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At least 1,747 records · Page 97
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Solar cell and I.C. aspects of ingot-to-slice mechanical processing

Intensive efforts have been put into the growth of silicon crystals to suit today's solar cell and integrated circuit requirements. Each step of processing the crystal must also receive concentrated attention to preserve the grown-in perfection and to provide a suitable device-ready wafer at reasonable cost. A comparison is made between solar cell and I.C. requirements on the mechanical processing of silicon from ingot to wafer. Specific defects are described that can ruin the slice or can possibly lead to device degradation. These include grinding cracks, saw exit chips, crow's-foot fractures, edge cracks, and handling scratches.

Dyer, L. D.↗
NASA NTRS1985

Total-dose radiation effects data for semiconductor devices: 1985 supplement, volume 1

Steady-state, total-dose radiation test data are provided, in graphic format, for use by electronic designers and other personnel using semiconductor devices in a radiation environment. The data were generated by JPL for various NASA space programs. The document is in two volumes: Volume 1 provides data on diodes, bipolar transistors, field effect transistors, and miscellaneous semiconductor types, and Volume 2 provides total-dose radiation test data on integrated circuits. Volume 1 of this 1985 Supplement contains new total-dose radiation test data generated since the August 1, 1981 release date of the original Volume 1. Publication of Volume 2 of the 1985 Supplement will follow that of Volume 1 by approximately three months.

Martin, K. E.↗
NASA NTRS1985

Design considerations for a gas microcontroller

This paper discusses some of the design problems that we are now addressing in considering a microcontroller for our upcoming GAS payload. We will be using microcontrollers to run our experiments and collect and store the data from those experiments. microcontroller are to be small , lightweight, have low power consumption, and high reliability. This paper will discuss some of the solutions that we have developed to meet these design requirements. still in the design stage and our final design may change from what we have now. We are continuing to look for new integrated circuits that will do what we need all in one package.

Douglas A. Ritter↗
NASA NTRS1985

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification.

Buehler, M. G.↗
NASA NTRS1985

JMOSFET: A MOSFET parameter extractor with geometry-dependent terms

The parameters from metal-oxide-silicon field-effect transistors (MOSFETs) that are included on the Combined Release and Radiation Effects Satellite (CRRES) test chips need to be extracted to have a simple but comprehensive method that can be used in wafer acceptance, and to have a method that is sufficiently accurate that it can be used in integrated circuits. A set of MOSFET parameter extraction procedures that are directly linked to the MOSFET model equations and that facilitate the use of simple, direct curve-fitting techniques are developed. In addition, the major physical effects that affect MOSFET operation in the linear and saturation regions of operation for devices fabricated in 1.2 to 3.0 mm CMOS technology are included. The fitting procedures were designed to establish single values for such parameters as threshold voltage and transconductance and to provide for slope matching between the linear and saturation regions of the MOSFET output current-voltage curves. Four different sizes of transistors that cover a rectangular-shaped region of the channel length-width plane are analyzed.

Buehler, M. G.↗
NASA NTRS1985

Fault models

A major problem in the qualification of integrated circuit cells and in the development of adequate tests for the circuits is to lack of information on the nature and density of fault models. Some of this information is being obtained from the test structures. In particular, the Pinhole Array Capacitor is providing values for the resistance of gate oxide shorts, and the Addressable Inverter Matrix is providing values for parameter distributions such as noise margins. Another CMOS fault mode, that of the open-gated transistor, is examined and the state of the transistors assessed. Preliminary results are described for a number of open-gated structures such as transistors, inverters, and NAND gates. Resistor faults are applied to various CMOS gates and the time responses are noted. The critical value for the resistive short to upset the gate response was determined.

Sayah, H. R.↗
NASA NTRS1985

Summary of process research analysis efforts

A summary of solar-cell process research analysis efforts was presented. Process design and cell design are interactive efforts where technology from integrated circuit processes and other processes are blended. The primary factors that control cell efficiency are: (1) the bulk parameters of the available sheet material, (2) the retention and enhancement of these bulk parameters, and (3) the cell design and the cost to produce versus the finished cells performance. The process sequences need to be tailored to be compatible with the sheet form, the cell shape form, and the processing equipment. New process options that require further evaluation and utilization are lasers, robotics, thermal pulse techniques, and new materials. There are numerous process control techniques that can be adapted and used that will improve product uniformity and reduced costs. Two factors that can lead to longer life modules are the use of solar cell diffusion barriers and improved encapsulation.

Burger, D. R.↗
NASA NTRS1986

MMIC devices for active phased array antennas

The use of finlines for microwave monolithic integrated circuit application in the 20 to 40 GHz frequency range. Other wave guiding structures, are also examined from a comparative point of view and some sonclusions are drawn on the basis of the results.

Mittra, R.↗
NASA NTRS1985

Endfire tapered slot antennas on dielectric substrates

Endfire-tapered slot antennas are suitable for many integrated circuit applications, imaging and phased arrays. An investigation of single elements of such antennas, including slots which are exponentially tapered (Vivaldi), linearly tapered, and constant width. For antennas of all types, a good general agreement is obtained for curves of beamwidth-versus-length, normalized to wavelength, when one compares the data with that for traveling-wave antennas published by Zucker (1961). An important condition for this agreement is that the effective dielectric thickness, defined in the text, is in a certain optimum range. This condition is qualitatively explained in terms of the theory for traveling-wave antennas.

Yngvesson, K. S.↗
NASA NTRS1984

The baseband processor in future satellite communication systems

This paper provides a description of a baseband processor planned for satellite communication systems operating in Ka band. The satellite based interconnection of individual earth terminals is described in terms of uplink and downlink message formats, and the on-board processing signal flow. Advanced technology requirements and developments are reviewed including current activity in custom large scale integrated circuit development.

Thomas, R. E.↗
NASA NTRS1986

Technology achievements and projections for communication satellites of the future

Multibeam systems of the future using monolithic microwave integrated circuits to provide phase control and power gain are contrasted with discrete microwave power amplifiers from 10 to 75 W and their associated waveguide feeds, phase shifters and power splitters. Challenging new enabling technology areas include advanced electrooptical control and signal feeds. Large scale MMIC's will be used incorporating on chip control interfaces, latching, and phase and amplitude control with power levels of a few watts each. Beam forming algorithms for 80 to 90 deg wide angle scanning and precise beam forming under wide ranging environments will be required. Satellite systems using these dynamically reconfigured multibeam antenna systems will demand greater degrees of beam interconnectivity. Multiband and multiservice users will be interconnected through the same space platform. Monolithic switching arrays operating over a wide range of RF and IF frequencies are contrasted with current IF switch technology implemented discretely. Size, weight, and performance improvements by an order of magnitude are projected.

Bagwell, J. W.↗
NASA NTRS1987

Local Data Processing for a Robot Hand

Integrated-circuit microcomputers process signals among sensors, external controls, and end-effector motor. Multiple-microprocessor system within end effector of remote manipulator accepts data from sensors in end effector, commumnicates with external control system, and controls end-effector motor. External system includes central control computer (which interacts with operator) and display. Local dataprocessing system in end effector relieves external control system of some of its computational load and minimizes data communication load with external higher level controller.

Bejczy, A. K.↗
NASA NTRS1987

Growing Single Crystals of Compound Semiconductors

Defect reduced by preventing melt/furnace contact and suppressing convention. Large crystals of compound semiconductors with few defects grown by proposed new method. Such materials as gallium arsenide and cadmium telluride produced, with quality suitable for very-large-scale integrated circuits or for large focal-plane arrays of photodetectors. Method used on small scale in Earth gravity, but needs microgravity to provide crystals large enough for industrial use.

Naumann, Robert J.↗
NASA NTRS1987

Hot-Gas Nozzle for Desoldering Leadless IC's

Simple hand-held tool removes leadless, surface-mounted integrated circuits (IC's) from printed-circuit boards. Nozzle used with hot-air gun of type used to apply heat-shrink tubing or with some other source of hot gas. Rectangular end of nozzle and deflector shape airflow pattern to concentrate heat directly on soldering pads located around edge of IC's to heat them quickly and uniformly.

Hanlon, Mark T.↗
NASA NTRS1986

A design concept for an MMIC microstrip phased array

A conceptual design for a microstrip phased array with monolithic microwave integrated circuit (MMIC) amplitude and phase controls is described. The MMIC devices used are 20 GHz variable power amplifiers and variable phase shifters recently developed by NASA contractors for applications in future Ka band advanced satellite communication antenna systems. The proposed design concept is for a general NxN element array of rectangular lattice geometry. Subarray excitation is incorporated in the MMIC phased array design to reduce the complexity of the beam forming network and the number of MMIC components required. The proposed design concept takes into consideration the RF characteristics and actual phyical dimensions of the MMIC devices. Also, solutions to spatial constraints and interconnections associated with currently available packaging designs are discussed. Finally, the design of the microstrip radiating elements and their radiation characteristics are examined.

Lee, R. Q.↗
NASA NTRS1986

Swept frequency technique for dispersion measurement of microstrip lines

Microstrip lines used in microwave integrated circuits are dispersive. Because a microstrip line is an open structure, the dispersion can not be derived with pure TEM, TE, or TM mode analysis. Dispersion analysis has commonly been done using a spectral domain approach, and dispersion measurement has been made with high Q microstrip ring resonators. Since the dispersion of a microstrip line is fully characterized by the frequency dependent phase velocity of the line, dispersion measurement of microstrip lines requires the measurement of the line wavelength as a function of frequency. In this paper, a swept frequency technique for dispersion measurement is described. The measurement was made using an automatic network analyzer with the microstrip line terminated in a short circuit. Experimental data for two microstrip lines on 10 and 30 mil Cuflon substrates were recorded over a frequency range of 2 to 20 GHz. Agreement with theoretical results computed by the spectral domain approach is good. Possible sources of error for the discrepancy are discussed.

Lee, R. Q.↗
NASA NTRS1986

Small computer interface to a stepper motor

A Commodore VIC-20 computer has been interfaced with a stepper motor to provide an inexpensive stepper motor controller. Only eight transistors and two integrated circuits compose the interface. The software controls the parallel interface of the computer and provides the four phase drive signals for the motor. Optical sensors control the zeroing of the 12-inch turntable positioned by the controller. The computer calculates the position information and movement of the table and may be programmed in BASIC to execute automatic sequences.

Berry, Fred A., Jr.↗
NASA NTRS1986

Physics through the 1990s: Scientific interfaces and technological applications

The volume examines the scientific interfaces and technological applications of physics. Twelve areas are dealt with: biological physics-biophysics, the brain, and theoretical biology; the physics-chemistry interface-instrumentation, surfaces, neutron and synchrotron radiation, polymers, organic electronic materials; materials science; geophysics-tectonics, the atmosphere and oceans, planets, drilling and seismic exploration, and remote sensing; computational physics-complex systems and applications in basic research; mathematics-field theory and chaos; microelectronics-integrated circuits, miniaturization, future trends; optical information technologies-fiber optics and photonics; instrumentation; physics applications to energy needs and the environment; national security-devices, weapons, and arms control; medical physics-radiology, ultrasonics, MNR, and photonics. An executive summary and many chapters contain recommendations regarding funding, education, industry participation, small-group university research and large facility programs, government agency programs, and computer database needs.

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