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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Development of Quantum Computing Interconnect Based on Aerosol Jet Printing and Electrochemical Deposition of Rhenium

The electrodeposition of rhenium on to a metal seed layer on flexible substrates is presented as a means to creating superconducting flexible cable connectors in an enabling plug-and-play approach for quantum computing. Cryogenic quantum electronics are currently connected using masses of stainless-steel coaxial cables that are bulky, rigid - both in form and design - and lead to significant joule heating, thermal noise, and cross talk. Here, we present an unprecedented approach to integrate an aerosol jet printed (AJP) metal seed layer with rhenium electrodeposition on a flexible substrate in the advancement of superconducting interconnect technologies. Silver and gold were printed using the ‘Nanojet’ aerosol jet printer on Kapton films. Adhesion of gold was found to be far superior to that of silver and adhesion on roughened Kapton surpassed that of its smooth counterpart. Electrodeposition of rhenium was successful on both silver and gold and an amorphous Re film was confirmed by XRD. Results for both materials are presented however due to the poor adhesion of silver to Kapton it was ruled out as a viable candidate. Composite materials were characterized by profilometry, EDS, XRD and FIBSEM. Electrical measurements of the composite at ambient temperature showed a critical temperature (T c ), where the resistance drops to 0, of 5.8 K, well above 4.2 K, the temperature of liquid helium. Stress-strain tests of the Ag-Re and Au-Re composites on roughened and smooth Kapton were completed. Cyclic flexure testing (200 cycles) to 1.25% strain showed smooth Kapton samples reach a stress of ~16 MPa, while Kapton roughened with sandpaper, reaches ~20MPa of stress for the same 1.25% strain.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Materials Data on ReAu3 by Materials Project

ReAu3 is alpha bismuth trifluoride structured and crystallizes in the tetragonal I4/mmm space group. The structure is three-dimensional. Re3+ is bonded to twelve Au1- atoms to form ReAu12 cuboctahedra that share corners with four equivalent ReAu12 cuboctahedra, corners with twenty-four AuRe4Au4 cuboctahedra, edges with eight equivalent ReAu12 cuboctahedra, edges with eight equivalent AuRe4Au4 cuboctahedra, faces with four equivalent ReAu12 cuboctahedra, and faces with six equivalent AuRe4Au8 cuboctahedra. There are eight shorter (2.86 Å) and four longer (2.98 Å) Re–Au bond lengths. There are two inequivalent Au1- sites. In the first Au1- site, Au1- is bonded to four equivalent Re3+ and four equivalent Au1- atoms to form distorted AuRe4Au4 cuboctahedra that share corners with eight equivalent ReAu12 cuboctahedra, corners with sixteen AuRe4Au4 cuboctahedra, edges with four equivalent ReAu12 cuboctahedra, edges with sixteen AuRe4Au4 cuboctahedra, and faces with six equivalent AuRe4Au4 cuboctahedra. All Au–Au bond lengths are 2.86 Å. In the second Au1- site, Au1- is bonded to four equivalent Re3+ and eight equivalent Au1- atoms to form AuRe4Au8 cuboctahedra that share corners with eight equivalent ReAu12 cuboctahedra, corners with twenty AuRe4Au4 cuboctahedra, edges with sixteen AuRe4Au4 cuboctahedra, faces with four equivalent AuRe4Au8 cuboctahedra, and faces with six equivalent ReAu12 cuboctahedra.

36 MATERIALS SCIENCE↗