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The bump protection hat (BPH) was subjected to impact testing in which it underwent three impacts at 35 foot-pounds of energy. The impacts generated stress cracks, but no penetration. All impacts resulted in deflections of less than one-half inch. It was shown that the BPH is qualified for Skylab and the rescue vehicle.
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The high speed aerodynamic characteristics of a family of four wing-fuselage configurations of 0, 35, 45, and 60 deg sweepback were determined from transonic bump model tests that were conducted in the Langley high speed 7 by 10 foot tunnel; sting supported model tests were conducted in the Langley 8 foot high speed tunnel and in the Langley high speed 7 by 10 foot tunnel, and rocket model tests were conducted by the Langley Pilotless Aircraft Research Division. A complementary study of the effect of Mach number gradients and streamline curvature on bump results is also included. The qualitative data obtained from the various test facilities for the wing-fuselage configurations were in essential agreement as regards the relative effects of sweepback and Mach number except for drag at zero lift. Quantitatively, important differences were present.
A high-speed wind tunnel test was conducted to determine the effect on cruise performance of installing long-duct refan-engine nacelles on the DC-8-50 and -61 models. Drag data and wing/pylon/nacelle channel pressure data are presented. At a typical cruise condition there exists a very small interference drag penalty of less than one-percent of total cruise data for the Refan installation. Pressure data indicate that some supersonic flow is present in the inboard channel of the inboard refan nacelle installation, but it is not sufficient to cause any wave drag on boundary layer separation. One pylon modification, which takes the form of pylon bumps, was tested. It resulted in a drag penalty, because its design goal of eliminating shock-related interference drag was not required and the bump thus became a source of additional parasite drag.
Color-color diagrams are used to study the set of accretion disk plus power-law models and to determine whether they can adequately fit the optical/UV continua of a sample of 34 quasars, and the soft X-ray excesses measured for seven of the sample objects by Masnou et al. (1991). The loci of pure disk models for cos theta is greater than 0 are virtually superimposed on each other regardless of cos theta, demonstrating that a given observed spectrum cannot be described by a unique combination of S and cos theta. The distributions of model and data colors are found to overlap, showing that the disk plus power-law models do fit the distribution of data colors. For six of the seven objects, the soft X-ray excesses may be fit with an accretion disk plus power-law model without requiring the assumption of super-Eddington accretion; this shows the utility of employing Kerr disks.
A 65 hp wind tunnel with a 40 mm by 240 mm airstream is described. This wind tunnel can achieve speeds in the neighborhood of the speed of sound, both subsonic and supersonic. It is useful in studying the transonic bump technique. The test section is 600 mm long. The side walls are made of transparent glass, and both the upper and lower walls are deformable, each through the use of nine jacks with elastic sleeves. So as to avoid condensation, the airstream's temperature is stabilized by an air exchanger at the temperature of the outside air. The first results for supersonic operation, the distribution of Mach numbers within the airstream between the parallel walls, the value of the use factor, and the diffuser's efficiency are all given.
A summary and analysis have been made of the results of various investigations to determine the aerodynamic characteristics of a supersonic aircraft configuration. The configuration has a wing with 40 degree sweepback at the quarter-chord line, aspect ratio 4, taper ratio 0.5, and 10-percent-thick circular-arc sections normal to the quarter-chord line. Experimental data were available for a Mach number range from 0.16 to 2.32. Results obtained from wing-flow, rocket-model, transonic-bump, and tunnel tests are presented and, where possible, are supplemented by empirical and theoretical calculations.
Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.
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Models tested in the NASA Ames 12-Foot Pressure Wind Tunnel over an angle of attack range from 0 deg to 90 deg are mounted on a floor strut that protrudes from a fairly large support bump. In high-angle-of-attack tests (angle of attack = 40 deg to 90 deg), for which the floor support was originally designed, the effects of the flow angularities produced by the bump are often negligible. This is not so for low-angle-of-attack tests (0 deg to 40 deg). Since there are no standard means for correcting test data for this bump effect, low-angle-of-attack testing with the bump is not recommended by the Ames wind-tunnel staff. This paper presents an exploratory study of a technique for correcting balance forces and experimental pressures for combined wall and bump effects. This is done by modeling the aircraft, wind-tunngl walls, and bump, with PAN AIR. The wall-and-bump-induced increments in the lift coefficient and pitching-moment coefficient predicted by PAN AIR are compared with increments obtained from the Ames 12-foot tunnel with the bump and an 8 x 12 low speed wind tunnel which has no bump.
Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.
Measurements were made on an Orion heat shield model to demonstrate the capability of the new LENS-XX expansion tunnel facility to make high quality measurements of heat transfer distributions at flow velocities from 3 km/s (h(sub 0) = 5 MJ/kg) to 8.4 km/s (h(sub 0) = 36 MJ/kg). Thirty-nine heat transfer gauges, including both thin-film and thermocouple instruments, as well as four pressure gauges, and high-speed Schlieren were used to assess the aerothermal environment on the capsule heat shield. Only results from laminar boundary layer runs are reported. A major finding of this test series is that the high enthalpy, low-density flows displayed surface heating behavior that is observed to be consistent with some finite-rate recombination process occurring on the surface of the model. It is too early to speculate on the nature of the mechanism, but the response of the gages on the surface seems generally repeatable and consistent for a range of conditions. This result is an important milestone in developing and proving a capability to make measurements in a ground test environment and extrapolate them to flight for conditions with extreme non-equilibrium effects. Additionally, no significant, isolated stagnation point augmentation ("bump") was observed in the tests in this facility. Cases at higher Reynolds number seemed to show the greatest amount of overall increase in heating on the windward side of the model, which may in part be due to small-scale particulate.
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We report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds. We bump-bonded a high-speed, low-noise InP high electron mobility transistor (HEMT) onto a separately fabricated passive circuit having a GaAs substrate. The compact bumps and small chip size were used for efficient coupling and maximum circuit design flexibility. This new quasi-monolithic millimeter-wave integrated circuit (Q-MMIC) amplifier exhibits a peak gain of 5.8 dB at approx. 90 GHz and a 3 dB bandwidth of greater than 25%. To our knowledge, this is the highest frequency amplifier assembled using bump-bonded technology. Our bump-bonding technique is a useful alternative to the high cost of monolithic millimeter-wave integrated circuits (MMIC's). Effects of the bumps on the circuit appear to be minimal. We used the simple matching circuit for demonstrating the technology - future circuits would have all of the elements (resistors, via holes, bias lines, etc.) included 'in conventional MMIC's. Our design in different from other investigators' efforts in that the bumps are only 8 microns thick by 15 microns wide. The bump sizes were sufficiently small that the devices, originally designed for W-band hybrid circuits, could be bonded without alteration. Figure 3 shows the measured and simulated magnitude of S-parameters from 85-120 GHz, of the InP HEMT bump-bonded to the low noise amplifier (LNA) passive. The maximum gain is 5.8 dB at approx. 90 GHz, and gain extends to 117 GHz. Measurement of a single device (without matching networks) shows approx. 1 dB of gain at 90 GHz. The measured gain of the amplifier agrees well with the design in the center of the measurement band, and the agreement falls off at the band edges. Since no accommodation for the bump-bonding parasitics was made in the design, the result implies that the parasitic elements associated with the bonding itself do not dominate the performance of the LNA circuit. It should be noted that this amplifier was designed for good noise performance, which is why the input and output return losses are poorer than one would expect for an amplifier simply matched for gain. However, noise performance has not been measured at this time. While the agreement between modeled vs. experimental data is not exact, the data prove that bump-bonded technology can be used for amplifiers at frequencies at least as high as 100 GHz. JPL is pursuing this technology as a way to economically and quickly incorporate the best available HEMTs into a circuit with all of the reliability and circuit design flexibility offered by MMIC technology. We are currently using the technology to fabricate 4-stage, wide-band, W-band LNA's. We have also performed pull and shear tests which show that the bump bonds are sufficiently robust for any anticipated application.
A future X-ray telescope mission like Lynx, a X-ray flagship mission concept, requires a large field of view, high energy resolution, and high spatial resolution. The Magnetic Microcalorimeter (MMC) detectors we are developing for such a mission feature a 5-arcminute field of view, approximately 100,000 pixels, each spanning 0.5–1 arcsecond. These detectors require the readout of 8,000 sensors. Three different array types have been designed to meet scientific goals, two of which utilize thermal multiplexing to reduce the number of readout channels in a scheme called “Hydra.” We are currently fabricating detectors on a recently completed buried wiring wafer with connections to every sensor. The sensors are read out using a microwave multiplexer (μMUX) with flux ramp modulation. A single μMUX can read out approximately 1,000 sensors with only two feed lines. We will report on the test of the first two-dimensional μMUX chip, consisting of 78 resonators. μMUX chips that pass screening will be directly bonded to MMC array chips using indium bump bonding. In parallel, we have tested a kinetic inductance traveling wave parametric amplifier (KI-TWPA) to amplify signals at low temperatures. The KI-TWPA exhibits extremely low internal noise, approaching the standard quantum limit. Since the energy resolution of an MMC is primarily limited by the readout system, the KI-TWPA is an ideal amplifier for MMCs with μMUX readout. We recently measured the readout noise of a μMUX with a KI-TWPA, demonstrating its capability for reading out MMC arrays. We present the design and fabrication of the latest MMC detectors, along with its readout performance.
Space toxicology greatly matured as a result of research and operations associated with the Shuttle. Materials offgassing had been a manageable concern since the Apollo days, but we learned to pay careful attention to compounds that could escape containment, to combustion events, to toxic propellants, to overuse of utility compounds, and to microbial and human metabolites. We also learned that flying real-time hardware to monitor air pollutants was a pathway with unanticipated speed bumps. Each new orbiter was tested for any excess offgassing products that could pollute the air during flight. In the late 1990s toxicologists and safety experts developed a 5-level toxicity rating system to guide containment of toxic compounds. This system is now in use aboard the International Space Station (ISS). Several combustion events during Shuttle Mir and also during Shuttle free-flight impelled toxicologists to identify hardware capable of monitoring toxic products; however, rapid adaptation of the hardware for the unique conditions of spaceflight caused unexpected missteps. Current and planned combustion analyzers would be useful to commercial partners that wish to manage the risk of health effects from thermal events. Propellants received special attention during the Shuttle program because of the possibility of bringing them into the habitable volume on extravehicular activity suits. Monitors for the airlocks were developed to mitigate this risk. Utility materials, such as lubricants, posed limited toxicological problems because water was not recovered. One clearly documented case of microbial metabolites polluting the Shuttle atmosphere was noted, and this has implications for commercial flights and control of microbes. Finally, carbon dioxide, the major human metabolite, episodically presented air quality problems aboard Shuttle, especially when nominal air flows were obstructed. Commercial vehicles must maintain robust air circulation given the anticipated high density of human occupants.
The purpose of these experiments and analysis was to augment the heating database and tools used for assessment of impact-induced shallow-cavity damage to the thermal protection system of the Space Shuttle Orbiter. The effect of length and depth on the local heating disturbance of rectangular cavities tested at hypersonic freestream conditions has been globally assessed using the two-color phosphor thermography method. These rapid-response experiments were conducted in the Langley 31-Inch Mach 10 Tunnel and were initiated immediately prior to the launch of STS-114, the initial flight in the Space Shuttle Return-To-Flight Program, and continued during the first week of the mission. Previously-designed and numerically-characterized blunted-nose baseline flat plates were used as the test surfaces. Three-dimensional computational predictions of the entire model geometry were used as a check on the design process and the two-dimensional flow assumptions used for the data analysis. The experimental boundary layer state conditions were inferred using the measured heating distributions on a no-cavity test article. Two test plates were developed, each containing 4 equally-spaced spanwise-distributed cavities. The first test plate contained cavities with a constant length-to-depth ratio of 8 with design point depth-to-boundary-layer-thickness ratios of 0.1, 0.2, 0.35, and 0.5. The second test plate contained cavities with a constant design point depth-to-boundary-layer-thickness ratio of 0.35 with length-to-depth ratios of 8, 12, 16, and 20. Cavity design parameters and the test condition matrix were established using the computational predictions. Preliminary results indicate that the floor-averaged Bump Factor (local heating rate nondimensionalized by upstream reference) at the tested conditions is approximately 0.3 with a standard deviation of 0.04 for laminar-in/laminar-out conditions when the cavity length-to-boundary-layer thickness is between 2.5 and 10 and for cavities in the depth-to-boundary-layer-thickness range of 0.3 to 0.8. Over this same range of conditions and parameters, preliminary results also indicate that the maximum Bump Factor on the cavity centerline falls between 2.0 and 2.75, as long as the cavity-exit conditions remain laminar. Cavities with length-to-boundary-layer-thickness ratio less than 2.5 can not be easily classified with this approach and require further analysis.
This document presents the full-scale analyses of the CFD RSRM. The RSRM model was developed with a 20 second burn time. The following are presented as part of the full-scale analyses: (1) RSRM embedded inclusion analysis; (2) RSRM igniter nozzle design analysis; (3) Nozzle Joint 4 erosion anomaly; (4) RSRM full motor port slag accumulation analysis; (5) RSRM motor analysis of two-phase flow in the aft segment/submerged nozzle region; (6) Completion of 3-D Analysis of the hot air nozzle manifold; (7) Bates Motor distributed combustion test case; and (8) Three Dimensional Polysulfide Bump Analysis.