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Results for “Bondline analysis”

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Laser interference structuring of Cu for adhesive joining of HVAC equipment

Due to potential energy and cost savings benefits, adhesive joining has been recently considered for heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems. HVAC adhesive bonding requires cost-effective and adequate surface preparations of adherents. Here, this article investigates the use of abrasion, traditional single-beam laser, and a laser-interference technique as surface preparations of copper surfaces. Surface morphology is characterized using scanning electron microscopy (SEM) and atomic force microscopy (AFM). Effective submicrometer peak-to-valley structuring with a periodicity of ∼2.7μ⁢m was demonstrated for laser-interference processing. Single-lap shear tests were conducted for 89 joints made with bondline thicknesses of 0.15 and 0.3 mm. Data on process variables and measured variables included open-time, bond length, maximum load, displacement at failure, shear lap strength, and failure mode. A statistical analysis was conducted on each lot to determine the lower limit with 95% confidence intervals for displacements at failure and shear lap strengths. A comparison is presented between the properties of laser-structured joints with respect to those prepared by abrasion, which is considered the baseline surface preparation technique. Based on this comparison, one single-beam laser technique and two laser-interference techniques were shown to exhibit vastly superior performance over the joints made with abraded specimens.

Sabau, Adrian S. [Oak Ridge National Laboratory (O↗
DOE OSTI2026

Mechanical Characterization of the NIF Ignition Target TMPSA Bonding Flexure

The Thermo-Mechanical Package Sub-Assembly (TMPSA) provides a critical mechanical, thermal, and electrical interface between a silicon arm and a TMP aluminum can in a NIF ignition target. During assembly, sixteen silicon pads are bonded to the aluminum using a fixture that positions the components and applies a repeatable prescribed displacement through a compliant flexure. The flexure converts fixture interference into displacement and reaction force. Because bondline thickness variation must be maintained within +/-4 µm, consistent flexure behavior is important to the assembly process. With a recent string of TMPSAs exhibiting low bond strength, the flexures were inspected. Despite being manufactured to the same specifications, flexures were found to exhibit variation in measured stiffness. Additionally, the measured stiffness values did not always follow the presumed beam mechanics model. This work addresses two questions: whether the bonding fixture is working as intended, and whether the previously made stiffness measurements are accurate representations of the use case. The flexures are analyzed using Euler-Bernoulli beam theory, measured beam dimensions, finite element analysis, and tolerance stack-up calculations. The analysis shows that the fixed-guided beam mechanics model appropriately represents the flexure during TMPSA bonding, but the chisel-tip stiffness measurement method introduces a deformation to the inner ring of the flexure that is not represented during use. The measured stiffness values should therefore be interpreted as test-condition stiffness values rather than direct measurements of operational flexure stiffness. The discrepancy is therefore attributed primarily to the measurement boundary condition rather than to failure of the fixed-guided beam model. Recommendations are provided for GD&T, dimensional inspection, and a representative stiffness testing method to better control bondline variation.

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