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At least 1,765 records · Page 98

Low Temperature Creep of Hot-Extruded Near-Stoichiometric NiTi Shape Memory Alloy: Effect of Thermal Cycling - Part 2

This paper is the first report on the effect prior low temperature creep on the thermal cycling behavior of NiTi. The isothermal low temperature creep behavior of near-stoichiometric NiTi between 300 and 473 K was discussed in Part I. The effect of temperature cycling on its creep behavior is reported in the present paper (Part II). Temperature cycling tests were conducted between either 300 or 373 K and 473 K under a constant applied stress of either 250 or 350 MPa with hold times lasting at each temperature varying between 300 and 700 h. Each specimen was pre-crept either at 300 or at 473 K for several months under an identical applied stress as that used in the subsequent thermal cycling tests. Irrespective of the initial pre-crept microstructures, the specimens exhibited a considerable increase in strain with each thermal cycle so that the total strain continued to build-up to 15 to 20 percent after only 5 cycles. Creep strains were immeasurably small during the hold periods. It is demonstrated that the strains in the austenite and martensite are linearly correlated. Interestingly, the differential irrecoverable strain, in the material measured in either phase decreases with increasing number of cycles, similar to the well-known Manson-Coffin relation in low cycle fatigue. Both phases are shown to undergo strain hardening due to the development of residual stresses. Plots of true creep rate against absolute temperature showed distinct peaks and valleys during the cool-down and heat-up portions of the thermal cycles, respectively. Transformation temperatures determined from the creep data revealed that the austenitic start and finish temperatures were more sensitive to the pre-crept martensitic phase than to the pre-crept austenitic phase. The results are discussed in terms of a phenomenological model, where it is suggested that thermal cycling between the austenitic and martensitic phase temperatures or vice versa results in the deformation of the austenite and a corresponding development of a back stress due to a significant increase in the dislocation density during thermal cycling.

Raj, S. V.↗

Evolution of Archival Storage (from Tape to Memory)

Over the last three decades, there has been a significant evolution in storage technologies supporting archival of remote sensing data. This section provides a brief survey of how these technologies have evolved. Three main technologies are considered - tape, hard disk and solid state disk. Their historical evolution is traced, summarizing how reductions in cost have helped being able to store larger volumes of data on faster media. The cost per GB of media is only one of the considerations in determining the best approach to archival storage. Active archives generally require faster response to user requests for data than permanent archives. The archive costs have to consider facilities and other capital costs, operations costs, software licenses, utilities costs, etc. For meeting requirements in any organization, typically a mix of technologies is needed.

Magnetic Storage; Technology Evolution↗

Effect of Temperature on the Deformation Behavior of B2 Austenite in a Polycrystalline Ni49.9Ti50.1 (at.Percent) Shape Memory Alloy

Superelasticity in austenitic B2-NiTi is of great technical interest and has been studied in the past by several researchers [1]. However, investigation of temperature dependent deformation in B2-NiTi is equally important since competing mechanisms of stress-induced martensite (SIM), retained martensite, plastic and deformation twinning can lead to unusual mechanical behaviors. Identification of the role of various mechanisms contributing to the overall deformation response of B2-NiTi is imperative to understanding and maturing SMA-enabled technologies. Thus, the objective of this work was to study the deformation of polycrystalline Ni49.9Ti50.1 (at. %) above A(sub f) (105 C) in the B2 state at temperatures between 165-440 C, and generate a B2 deformation map showing active deformation mechanisms in different temperature-stress regimes.

Garg, A.↗

DDR Memories

This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.

Double Data Rate (DDR)↗

Double Data Rate (DDR) Memory Devices

This presentation will include information about Double Data Rate (DDR) technology, NASA Electronic Parts and Packaging (NEPP) tasks and their purpose, collaborations, a roadmap, NEPP partners, results to date, and future plans.

NASA Electronic Parts and Packaging (NEPP) Program↗

Near-Field Heat Transfer Enabled Nanothermomechanical Memory and Logic Devices

A thermomechanical memory/logic device is disclosed. In embodiments, the thermomechanical device includes a first thermally controlled terminal (e.g., hot terminal); a second thermally controlled terminal (e.g., cool terminal/base); a stem or other structure that can be thermally expanded connected to the cool terminal; and a thermal conductive head coupled to the stem. The head can exchange heat with the hot terminal. The stem and head are between the first thermally controlled terminal and the second thermally controlled terminal, wherein the stem expands or contracts in response to heat absorbed or given off by the thermal conductive head, causing the head to move towards the first thermally controlled terminal or towards the second thermally controlled terminal until a stable state is reached. For example, bistable thermal states can be used to implement logic states (e.g., ZERO or ONE states).

Ndao, Sidy↗

Shape Memory Alloy (SMA) Tires - A New Paradigm in Tire Performance

Tires for rover applications have had to deal with numerous challenges, risking mission failure and significantly increasing costs associated with missions. As a result, a new tire technology has been developed to overcome all of the limitations with the current approach. This presentation will highlight how this new technology has changed the paradigm for NASA's mission and will provide a glimpse at terrestrial applications where this technology may provide advantage.

Spring↗

Single Event Testing of SDRAM, DDR2 and DDR3 Memories

SEE test results are presented for SDRAM, DDR2, and DDR3. No tested devices exhibited SEL. SBUs were observed, but no MBUs were observed in data words. SEFI data were taken at low and high speed.

Guertin, Steven M.↗

Explicit IMF B(sub y)-Effect Maximizes at Subauroral Latitudes (Dedicated to the Memory of Eigil Friis-Christensen)

The most important parameter in the coupling between solar wind and geomagnetic activity is the B(sub z)‐component of the interplanetary magnetic field (IMF). However, recent studies have shown that IMF B(sub y) is an additional, independent driver of geomagnetic activity. We use here local geomagnetic indices from a large network of magnetic stations to study how IMF B(sub y) affects geomagnetic activity at different latitudes for all solar wind and, separately, during coronal mass ejections. We show that geomagnetic activity, for all solar wind, is 20% stronger for B(sub y) > 0 than for B(sub y) < 0 at subauroral latitudes of about 60° corrected geomagnetic latitude. During coronal mass ejections, the B(sub y)‐effect is larger, about 40%, at slightly lower latitudes of about 57° (corrected geomagnetic) latitude. These results highlight the importance of the IMF B(sub y)‐component for space weather at different latitudes and must be taken into account in space weather modeling

Holappa, L.↗