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At least 1,675 records · Page 93

Data Center Cybersecurity, Supply Chain Risk Management, and Emerging Regulation Cohort Summary: Takeaways and Action Plans

This report summarizes the outcomes of the Data Center Cohort under the Department of Energy’s Technical Assistance for Digital Assurance (TADA) initiative, aimed at enhancing grid resilience through cybersecurity, supply chain risk management (SCRM), and Cyber-Informed Engineering (CIE). The cohort engaged 17 organizations across utilities, data center operators, vendors, and technology providers in three sessions combining presentations, discussions, and exercises. Key topics included AI-driven load behavior, cybersecurity vulnerabilities in UPS/BESS and cooling systems, governance gaps at utility–data center boundaries, and supply chain integrity. Five cross-cutting themes emerged: interconnection architecture vulnerabilities, fragmented governance, AI-driven stability risks, lack of regulatory frameworks, and long-term supply chain concerns. Actionable recommendations were developed, including implementing DMZ segmentation, formalizing vendor access agreements, designing AI workload limits, and advancing standards through NERC and state-level programs. These strategies aim to strengthen resilience, clarify responsibilities, and ensure secure integration of data centers into the grid.

24 - POWER TRANSMISSION AND DISTRIBUTION↗

Utility-Scale Solar, 2023 Edition: Analysis of Empirical Plant-level Data from U.S. Ground-mounted PV, PV+battery, and CSP Plants (exceeding 5 MWAC)

Berkeley Labs "Utility-Scale Solar", 2023 Edition presents analysis of empirical plant-level data from the U.S. fleet of ground-mounted photovoltaic (PV), PV+battery, and concentrating solar-thermal power (CSP) plants with capacities exceeding 5 MWAC. While focused on key developments in 2022, this report explores trends in deployment, technology, capital and operating costs, capacity factors, the levelized cost of solar energy (LCOE), power purchase agreement (PPA) prices, wholesale market value, and interconnection queue data.

analysis↗

Utility-Scale Solar, 2022 Edition: Analysis of Empirical Plant-level Data from U.S. Ground-mounted PV, PV+battery, and CSP Plants (exceeding 5 MWAC)

Berkeley Labs "Utility-Scale Solar", 2022 Edition presents analysis of empirical plant-level data from the U.S. fleet of ground-mounted photovoltaic (PV), PV+battery, and concentrating solar-thermal power (CSP) plants with capacities exceeding 5 MWAC. While focused on key developments in 2021, this report explores trends in deployment, technology, capital and operating costs, capacity factors, the levelized cost of solar energy (LCOE), power purchase agreement (PPA) prices, wholesale market value, and interconnection queue data.

2022↗

Utility-Scale Solar, 2024 Edition: Analysis of Empirical Plant-level Data from U.S. Ground-mounted PV, PV+battery, and CSP Plants (exceeding 5 MWAC)

Berkeley Labs "Utility-Scale Solar", 2024 Edition presents analysis of empirical plant-level data from the U.S. fleet of ground-mounted photovoltaic (PV), PV+battery, and concentrating solar-thermal power (CSP) plants with capacities exceeding 5 MWAC. While focused on key developments in 2023, this report explores trends in deployment, technology, capital and operating costs, capacity factors, the levelized cost of solar energy (LCOE), power purchase agreement (PPA) prices, wholesale market value, net value, and interconnection queue data.

analysis↗

Engaging with Utilities and Key Stakeholders [Slides]

The Energy to Communities (E2C) peer-learning cohort program provides technical assistance to groups of 15 community entities around a common energy topic over the course of 6 months. Every month, participants join a virtual meeting where they hear from experts and exchange strategies and best practices with their peers. This cohort, "Successful Energy Project Implementation" will explore common challenges in implementing energy projects and learn strategies to turn project plans into reality. Each participant will focus on a local energy project or priority as a cornerstone for their learning throughout the series. This presentation overviews the interconnection process for distributed energy resources and how to engage well with utilities. The workshop will be held on March 25, 2026.

24 POWER TRANSMISSION AND DISTRIBUTION↗

V2XConnect: Harmonizing the Landscape of Bidirectional Charging Codes, Standards, and Communication Protocols

The utility grid is constantly evolving with new generation sources and diverse loads from backup generators, backup batteries, rooftop photovoltaics (PV), and flexible charging loads. Each of these technologies presents consumers with an opportunity to work with their local utility to promote grid stability, reliability, and affordability. Through a wide range of programs, utilities are incentivizing the use of these resources to benefit the grid. However, especially for devices with inverters that supply power back to the grid, it is important that these assets comply with local grid codes to ensure human safety, power quality, and grid reliability. One of the most promising of these new technologies is the bidirectional electric vehicle (EV) coupled with bidirectional electric vehicle supply equipment (EVSE). This report introduces the technologies that enable bidirectional charging and how these systems operate. It then outlines the necessary interconnection codes and industry standards that govern the operations of grid-tied inverters, including those in bidirectional charging. A key challenge is then outlined from the complex landscape of communication protocols and proprietary systems designed to coordinate these grid assets. Finally, a single gateway solution is proposed to harmonize communications between all assets across an entire site for a cohesive response to grid codes and utility programs that is flexible enough to support a range of market options.

33 ADVANCED PROPULSION SYSTEMS↗

Probabilistic Fatigue Life Analysis of High Density Electronics Packaging

The fatigue of thin film metal interconnections in high density electronics packaging subjected to thermal cycling has been evaluated using a probabilistic fracture mechanics methodology. This probabilistic methodology includes characterization of thin film stress using an experimentally calibrated finite element model and simulation of flaw growth in the thin films using a stochastic crack growth model.

thermal cycling fatigue of thin film metal interco↗

Power Actuation and Switching Module Development

The Deep Space Avionics (DSA) Project is developing a Power Actuation and Switching Module (PASM). This component enables a modular and scalable design approach for power switching applications, which can result in a wide variety of power switching architectures using this simple building block. The PASM is designed to provide most of the necessary power switching functions of spacecraft for various Deep Space missions including future missions to Mars, comets, Jupiter and its moons. It is fabricated using an A SIC process that is tolerant of high radiation. The development includes two application specific integrated circuits (ASICs) and support circuitry all packaged using High Density Interconnect (HDI) technology. It can be operated in series or parallel with other PASMs, It can be used as a high-side or low-side switch and it can drive thruster valves, pyrotechnic devices such as NASA standard initiators, bus shunt resistors, and regular spacecraft component loads. Each PASM contains two independent switches with internal current limiting and over-current trip-off functions to protect the power subsystem from load faults. During turnon and turnoff each switch can limit the rate of current change (di/dt) to a value determined by the user. Threeway majority-voted On/Off commandability and full switch status telemetry (both analog and digital) are built into the module. This paper describes the development process used to design, model, fabricate, and test these compact and versatile power switches. Preliminary test results from prototype HDI PASM hardware are also discussed.

Power Actuation and Switching Module (PASM)↗

Interferometer real time control development for SIM

This paper provides an overview of the architecture, design, integration, and test of the SIM flight interferometer real time control to meet challenging flight system requirements for the high processor throughput, low-latency interconnect, and precise synchronization to support microarcsecond-level astrometric measurements for greater than five years at 1 AU in Earth-trailing orbit.

real↗

Advanced Power Electronics Designs - Reliability and Prognostics

The electrical interconnection and isolation design aspects within an inverter must also provide high thermal performance and thermomechanical reliability. In collaboration with ORNL, DuPont, and Indiana Integrated Circuits (IIC), NREL is evaluating new packaging materials and manufacturing techniques for wide-bandgap-based traction inverters. Thermal modeling and experimental evaluation revealed that an organic direct-bond-copper (ODBC) substrate has similar thermal resistance to traditional ceramic substrates. High-temperature thermal cycling has shown the ODBC substrates to have greater reliability than ceramic substrates which is a significant finding in the quest for low-cost, power-dense, high-temperature power electronics. IIC's direct chip-to-chip topside electrical connection will be attached to ODBC substrates and reliability evaluation for both technologies will be performed at NREL in Q4.

30 DIRECT ENERGY CONVERSION↗

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

47 OTHER INSTRUMENTATION↗

Multi-layered Resilient Microgrid Networks

Distribution grid resilience, especially when the grid is under high penetration of Distributed Energy Resources (DER), e.g. PV and energy storage, is essential to ensure the quality of electric power services. The resiliency aspect is particularly important for critical loads that typically include hospitals, police/fire stations, and national security facilities. Networks of multiple interconnected reconfigurable microgrids help to increase renewable energy penetration and may be used as basic building blocks for implementing future resilient power grids. However, this integration requires additional layers of communications, both horizontal and vertical, which may substantially increase the potential cyber attack surfaces as well as escalate risks for wide-spread malfunctions of automation systems. The Mulit-layered Resilient Microgrid Networks project is an industry-academic collaboration between ABB, Duke Energy and the University of Illinois at Urbana-Champaign (UIUC) that has developed and demonstrated a cyber-physical resilient control and communication architecture for deployment of multiple microgrid networks, as well as retrofitting the existing distribution grids by increasing DER penetration levels.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Nested Microgrids for Increased Grid Resiliency

The article presents a control and communication architecture for interconnecting multiple microgrids by leveraging IEC 61850 data models with distributed energy resources (DER) extensions, IEC Common Information Model (CIM) and Open Field Message Bus (OpenFMB) frameworks. An example use case for planned islanding in the nested microgrid scenario is also provided.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Advanced Power Electronics Designs - Reliability and Prognostics (Keystone Project 1)

The primary deliverable for this project will be to construct a power electronics package utilizing an organic electrically insulating substrate material with a direct chip-to-chip interconnect technology and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

ADVANCED PROPULSION SYSTEMS↗