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NASA NTRS2011

Observability and Estimation of Distributed Space Systems via Local Information-Exchange Networks

Spacecraft formation flying involves the coordination of states among multiple spacecraft through relative sensing, inter-spacecraft communication, and control. Most existing formation-flying estimation algorithms can only be supported via highly centralized, all-to-all, static relative sensing. New algorithms are proposed that are scalable, modular, and robust to variations in the topology and link characteristics of the formation exchange network. These distributed algorithms rely on a local information exchange network, relaxing the assumptions on existing algorithms. Distributed space systems rely on a signal transmission network among multiple spacecraft for their operation. Control and coordination among multiple spacecraft in a formation is facilitated via a network of relative sensing and interspacecraft communications. Guidance, navigation, and control rely on the sensing network. This network becomes more complex the more spacecraft are added, or as mission requirements become more complex. The observability of a formation state was observed by a set of local observations from a particular node in the formation. Formation observability can be parameterized in terms of the matrices appearing in the formation dynamics and observation matrices. An agreement protocol was used as a mechanism for observing formation states from local measurements. An agreement protocol is essentially an unforced dynamic system whose trajectory is governed by the interconnection geometry and initial condition of each node, with a goal of reaching a common value of interest. The observability of the interconnected system depends on the geometry of the network, as well as the position of the observer relative to the topology. For the first time, critical GN&C (guidance, navigation, and control estimation) subsystems are synthesized by bringing the contribution of the spacecraft information-exchange network to the forefront of algorithmic analysis and design. The result is a formation estimation algorithm that is modular and robust to variations in the topology and link properties of the underlying formation network.

Fathpour, Nanaz↗

NASA NTRS2012

Precipitation from Space: Advancing Earth System Science

Of the three primary sources of spatially contiguous precipitation observations (surface networks, ground-based radar, and satellite-based radar/radiometers), only the last is a viable source over ocean and much of the Earth's land. As recently as 15 years ago, users needing quantitative detail of precipitation on anything under a monthly time scale relied upon products derived from geostationary satellite thermal infrared (IR) indices. The Special Sensor Microwave Imager (SSMI) passive microwave (PMW) imagers originated in 1987 and continue today with the SSMI sounder (SSMIS) sensor. The fortunate longevity of the joint National Aeronautics and Space Administration (NASA) and Japan Aerospace Exploration Agency (JAXA) Tropical Rainfall Measuring Mission (TRMM) is providing the environmental science community a nearly unbroken data record (as of April 2012, over 14 years) of tropical and sub-tropical precipitation processes. TRMM was originally conceived in the mid-1980s as a climate mission with relatively modest goals, including monthly averaged precipitation. TRMM data were quickly exploited for model data assimilation and, beginning in 1999 with the availability of near real time data, for tropical cyclone warnings. To overcome the intermittently spaced revisit from these and other low Earth-orbiting satellites, many methods to merge PMW-based precipitation data and geostationary satellite observations have been developed, such as the TRMM Multisatellite Precipitation Product and the Climate Prediction Center (CPC) morphing method (CMORPH. The purpose of this article is not to provide a survey or assessment of these and other satellite-based precipitation datasets, which are well summarized in several recent articles. Rather, the intent is to demonstrate how the availability and continuity of satellite-based precipitation data records is transforming the ways that scientific and societal issues related to precipitation are addressed, in ways that would not be otherwise possible. These developments have taken place in parallel with the growth of an increasingly interconnected scientific environment. Scientists from different disciplines can easily interact with each other via information and materials they encounter online, and collaborate remotely without ever meeting each other in person. Likewise, these precipitation datasets are quickly and easily available via various data portals and are widely used. Within the framework of the NASA/JAXA Global Precipitation Measurement (GPM mission, these applications will become increasingly interconnected. We emphasize that precipitation observations by themselves provide an incomplete picture of the state of the atmosphere. For example, it is unlikely that a richer understanding of the global water cycle will be possible by standalone missions and algorithms, but must also involve some component of data, where model analyses of the physical state are constrained alongside multiple observations (e.g., precipitation, evaporation, radiation). The next section provides examples extracted from the many applications that use various high-resolution precipitation products. The final section summarizes the future system for global precipitation processing.

Kucera, Paul A.↗

NASA NTRS2012

Inverted Three-Junction Tandem Thermophotovoltaic Modules

An InGaAs-based three-junction (3J) tandem thermophotovoltaic (TPV) cell has been investigated to utilize more of the blackbody spectrum (from a 1,100 C general purpose heat source GPHS) efficiently. The tandem consists of three vertically stacked subcells, a 0.74-eV InGaAs cell, a 0.6- eV InGaAs cell, and a 0.55-eV InGaAs cell, as well as two interconnecting tunnel junctions. A greater than 20% TPV system efficiency was achieved by another group with a 1,040 C blackbody using a single-bandgap 0.6- eV InGaAs cell MIM (monolithic interconnected module) (30 lateral junctions) that delivered about 12 V/30 or 0.4 V/junction. It is expected that a three-bandgap tandem MIM will eventually have about 3 this voltage (1.15 V) and about half the current. A 4 A/cm2 would be generated by a single-bandgap 0.6-V InGaAs MIM, as opposed to the 2 A/cm2 available from the same spectrum when split among the three series-connected junctions in the tandem stack. This would then be about a 50% increase (3xVoc, 0.5xIsc) in output power if the proposed tandem replaced the single- bandgap MIM. The advantage of the innovation, if successful, would be a 50% increase in power conversion efficiency from radioisotope heat sources using existing thermophotovoltaics. Up to 50% more power would be generated for radioisotope GPHS deep space missions. This type of InGaAs multijunction stack could be used with terrestrial concentrator solar cells to increase efficiency from 41 to 45% or more.

Wojtczuk, Steven↗

NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗

NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with solder interconnects consisting of lead-free alloys (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder

Kessel, Kurt↗

NASA NTRS2009

NASA-DoD Lead-Free Electronics Project

In response to concerns about risks from lead-free induced faults to high reliability products, NASA has initiated a multi-year project to provide manufacturers and users with data to clarify the risks of lead-free materials in their products. The project will also be of interest to component manufacturers supplying to high reliability markets. The project was launched in November 2006. The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of lead-free alloys - Packages (e.g., TSOP, BOA, PDIP) assembled and reworked with solder interconnects consisting of mixed alloys, lead component finish/lead-free solder and lead-free component finish/SnPb solder.

Kessel, Kurt R.↗

NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Chen, Liang-Yu↗

NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗

NASA NTRS2014

Passive Resonant Bidirectional Converter with Galvanic Barrier

A passive resonant bidirectional converter system that transports energy across a galvanic barrier includes a converter using at least first and second converter sections, each section including a pair of transfer terminals, a center tapped winding; a chopper circuit interconnected between the center tapped winding and one of the transfer terminals; an inductance feed winding interconnected between the other of the transfer terminals and the center tap and a resonant tank circuit including at least the inductance of the center tap winding and the parasitic capacitance of the chopper circuit for operating the converter section at resonance; the center tapped windings of the first and second converter sections being disposed on a first common winding core and the inductance feed windings of the first and second converter sections being disposed on a second common winding core for automatically synchronizing the resonant oscillation of the first and second converter sections and transferring energy between the converter sections until the voltage across the pairs of transfer terminals achieves the turns ratio of the center tapped windings.

Rosenblad, Nathan S.↗

NASA NTRS2014

The Link Between Shocks, Turbulence, and Magnetic Reconnection in Collisionless Plasmas

Global hybrid (electron fluid, kinetic ions) and fully kinetic simulations of the magnetosphere have been used to show surprising interconnection between shocks, turbulence and magnetic reconnection. In particular collisionless shocks with their reflected ions that can get upstream before retransmission can generate previously unforeseen phenomena in the post shocked flows: (i) formation of reconnecting current sheets and magnetic islands with sizes up to tens of ion inertial length. (ii) Generation of large scale low frequency electromagnetic waves that are compressed and amplified as they cross the shock. These 'wavefronts' maintain their integrity for tens of ion cyclotron times but eventually disrupt and dissipate their energy. (iii) Rippling of the shock front, which can in turn lead to formation of fast collimated jets extending to hundreds of ion inertial lengths downstream of the shock. The jets, which have high dynamical pressure, 'stir' the downstream region, creating large scale disturbances such as vortices, sunward flows, and can trigger flux ropes along the magnetopause. This phenomenology closes the loop between shocks, turbulence and magnetic reconnection in ways previously unrealized. These interconnections appear generic for the collisionless plasmas typical of space, and are expected even at planar shocks, although they will also occur at curved shocks as occur at planets or around ejecta.

MAGNETOSPHERE↗

NASA NTRS2015

Sparsely-Bonded CMOS Hybrid Imager

A method and device for imaging or detecting electromagnetic radiation is provided. A device structure includes a first chip interconnected with a second chip. The first chip includes a detector array, wherein the detector array comprises a plurality of light sensors and one or more transistors. The second chip includes a Read Out Integrated Circuit (ROIC) that reads out, via the transistors, a signal produced by the light sensors. A number of interconnects between the ROIC and the detector array can be less than one per light sensor or pixel.

Cunningham, Thomas J.↗

NASA NTRS2016

Reactive Orthotropic Lattice Diffuser for Noise Reduction

An orthotropic lattice structure interconnects porous surfaces of the flap with internal lattice-structured perforations to equalize the steady pressure field on the flap surfaces adjacent to the end and to reduce the amplitude of the fluctuations in the flow field near the flap end. The global communication that exists within all of the perforations provides the mechanism to lessen the pressure gradients experienced by the end portion of the flap. In addition to having diffusive effects (diffusing the incoming flow), the three-dimensional orthogonal lattice structure is also reactive (acoustic wave phase distortion) due to the interconnection of the perforations.

Khorrami, Mehdi R.↗

NASA NTRS2016

Multi-Dimensional Damage Detection

Methods and systems may provide for a structure having a plurality of interconnected panels, wherein each panel has a plurality of detection layers separated from one another by one or more non-detection layers. The plurality of detection layers may form a grid of conductive traces. Additionally, a monitor may be coupled to each grid of conductive traces, wherein the monitor is configured to detect damage to the plurality of interconnected panels in response to an electrical property change with respect to one or more of the conductive traces. In one example, the structure is part of an inflatable space platform such as a spacecraft or habitat.

Gibson, Tracy L.↗

NASA NTRS2016

Multi-Dimensional Damage Detection

Gibson, Tracy L.↗

NASA NTRS2016

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over approximately 1-micrometer scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

Microelectronics↗

NASA NTRS2016

Processing and Characterization of Thousand-Hour 500 C Durable 4H-SiC JFET Integrated Circuits

This work reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 hours of stable electrical operation at 500 C in air ambient. These ICs are based on 4H-SiC junction field effect transistor (JFET) technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over 1-m scale vertical topology. Following initial burn-in, important circuit parameters remain stable for more than 1000 hours of 500 C operational testing. These results advance the technology foundation for realizing long-term durable 500 C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

JFET↗

NASA NTRS2017

Human Mars Mission Design - The Ultimate Systems Challenge

A human mission to Mars will occur at some time in the coming decades. When it does, it will be the end result of a complex network of interconnected design choices, systems analyses, technical optimizations, and non-technical compromises. This mission will extend the technologies, engineering design, and systems analyses to new limits, and may very well be the most complex undertaking in human history. It can be illustrated as a large menu, or as a large decision tree. Whatever the visualization tool, there are numerous design decisions required to assemble a human Mars mission, and many of these interconnect with one another. This paper examines these many decisions and further details a number of choices that are highly interwoven throughout the mission design. The large quantity of variables and their interconnectedness results in a highly complex systems challenge, and the paper illustrates how a change in one variable results in ripples (sometimes unintended) throughout many other facets of the design. The paper concludes with a discussion of some mission design variables that can be addressed first, and those that have already been addressed as a result of ongoing National Aeronautics and Space Administration (NASA) developments, or as a result of decisions outside the technical arena. It advocates the need for a 'reference design' that can be used as a point of comparison, and to illustrate the system-wide impacts as design variables change.

Connolly, John F.↗

NASA NTRS2017

Axiomatic Design of Space Life Support Systems

Systems engineering is an organized way to design and develop systems, but the initial system design concepts are usually seen as the products of unexplained but highly creative intuition. Axiomatic design is a mathematical approach to produce and compare system architectures. The two axioms are:- Maintain the independence of the functional requirements.- Minimize the information content (or complexity) of the design. The first axiom generates good system design structures and the second axiom ranks them. The closed system human life support architecture now implemented in the International Space Station has been essentially unchanged for fifty years. In contrast, brief missions such as Apollo and Shuttle have used open loop life support. As mission length increases, greater system closure and increased recycling become more cost-effective.Closure can be gradually increased, first recycling humidity condensate, then hygiene wastewater, urine, carbon dioxide, and water recovery brine. A long term space station or planetary base could implement nearly full closure, including food production. Dynamic systems theory supports the axioms by showing that fewer requirements, fewer subsystems, and fewer interconnections all increase system stability. If systems are too complex and interconnected, reliability is reduced and operations and maintenance become more difficult. Using axiomatic design shows how the mission duration and other requirements determine the best life support system design including the degree of closure.

Axiomatic design↗