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At least 19 records

Enhancing the stability of copper chromite catalysts for the selective hydrogenation of furfural with ALD overcoating (II) – Comparison between TiO2 and Al2O3 overcoatings

TiO2 atomic layer deposition (ALD) overcoatings were applied to copper chromite catalysts to increase the stability for 2-furfuraldehyde (“furfural”) hydrogenation. After overcoating, about 75% activity was preserved compared to neat copper chromite: much higher activity than an alumina ALD overcoated catalyst with a similar number of ALD cycles. The effects of ALD TiO2 on the active Cu nanoparticles were studied extensively using both in-situ TPR/isothermal-oxidation and in-situ furfural hydrogenation via Cu XAFS. The redox properties of Cu were modified only slightly by the TiO2 ALD overcoat. However, a subtle electronic interaction was observed between the TiO2 ALD layers and the Cu nanoparticles. With calcination at 500 °C the interaction between the TiO2 overcoat and the underlying catalyst is strong enough to inhibit migration and site blocking by chromite, but is sufficiently weaker than the interaction between the Al2O3 overcoat and copper chromite that it does not strongly inhibit the catalytic activity of the copper nanoparticles.

Zhang, Hongbo↗

Influence of Copper Oxidation State on the Bonding and Electronic Structure of Cobalt-Copper Complexes

Heterobimetallic complexes that pair cobalt and copper were synthesized and characterized by a suite of physical methods, including X-ray diffraction, X-ray anomalous scattering, cyclic voltammetry, magnetometry, electronic absorption spectroscopy, electron paramagnetic resonance, and quantum chemical methods. Both Cu(II) and Cu(I) reagents were independently added to a Co(II) metalloligand to provide (py 3 tren)CoCuCl (1-Cl) and (py 3 tren)CoCu(CH 3 CN) (2-CH 3 CN), respectively, where py3tren is the triply deprotonated form of N,N,N-tris(2-(2-pyridylamino)ethyl)amine. Complex 2-CH 3 CN can lose the acetonitrile ligand to generate a coordination polymer consistent with the formula “(py3tren)CoCu” (2). One-electron chemical oxidation of 2-CH 3 CN with AgOTf generated (py 3 tren)CoCuOTf (1-OTf). The Cu(II)/Cu(I) redox couple for 1-OTf and 2-CH 3 CN is reversible at -0.56 and -0.33 V vs Fc + /Fc, respectively. The copper oxidation state impacts the electronic structure of the heterobimetallic core, as well as the nature of the Co–Cu interaction. Quantum chemical calculations showed modest electron delocalization in the (CoCu) +4 state via a Co–Cu σ bond that is weakened by partial population of the Co–Cu σ antibonding orbital. By contrast, no covalent Co–Cu bonding is predicted for the (CoCu) +3 analogue, and the d-electrons are fully localized at individual metals.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Copper Outdiffusion from Copper-Plated Solar Cell Contacts during Damp Heat Exposure

Plated copper (Cu) contacts for silicon (Si) solar cells are an attractive alternative material to conventional screenprinted silver, but there are unresolved questions on the long-term integrity of plated contact structures. Here, in this work, we perform characterization on plated Cu contacts from encapsulated cells that were degraded during extended exposure to damp heat (DH) stress. First, using energy-dispersive X-ray spectroscopy, we find evidence of Cu outdiffusion upward through capping layers made of both tin and silver applied with light-induced plating, resulting in a layer of Cu on the outer contact surface. We hypothesize that if Cu is mobile in the module, it may eventually find some route by which to enter the Si cells where it can degrade performance. Subsequently, in several types of Cu-plated, DH-degraded cells, secondary ion mass spectrometry detects elevated levels of Cu at the Si surface and in the Si cell bulk, which suggests that Cu can indeed migrate from contacts into Si over the course of DH stress.

14 SOLAR ENERGY↗

Reversing Size-Dependent Trends in the Oxidation of Copper Clusters through Support Effects: Reversing Size-Dependent Trends in the Oxidation of Copper Clusters through Support Effects

Having the ability to tune the oxidation state of Cu nanoparticles is essential for their utility as catalysts. The degree of oxidation that maximizes product yield and selectivity is known to vary, depending on the particular reaction. Using first principles calculations and XANES measurements, we show that for subnanometer sizes in the gas phase, smaller Cu clusters are more resistant to oxidation. However, this trend is reversed upon deposition on an alumina support. We are able to explain this result in terms of strong cluster-support interactions, which differ significantly for the oxidized and elemental clusters. The stable cluster phases also feature novel oxygen stoichiometries. Our results suggest that one can tune the degree of oxidation of Cu catalysts by optimizing not just their size, but also the support they are deposited on.

ab initio calculations↗

Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films

Liquid-based precursors for formation of Copper Selenide, Indium Selenide, Copper Indium Diselenide, and/or copper Indium Galium Diselenide include copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent. These liquid-based precursors can be deposited in liquid form onto substrates and treated by rapid thermal processing to form crystalline copper selenide and indium selenide films.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors

Liquid-based indium selenide and copper selenide precursors, including copper-organoselenides, particulate copper selenide suspensions, copper selenide ethylene diamine in liquid solvent, nanoparticulate indium selenide suspensions, and indium selenide ethylene diamine coordination compounds in solvent, are used to form crystalline copper-indium-selenide, and/or copper indium gallium selenide films (66) on substrates (52).

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Improved synthesis and characterization of the copper Lyonsite-type compound Cu{sub 4−x}Mo{sub 3}O{sub 12}

A novel method involving a molten Ga flux for the synthesis of diffraction quality crystals of the compound Cu{sub 3.82(1)}Mo{sub 3}O{sub 12}, a copper molybdate in the Lyonsite (α-Cu{sub 3}Fe{sub 4}(VO{sub 4}){sub 6}) family, has been developed. Single-crystal X-ray diffraction data have been collected. Cu{sub 3.82(1)}Mo{sub 3}O{sub 12} crystallizes in the space group P2{sub 1}2{sub 1}2{sub 1} with cell dimensions of a=4.9972(1) Å, b=11.0259(3) Å, and c=17.4912(5) Å. Refinement of the resulting structure has enabled modeling of disorder in the channels of the structure and has indicated the localization of copper vacancies to these channel positions. Thermopower measurements indicate that Cu{sub 3.82(1)}Mo{sub 3}O{sub 12} is a rare and interesting example of a cation-deficient n-type material. - Graphical abstract: The unit cell of Cu{sub 3.82(1)}(MoO{sub 4}){sub 3} with displacement ellipsoids drawn at the 75% probability level. Cu is green, Mo is blue, O is red. Highlights: ► A repeatable method for the synthesis Cu{sub 3.82(1)}Mo{sub 3}O{sub 12} has been developed. ► Single crystals were formed from a polycrystalline sample through the use of a gallium flux. ► Thermopower measurements of Cu{sub 3.82(1)}Mo{sub 3}O{sub 12} show n-type behavior.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Identification of copper-copper and copper-hydrogen complexes in silicon

The centers formed in silicon as a result of interaction between the substitutional copper impurity (Cu{sub s}) and interstitial copper (Cu{sub i}) or hydrogen (H) atoms, which are mobile at room temperature, are investigated in this study using the deep-level transient spectroscopy (DLTS) technique. It is shown that a well-known photoluminescence center, which includes four copper atoms, is formed from Cu{sub s} via the subsequent addition of Cu{sub i}. Both intermediate complexes (Cu{sub s}-Cu{sub i} and Cu{sub s}-2Cu{sub i}) are identified by their deep levels in the lower half of the band gap. It is found that Cu{sub s} atoms form complexes with one, two, and three hydrogen atoms, with Cu{sub s}-H and Cu{sub s}-2H being electrically active. It is noted that the addition of either hydrogen or copper has a similar effect on the deep-level structure of Cu{sub s}.

36 MATERIALS SCIENCE↗

Surface energies, adhesion energies, and exfoliation energies relevant to copper-graphene and copper-graphite systems

We have generated precise values for several key energies that are relevant to Cu-graphene or Cu-graphite systems. Such systems may find technological applications that range from graphene synthesis, to condensation heat transfer, to electrical contacts to graphene, to composites. Using density functional theory, we have calculated surface energies of the three low-index faces of bulk Cu. We find that these surface energies, calculated with the PBEsol functional, are significantly higher than with the more common PBE functional and agree more closely with experiment. We have also calculated the surface energies of graphene and graphite, the exfoliation energy between graphene and graphite, and the adhesion energies between graphene or graphite and a Cu(111) slab. The adhesion energy between a carbon layer and Cu(111) is close to the exfoliation energy and cleavage energy of graphite, the four sets of values spanning a range of only 0.394–0.456 J/m2. Our results are consistent with the earlier experimental observation of three-dimensional growth of Cu on top of graphite. The energies are also used to perform a continuum Winterbottom analysis and also discrete (atomistic) variants of this analysis to predict the equilibrium shapes of Cu particles supported on graphite.

Han, Yong↗