The effect of plastic deformation on the resistivity and Hall effect of copper- palladium and gold-palladium alloys.
Plastic deformation effect on resistivity and Hall effect of copper-palladium and gold- palladium alloys
HALL EFFECT↗
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Development of NERVA copper-constantan immersion thermocouples. NERVA program
Immersion type copper-constantan thermocouples for NERVA
Chandon, H. C.↗
Radiation-induced reduction of divalent copper salts in solutions
Organic additives and concentration effects on radiation induced reduction of copper salts in aqueous solution
Marsik, S. J.↗
Discharge characteristics of some copper oxide-magnesium thermal cells
Improved service life through reduction of self discharges in copper oxide-magnesium thermal cells
Thaller, L. H.↗
Radiation damage in thick copper and gold specimens produced by low-energy protons
Radiation damage in low energy proton irradiated thick copper and gold foils and subsequent annealing characteristics
Morris, R. D.↗
Low-temperature resistance minimum and magnetoresistance for dilute alloys of iron in copper
Predictions for magnetoresistivity temperature dependence of dilute alloys of iron in copper
Hudson, W. R.↗
Effect of amount of electrolyte, drain rate and electrode geometry on performance of copper oxide-magnesium thermal cells
Effects of electrolyte amount, drain rate, and electrode geometry on copper oxide-magnesium thermal cell performance
Thaller, L. H.↗
Discharge characteristics of some copper oxide-magnesium thermal cells.
Design influence on discharge characteristics of copper oxide magnesium thermal cells
Thaller, L. H.↗
Optical resolution of DL-aspartic acid copper complex by the use of biopolymers.
Partial optical resolution of DL-aspartic acid copper complex from supersaturated solution by seeding with biopolymers
Harada, K.↗
New photoemission studies of the d bands of nickel and copper.
Photoemission studies of optical density of D bands of nickel and copper
Eastman, D. E.↗
Method for copper staining of germanium crystals
Proper conditions for copper staining of germanium crystals include a low solution temperature of 3 degrees C, illumination of the sample by infrared light, and careful positioning of the light source relative to the sample so as to minimize absorption of the infrared light.
Rivet, E. J.↗
Sliding friction of copper alloys in vacuum
Sliding friction and wear behavior of copper alloys in air and vacuum
Jellison, J.↗
Stress relief of copper clad microwave circuit laminates to reduce and prevent warpage
Stress relief of copper-clad microwave circuit laminates to reduce and prevent warpage
Boone, W. L., Jr.↗
Atomic absorption analysis for copper and zinc in iron and stony meteorites
Absorption analysis for copper and zinc traces in iron and stony meteorites
Nava, D. F.↗
Adhesion of gold to various planes of copper studied with LEED
Adhesion of gold on copper planes studied with low energy electron diffraction
Buckley, D. H.↗
Develop methods for preparation of pure copper /2/ fluoride and develop analytical techniques for determination of impurities Final report
Ultrapure copper fluoride synthesis, analytical techniques, and production of one kilogram for cathode material
Lundquist, J. R.↗
Initial comparisons between experiment and theory of the strain fields in a cracked copper plate.
Initial comparisons between theory and experiment of strain fields in cracked copper plate
Swedlow, J. L.↗
Copper-titanium eutectic alloy improves electrical and mechanical contact to silicon carbide
Contact preparation at low temperatures is possible with the use of a copper-titanium eutectic alloy. Contacts formed with this alloy are ohmic on p-type silicon carbide and rectifying on n-type.
Shier, J. S.↗