SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Hand-operated die set bends, without damage, electrical component leads to perfectly match holes in printed circuit board. This tool speeds up printed circuit fabrication and reduces the number of component rejections.
Sensitive electronic components are enclosed in wire mesh for protection. The wire mesh isolates the component from shock and vibration. It acts as a heat sink and as a screen against RF interference.
Test probe, in conjunction with standard equipment, tests axial-lead electronic components in their original packages. The probe can be modified to test any electronic component with automatic or nonautomatic equipment.
Interferometer with rigidly mounted components assures parallelism of critical components. The interferometer is constructed for effective operation even if the total instrument is subjected to mechanical stress.
Spring clamp fixture holds small electronic components in a desired position while they are being soldered on a circuit board. The spring clamp is clipped on the edge of the circuit board and an adjustable spring-steel boom holds components against the board. The felt pad at the end of the boom is replaced with different attachments for other holding tasks.
Body-fitted restraint harness enables workers to safely and conveniently handle critical components during their installation or removal. Since the harness supports the components, the worker is able to maneuver through restricted areas with his hands free. It is easily put on, adjusted, and removed, or comfortably worn without interfering with normal activities.
Semiautomatic device with a four-terminal network tests quantities of components having biaxial leads. The four-terminal network permits the testing of components in different environments. This device is easily modified for completely automatic operation.
Hand tool forms right angles in electronic component leads so they fit the spaced holes of a printed circuit board. This tool firmly holds the leads at points near the component ends to prevent damage and provide accuracy.
At .the beginning of the S-IC booster contract, it was evident that certain manufacturing techniques would have to be developed before the proposed design could be put into full production. Much of the development activity that has been accomplished was initiated because the size of booster components was greater than the capacities of available equipment. This paper describes some of the more significant methods that have evolved from this development activity, and which demonstrate how the capability to manufacture S-IC components such as bulkhead gore segments, tank skins, Y-rings, and lox tunnels, has been acquired. The fabrication methods used to transform 2219 aluminum alloy plate into the large, sculptured, and contoured parts that make up the structural surfaces of the booster include hydraulic bulge forming, age forming, and adaptations of conventional skin milling and chemical milling processes. The importance of fixturing and the machining sequence related to fabrication of the Y-ring are pointed out. The shear-spinning process that is used to produce a seamless, one-piece lox tunnel 40 feet long from a cylindrical blank only 62 inches long is described. The presentation is concluded with a synopsis of the current design changes that are being implemented to improve strength-to-weight ratios. A brief statement of possible future activity is included.
Infrared nondestructive testing for electronic component failures - conformal coating material testing to standardize infrared emissivity of electronic components
Digital computer program performs stress analysis and burst speed calculations on rotating axisymmetric turbomachinery components. The computer printout contains the displacement of each nodal point, the stress at the center of each element, the average tangential stress within the component, and the burst speed.
Warpage and creep in stainless steel valve components are decreased by a procedure in which components are machined to a semifinish and then cold soaked in a bath of cryogenic liquid. After the treatment they are returned to ambient temperature and machine finished to the final drawing dimensions.
Coating for electronic components used in space applications has bacteriostatic qualities capable of hindering bacterial reproduction, both vegetative and sporulative viable microorganisms. It exhibits high electrical resistivity, a low outgassing rate, and is capable of restraining electronic components when subjected to mechanical vibrations.
Electronic component development for space technology, discussing memory transistor, transducers, molecular electronics, power components and integration
Reliable computation in computing systems designed from unreliable components, considering two models for component malfunctions
Solar X ray detector aboard OGO 5 satellite observing two components in energetic solar X ray bursts, attributing impulsive component to bremsstrahlung
Development of computer programs for component analysis and design aids used in production of microstrip components is discussed. System includes designs for couplers, filters, circulators, transformers, power splitters, diode switches, and attenuators.
Simplified equations are presented for estimating the length and weight of major powerplant components of VTOL aircraft. The equations were developed from correlations of lift and cruise engine data. Components involved include fan, fan duct, compressor, combustor, turbine, structure, and accessories. Comparisons of actual and calculated total engine weights are included for several representative engines.