Engineering PapersSearch

SEARCH · Engineering Papers

Results for “ADHESION”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records

Debonding-on-demand reversible adhesives via heat or light with competitive adhesion strength to conventional epoxy adhesives

Stimuli responsive debonding-on-demand (DoD) reversible adhesives are of great interest for the circular economy. However, the reversible adhesives developed so far often lack competitive adhesion strength in a bonding state. In this work, reversible epoxy adhesives based on Diels–Alder (DA) chemistry were developed and exhibited a competitive adhesion strength (e.g., 12 – 16 MPa of a lap shear strength) to commercial non-reversible epoxy adhesives. The reversible epoxy formulation showed superior thermal stability up to 110°C, and transition to a debonding state in the order of 0.1 MPa at 140°C, consequently, an on/off-type debonding behavior. The transition to a debonding state was attributed to crosslinking density control (e.g., decrease by 33% – 49%) through the reversible DA chemistry and the proximity to the glass transition. Next, for debonding by light stimulus, photothermal refractory plasmonic titanium nitride (TiN) nanoparticles were incorporated in the reversible epoxy, which can generate the required heat for debonding upon exposure to visible light. Photothermal debonding allows for precise debonding at target areas and tunable adhesion strength by controlling the exposure area and light intensity. The DA adhesive formulations containing 0.5 wt.% TiN nanoparticles presented a debonding state with zero adhesion under light exposure with intensity of 1670 mW/cm 2 (inducing 140°C). Even after three cycles of reattachment, the DA adhesive formulations retained 96% of the pristine sample’s adhesion strength measured at 110°C. Therefore, the DA adhesives are attractive candidates as reversible DoD systems applicable in higher temperatures.

42 ENGINEERING

Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

This paper studied the evolution of air voids at the substrate-adhesive interface during the curing and bonding process of an epoxy-based adhesive between two glass substrates due to the sequence of adhesive placement, external pressure, and plasma treatment on substrates for bonding. The experimental results showed that a higher quantity of interfacial voids were generated during adhesive curing when the substrate was attached to the adhesive compared to when the adhesive was applied and distributed on the substrate. Such interfacial voids can be efficiently removed or reduced by applying slight pressure on the bonded structure during adhesive curing, or by leveraging plasma-treated substrates, as less reported in the literature. This work provided practical suggestions for preparing adhesive joints with minimized interfacial air voids to enhance bonding performance, particularly for dissimilar joints such as metal-CFRTP (carbon-fiber-reinforced thermoplastic polymer), as well as combinations with different types of polymer composites.

Qiao, Yao [BATTELLE (PACIFIC NW LAB)] (ORCID:00000

Temperature Effects on Adhesive Bond Strengths and Modulus for Commonly Used Spacecraft Structural Adhesives

A study was performed to observe how changes in temperature and substrate material affected the strength and modulus of an adhesive bondline. Seven different adhesives commonly used in aerospace bonded structures were tested. Aluminum, titanium and Invar adherends were cleaned and primed, then bonded using the manufacturer's recommendations. Following surface preparation, the coupons were bonded with the adhesives. The single lap shear coupons were then pull tested per ASTM D 1002 Standard Test Method for Apparent Shear Strength of Single- Lap-Joint over a temperature range from -150 deg C up to +150 deg C. The ultimate strength was calculated and the resulting data were converted into B-basis design allowables. Average and Bbasis results were compared. Results obtained using aluminum adherends are reported. The effects of using different adherend materials and temperature were also studied and will be reported in a subsequent paper. Dynamic Mechanical Analysis (DMA) was used to study variations in adhesive modulus with temperature. This work resulted in a highly useful database for comparing adhesive performance over a wide range of temperatures, and has facilitated selection of the appropriate adhesive for spacecraft structure applications.

structural adhesives testing

Application of strain gages to measure adhesive strains through the thickness of an adhesively-bonded stiffened strip

The purpose of the study is to measure the through-the-thickness strain distribution in an adhesively bonded stiffened strip subject to four-point bending and to compare the distribution with predicted results. Small-strain gages are used for measuring the normal strain in the adhesive layer of the strip. A total of 16 120-ohm encapsulated strain gages were mounted on the adhesive layer, and the specimen was loaded quasi-statistically and never to failure. Both the experimental and analytical results show good correlation and, in particular, a high strain gradient acting near the edge of the adhesive layer.

Lopez, O. F.

In-Situ Ice Adhesion Testing using the Deformed Skin Adhesion Test

There exists a plethora of ice adhesion testing methods such as centrifuge-based methods, push/pull methods, and lap joint shear tests. However, these methods often cannot be done in-situ during an icing spray and require researcher handling/preparation prior to testing. Additionally, many of these methods test ice accretions that are not representative of the ice shapes that grow on airframes which can have unintended consequences such as edge or corner stress concentrations. In order to mitigate the issues present with other ice adhesion tests a novel, hands-free, in-situ test method imbedded into the leading edge of the airfoil has been developed and tested in the NASA Glenn Research Center Icing Research Tunnel. The mechanics of the new test method are discussed with finite element simulations being used to highlight the fundamental mechanics of this test method. The testing procedures used during the experimental test campaign are discussed along with the icing cloud test matrix. Analysis of the force-displacement results highlights the repeatability of the test method with regards to both sample behavior across several days of testing and different ice shapes. The results from first run of the day showed a significant discrepancy from subsequent runs and differential image analysis was used to determine differences in the interfacial bonding states between runs.

Ice Adhesion

In-Situ Ice Adhesion Testing using the Deformed Skin Adhesion Test

There exists a plethora of ice adhesion testing methods such as centrifuge-based methods, push/pull methods, and lap joint shear tests. However, these methods often cannot be done in-situ during an icing spray and require researcher handling/preparation prior to testing. Additionally, many of these methods test ice accretions that are not representative of the ice shapes that grow on airframes which can have unintended consequences such as edge or corner stress concentrations. In order to mitigate the issues present with other ice adhesion tests a novel, hands-free, in-situ test method imbedded into the leading edge of the airfoil has been developed and tested in the NASA Glenn Research Center Icing Research Tunnel. The mechanics of the new test method are discussed with finite element simulations being used to highlight the fundamental mechanics of this test method. The testing procedures used during the experimental test campaign are discussed along with the icing cloud test matrix. Analysis of the force-displacement results highlights the repeatability of the test method with regards to both sample behavior across several days of testing and different ice shapes. The results from first run of the day showed a significant discrepancy from subsequent runs and differential image analysis was used to determine differences in the interfacial bonding states between runs.

Ice Adhesion

Modified Surface Having Low Adhesion Properties to Mitigate Insect Residue Adhesion

A process to modify a surface to provide reduced adhesion surface properties to mitigate insect residue adhesion. The surface may include the surface of an article including an aircraft, an automobile, a marine vessel, all-terrain vehicle, wind turbine, helmet, etc. The process includes topographically and chemically modifying the surface by applying a coating comprising a particulate matter, or by applying a coating and also topographically modifying the surface by various methods, including but not limited to, lithographic patterning, laser ablation and chemical etching, physical vapor phase deposition, chemical vapor phase deposition, crystal growth, electrochemical deposition, spin casting, and film casting.

Wohl, Christopher J., Jr.

Urethane/Silicone Adhesives for Bonding Flexing Metal Parts

Adhesives that are blends of commercially available urethane and silicone adhesives have been found to be useful for bonding metal parts that flex somewhat during use. These urethane/silicone adhesives are formulated for the specific metal parts to be bonded. The bonds formed by these adhesives have peel and shear strengths greater than those of bonds formed by double-sided tapes and by other adhesives, including epoxies and neat silicones. In addition, unlike the bonds formed by epoxies, the bonds formed by these adhesives retain flexibility. In the initial application for which the urethane/silicone adhesives were devised, there was a need to bond spring rings, which provide longitudinal rigidity for inflatable satellite booms, with the blades that provide the booms axial strength. The problem was to make the bonds withstand the stresses, associated with differences in curvature between the bonded parts, that arose when the booms were deflated and the springs were compressed. In experiments using single adhesives (that is, not the urethane/ silicone blends), the bonds were broken and, in each experiment, it was found that the adhesive bonded well with either the ring or with the blade, but not both. After numerous experiments, the adhesive that bonded best with the rings and the adhesive that bonded best with the blades were identified. These adhesives were then blended and, as expected, the blend bonded well with both the rings and the blades. The two adhesives are Kalex (or equivalent) high-shear-strength urethane and Dow Corning 732 (or equivalent) silicone. The nominal mixture ratio is 5 volume parts of the urethane per 1 volume part of the silicone. Increasing the proportion of silicone makes the bond weaker but more flexible, and decreasing the proportion of silicone makes the bond stronger but more brittle. The urethane/silicone blend must be prepared and used quickly because of the limited working time of the urethane: The precursor of the urethane adhesive is supplied in a two-part form, comprising a resin and a hardener that must be mixed. The resulting urethane adhesive has a working time of 3 to 5 minutes. To prepare the urethane/silicone blend, one must quickly add the silicone to the urethane adhesive and mix it in thoroughly within the working time of the urethane. Once the urethane/silicone blend has been mixed and applied to the bond surfaces, it takes about 2 hours for the adhesive to cure under pressure. However, it takes about 24 hours for the adhesive to reach full strength.

Edwards, Paul D.

Thermal Characterization of Adhesive

The current Space Shuttle Reusable Solid Rocket Motor (RSRM) nozzle adhesive bond system is being replaced due to obsolescence. Down-selection and performance testing of the structural adhesives resulted in the selection of two candidate replacement adhesives, Resin Technology Group's Tiga 321 and 3M's EC2615XLW. This paper describes rocket motor testing of these two adhesives. Four forty-pound charge motors were fabricated in configurations that would allow side by side comparison testing of the candidate replacement adhesives and the current RSRM adhesives. The motors provided an environment where the thermal performance of adhesives in flame surface bondlines was compared. Results of the FPC testing show that: 1) The phenolic char depths on radial bond lines is approximately the same and vary depending on the position in the blast tube regardless of which adhesive was used; 2) The adhesive char depth of the candidate replacement adhesives is less than the char depth of the current adhesives; 3) The heat-affected depth of the candidate replacement adhesives is less than the heat-affected depth of the current adhesives; and 4) The ablation rates for both replacement adhesives are slower than that of the current adhesives.

Spomer, Ken A.