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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

Solid state thermal control for spacecraft

The steady-state heat-pumping capabilities of thermoelectric devices are examined for spacecraft in earth orbit, using a simple model. Thermoelectric parameters for a standard Bi2Te, alloy are fitted with fourth-order polynomials in temperature. Parameters are used which are the average for the temperature difference across the p-n couple. Internal spacecraft temperatures are varied from 270 to 330 K, and absorbed incident radiation fluxes are varied from zero to 700 W per sq m. It is found that heat rejection can be optimized with respect to thermoelectric device and radiator fin geometries, as well as with respect to input electrical power and that these devices are most useful on the surfaces with highest incident radiant power. Maximum heat fluxes which can be pumped out of the spacecraft are on the order of 50-160 W per sq m for the various thermal environments examined. Input electrical powers corresponding to these maximum heat fluxes range from about 50-300 W per sq m. However, efficiency is greatly improved by operation at lower input-power levels.

Harpster, J. W. C.↗
NASA NTRS2000

Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition

Advanced thermoelectric microdevices integrated into thermal management packages and low power, electrical source systems are of interest for a variety of space and terrestrial applications. By shrinking the size of the thermoelements, or legs, of these devices, it becomes possible to handle much higher heat fluxes, as well as operate at much lower currents and higher voltages that are more compatible with electronic components. The miniaturization of state-of-the-art thermoelectric module technology based on Bi2Te3 alloys is limited due to mechanical and manufacturing constraints for both leg dimensions (100-200 gm thick minimum) and the number of legs (100-200 legs maximum). We are investigating the development of novel microdevices combining high thermal conductivity substrate materials such as diamond, thin film metallization and patterning technology, and electrochemical deposition of thick thermoelectric films. It is anticipated that thermoelectric microcoolers with thousands of thermocouples and capable of pumping more than 200 W/sq cm over a 30 to 60 K temperature difference can be fabricated. In this paper, we report on our progress in developing an electrochemical deposition process for obtaining 10-50 microns thick films of Bi2Te3 and its solid solutions. Results presented here indicate that good quality n-type Bi2Te3, n-type Bi2Te(2.95)Se(0.05) and p-type Bi(0.5)Sb(1.5)Te3 thick films can be deposited by this technique. Some details about the fabrication of the miniature thermoelements are also described.

Fleurial, J.-P.↗