tip facing away from the tip of a stainless-steel pin and is glued to the tip of the pin by use of silver epoxy. Then the shard is milled by use of a focused ion beam (FIB) to make the shard very thin (relative to its length) and to make its tip sharp enough for atom-probe analysis. The method of sharp shards is extremely time-consuming because the selection of shards must be performed with the help of a microscope, the shards must be positioned on the pins by use of micromanipulators, and the irregularity of size and shape necessitates many hours of FIB milling to sharpen each shard. In the present method, a flat slab of the material of interest (e.g., a polished sample of rock or a coated semiconductor wafer) is mounted in the sample holder of a dicing saw of the type conventionally used to cut individual integrated circuits out of the wafers on which they are fabricated in batches. A saw blade appropriate to the material of interest is selected. The depth of cut and the distance between successive parallel cuts is made such that what is left after the cuts is a series of thin, parallel ridges on a solid base. Then the workpiece is rotated 90 and the pattern of cuts is repeated, leaving behind a square array of square posts on the solid base. The posts can be made regular, long, and thin, as required for samples for atom-probe analysis. Because of their small volume and regularity, the amount of FIB-milling time can be much less than that of the method of sharp shards. Individual posts can be broken off for mounting in a manner similar to that of the method of sharp shards. Alternatively, the posts can be left intact on the base and the base can be cut to a small square (e.g., 3 by 3 mm) suitable for mounting in an atom probe of a type capable of accepting multiple-tip specimens. The advantage of multiple-tip specimens is the possibility of analyzing many tips without the time-consuming interchange of specimens.
Abrasive jet technique, producing prototype conductor networks for thick-film hybrid microcircuits, does not require screening and fixing procedures. Pantograph engraver is used to perform abrasive cutting of the conductor network.
Circuit protects all output lines of switching regulator against overloads without requiring current sensors on every line. If overload is sensed, device short circuits bias on switching transistor so that power is rapidly cut off from loads. Circuit also includes delay network to inhibit erroneous operation during startup.
Damage to underlying layer averted. Contact of cutter blade with metal shim completes circuit that warns cutting-tool operator to stop. Tool thus prevented from cutting into structural wall.
The Mass Flowmeter is a device used to measure flow of oxygen in spacecraft's life support system. Tylan Corporation's Mass Flow Controller's major application is accurate control of reactive gases-- such as hydrogen, phosphine and silane as they are diffused at extremely high temperatures into silicon wafers. Wafers are ultimately cut up into integrated circuits or "chips" for electronic products. Precise process control afforded by the Mass Flow Controller makes it possible to produce circuit chips of greater performance at lower cost.
A hand tool has been developed for crimping leads in flexible tails that are parts of some electronic circuits -- especially some sensor circuits. The tool is used to cut the tails to desired lengths and attach solder tabs to the leads. For tailoring small numbers of circuits for special applications, this hand tool is a less expensive alternative to a commercially available automated crimping tool. The crimping tool consists of an off-the-shelf hand crimping tool plus a specialized crimping insert designed specifically for the intended application.
Cost managment as a guiding factor in optimum development of technology, and proper timing of cost-saving programs in the development of a system or technology with payoffs in development and operational advances are discussed and illustrated. Advances enhancing the performance of hardware or software advances raising productivity or reducing cost, are outlined, with examples drawn from: thermochemical thrust maximization, development of cryogenic storage tanks, improvements in fuel cells for Space Shuttle, design of a spacecraft pyrotechnic initiator, cost cutting by reduction in the number of parts to be joined, and cost cutting by dramatic reductions in circuit component number with small-scale double-diffused integrated circuitry. Program-focused supporting research and technology models are devised to aid judicious timing of cost-conscious research programs.
The Orbiter radiator system consists of eight individual 4.6 m x 3.2 m panels located with four on each payload bay door. Forward panels #1 and #2 are 2.3 cm thick while the aft panels #3 and #4 have a smaller overall thickness of 1.3 cm. The honeycomb radiator panels consist of 0.028 cm thick Aluminum 2024-T81 facesheets and Al5056-H39 cores. The face-sheets are topped with 0.005 in. (0.127 mm) silver-Teflon tape. The radiators are located on the inside of the shuttle payload bay doors, which are closed during ascent and reentry, limiting damage to the on-orbit portion of the mission. Post-flight inspections at the Kennedy Space Center (KSC) following the STS-115 mission revealed a large micrometeoroid/orbital debris (MMOD) impact near the hinge line on the #4 starboard payload bay door radiator panel. The features of this impact make it the largest ever recorded on an orbiter payload bay door radiator. The general location of the damage site and the adjacent radiator panels can be seen in Figure 2. Initial measurements of the defect indicated that the hole in the facesheet was 0.108 in. (2.74 mm) in diameter. Figure 3 shows an image of the front side damage. Subsequent observations revealed exit damage on the rear facesheet. Impact damage features on the rear facesheet included a 0.03 in. diameter hole (0.76 mm), a approx.0.05 in. tall bulge (approx.1.3 mm), and a larger approx.0.2 in. tall bulge (approx.5.1 mm) that exhibited a crack over 0.27 in. (6.8 mm) long. A large approx.1 in. (25 mm) diameter region of the honeycomb core was also damaged. Refer to Figure 4 for an image of the backside damage to the panel. No damage was found on thermal blankets or payload bay door structure under the radiator panel. Figure 5 shows the front facesheet with the thermal tape removed. Ultrasound examination indicated a maximum facesheet debond extent of approximately 1 in. (25 mm) from the entry hole. X-ray examinations revealed damage to an estimated 31 honeycomb cells with an extent of 0.85 in. x 1.1 in. (21.6 x 27.9 mm). Pieces of the radiator at and surrounding the impact site were recovered during the repair procedures at KSC. They included the thermal tape, front facesheet, honeycomb core, and rear facesheet. These articles were examined at JSC using a scanning electron microscope (SEM) with an energy dispersive x-ray spectrometer (EDS). Figure 6 shows SEM images of the entry hole in the facesheet. The asymmetric height of the lip may be attributed to projectile shape and impact angle. Numerous instances of a glass-fiber organic matrix composite were observed in the facesheet tape sample. The fibers were approximately 10 micrometers in diameter and variable lengths. EDS analysis indicated a composition of Mg, Ca, Al, Si, and O. Figures 7 and 8 present images of the fiber bundles, which were believed to be circuit board material based on similarity in fiber diameter, orientation, consistency, and composition. A test program was initiated in an attempt to simulate the observed damage to the radiator facesheet and honeycomb. Twelve test shots were performed using projectiles cut from a 1.6 mm thick fiberglass circuit board substrate panel. Results from test HITF07017, shown in figures 9 and 10, correlates with the observed impact features reasonably well. The test was performed at 4.14 km/sec with an impact angle of 45 degrees using a cylindrical projectile with a diameter and length of 1.25 mm. The fiberglass circuit board material had a density of 1.65 g/cu cm, giving a projectile mass of 2.53 mg. An analysis was performed using the Bumper code to estimate the probability of impact to the shuttle from a 1.25 mm diameter particle. Table 1 shows a 1.6% chance (impact odds = 1 in 62) of a 1.25 mm or larger MMOD impact on the radiators of the vehicle during a typical ISS mission. There is a 0.4% chance (impact odds = 1 in 260) that a 1.25 mm or larger MMOD particle would impact the RCC wing leading edge and nose cap during a typical miion. Figure 11 illustrates the vulnerable areas of the wing leading edge reinforced carbon-carbon (RCC), an area of the vehicle that is very sensitive to impact damage. The highlighted red, orange, yellow, and light green areas would be expected to experience critical damage if impacted by an OD particle such as the one that hit the RH4 radiator panel on STS-115.
The NASA/JPL 2003/2005 Mars Sample Return (MSR) Missions will each have a sample return canister that will be filled with samples cored from the surface of MARS. These spherical canisters will be 14.8 cm in diameter and must be powered only by solar cells on the surface and must communicate using RF transmission with the recovery vehicle that will be coming in 2006 or 2009 to retrieve the canister. This paper considers the aspect and conclusion that went into the design of the power system that achieves the maximum power with the minimum risk. The power output for the spherical orbiting canister was modeled and plotted in various views of the orbit by the SOAP program developed by JPL. The requirements and geometry for a solar array on a sphere are unique and place special constraints on the design. These requirements include 1) accommodating a lid for sample loading into the canister, surface area was restricted from use on the Northern pole of the spherical canister. 2) minimal cell surface coverage (maximum cell efficiency), less than 40%, for recovery vehicle to locate the canister by optical techniques. 3) a RF transmission during 50% of MARS orbit time on any spin axis, which requires optimum circuit placement of the solar cell onto the spherical canister. The best configuration would have been a 4.5 volt round cell, but in the real world we compromised with six triangular silicon cells connected in series to form a hexagon. These hexagon circuits would be mounted onto a flat facet cut into the spherical canister. The surface flats are required in order to maximize power, the surface of the cells connected in series must be at the same angle relative to the sun. The flat facets intersect each other to allow twelve circuits evenly spaced just North and twelve circuits South of the equator of the spherical canister. Connecting these circuits in parallel allows sufficient power to operate the transmitter at minimum solar exposure, Northern pole of the canister facing the sun. Additional power, as much as 20%, is also generated by the circuits facing MARS due to albedo of MARS.
Structure composed of standardized-circuit arrays reduces cost and complexity of fabricating special integrated circuits. Desired circuits are formed from basic mask, custom cuts, and contact points. Interactive computer program speeds design.
The electrician pictured is installing a General Electric Ground Fault Interrupter (GFI), a device which provides protection against electrical shock in the home or in industrial facilities. Shocks due to defective wiring in home appliances or other electrical equipment can cause severe burns, even death. As a result, the National Electrical Code now requires GFIs in all new homes constructed. This particular type of GFI employs a sensing element which derives from technology acquired in space projects by SCI Systems, Inc., Huntsville, Alabama, producer of sensors for GE and other manufacturers of GFI equipment. The sensor is based on the company's experience in developing miniaturized circuitry for space telemetry and other spacecraft electrical systems; this experience enabled SCI to package interruptor circuitry in the extremely limited space available and to produce sensory devices at practicable cost. The tiny sensor measures the strength of the electrical current and detects current differentials that indicate a fault in the functioning of an electrical system. The sensing element then triggers a signal to a disconnect mechanism in the GFI, which cuts off the current in the faulty circuit.
In recent years, some remote-sensing applications require advanced airborne multi-sensor systems to provide high performance reflective and emissive spectral imaging measurement rapidly over large areas. The key or unique problem of characteristics is associated with a black box back-end system that operates a suite of cutting-edge imaging sensors to collect simultaneously the high throughput reflective and emissive spectral imaging data with precision georeference. This back-end system needs to be portable, easy-to-use, and reliable with advanced onboard processing. The innovation of the black box backend is a miniaturized airborne imaging central server system (MAICSS). MAICSS integrates a complex embedded system of systems with dedicated power and signal electronic circuits inside to serve a suite of configurable cutting-edge electro- optical (EO), long-wave infrared (LWIR), and medium-wave infrared (MWIR) cameras, a hyperspectral imaging scanner, and a GPS and inertial measurement unit (IMU) for atmospheric and surface remote sensing. Its compatible sensor packages include NASA s 1,024 1,024 pixel LWIR quantum well infrared photodetector (QWIP) imager; a 60.5 megapixel BuckEye EO camera; and a fast (e.g. 200+ scanlines/s) and wide swath-width (e.g., 1,920+ pixels) CCD/InGaAs imager-based visible/near infrared reflectance (VNIR) and shortwave infrared (SWIR) imaging spectrometer. MAICSS records continuous precision georeferenced and time-tagged multisensor throughputs to mass storage devices at a high aggregate rate, typically 60 MB/s for its LWIR/EO payload. MAICSS is a complete stand-alone imaging server instrument with an easy-to-use software package for either autonomous data collection or interactive airborne operation. Advanced multisensor data acquisition and onboard processing software features have been implemented for MAICSS. With the onboard processing for real time image development, correction, histogram-equalization, compression, georeference, and data organization, fast aerial imaging applications, including the real time LWIR image mosaic for Google Earth, have been realized for NASA fs LWIR QWIP instrument. MAICSS is a significant improvement and miniaturization of current multisensor technologies. Structurally, it has a complete modular and solid-state design. Without rotating hard drives and other moving parts, it is operational at high altitudes and survivable in high-vibration environments. It is assembled from a suite of miniaturized, precision-machined, standardized, and stackable interchangeable embedded instrument modules. These stackable modules can be bolted together with the interconnection wires inside for the maximal simplicity and portability. Multiple modules are electronically interconnected as stacked. Alternatively, these dedicated modules can be flexibly distributed to fit the space constraints of a flying vehicle. As a flexibly configurable system, MAICSS can be tailored to interface a variety of multisensor packages. For example, with a 1,024x1,024 pixel LWIR and a 8,984x6,732 pixel EO payload, the complete MAICSS volume is approximately 7x9x11 in. (=18x23x28 cm), with a weight of 25 lb (=11.4 kg).
A coupled cavity traveling wave tube with a velocity taper, which affords beam wave resynchronization and thereby enhances is described. The wave velocity reduction is achieved by reducing the resonant frequencies of the individual resonant cavities as a function of the distance from the electron gun, through changes in internal cavity dimensions. The required changes in cavity dimensions can be accomplished by gradually increasing the cavity radius decreasing the gap length from cavity to cavity. The velocity reduction is carried out without an increase in circuit resistive losses and the upper and lower cut off frequencies are reduced in approximately the same manner.
A flexible, fabric-based circuit comprises a non-conductive flexible layer of fabric and a conductive flexible layer of fabric adjacent thereto. A non-conductive thread, an adhesive, and/or other means may be used for attaching the conductive layer to the non-conductive layer. In some embodiments, the layers are attached by a computer-driven embroidery machine at pre-determined portions or locations in accordance with a pre-determined attachment layout before automated cutting. In some other embodiments, an automated milling machine or a computer-driven laser using a pre-designed circuit trace as a template cuts the conductive layer so as to separate an undesired portion of the conductive layer from a desired portion of the conductive layer. Additional layers of conductive fabric may be attached in some embodiments to form a multi-layer construct.