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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,675 records · Page 93
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Reasoning Service Exemplars for NASA’s Data and Reasoning Fabric

Future operations for Urban and Advanced Air Mobility are enabled by a distributed network of reliable and secured data and reasoning services referred to here as a fabric. In the aggregate, such a system must be all encompassing and mission agnostic, but specific use-cases are still needed to improve understanding and drive design paradigms. For this purpose, three reasoning service exemplars for Target Selection and Routing, Trajectory Generation, and Battery Health Management were developed and integrated into a specific NASA proposed data and reasoning fabric. These services were then used to build a mission reasoning application for lightning strike reconnaissance developed in collaboration with the Civil Air Patrol. Autonomous mission execution was then demonstrated using a multivehicle simulation platform with a full envelope 6 Degree-of-Freedom dynamics model for a concept electric Vertical Takeoff and Landing aircraft.

Autonomy↗
NASA NTRS2023

Investigating Abrasion Effects of Lunar Simulant Grain Sizes on Candidate Spacesuit Fabric

Lunar dust is identified as one of the most significant challenges during the Apollo exploration missions due to its extremely abrasive and electrostatic characteristics. As NASA and the space industry prepare for the upcoming Artemis missions, researching and testing with lunar simulant is quintessential to understanding the effects of lunar dust on the systems and equipment that will be deployed on the lunar surface. Testing will also provide paths that lead to developing technologies and cleaning tools that could be used for dust mitigation. Additionally, it is expected that any hardware that will be exposed to the dusty environment should undergo rigorous testing to ensure it will maintain long-term performance and operate on the lunar surface. For this study, exterior spacesuit fabric was observed. Abrasion is one of the main concerns of lunar dust exposure for spacesuit fabric. Three different abrasion methods were chosen: a rotary tumbler, the Martindale method, and Accelerotor. These abrasion methods were tested on coated and uncoated spacesuit material, Orthofabric, to understand the abrasion rates of sieved lunar simulant and investigate if the addition of ceramic coating mitigated dust abrasion. To summarize, the testing results provided that larger grains are more abrasive than smaller grains, and the selected ceramic coatings did not minimize abrasion during the controlled abrasion tests. It is important to note that the selected ceramic coatings were not designed or intended to provide protection from the abrasive lunar environment. It is recommended to select additional ceramic coatings with an elevated TRL of 5 or greater for testing with Orthofabric and lunar simulant. As an additional note, contact angle measurements were not accounted for in coating selection and should be a factor when selecting adhesion resistant coatings for lunar dust.

grain size↗
NASA NTRS2022

Layer by layer thin film fabrication with in-process laser patterning

A modification of the traditional layer by layer process where the substrate is irradiated with laser light during the polycation and/or polyanion dipping cycles is described. By adjusting the laser irradiation time during dipping, irradiation power, number of bilayers, and the location and speed of laser irradiation, a variety of structures with controlled thicknesses can be fabricated. Laser patterned multilayer PAH/PTEBS polymer thin films were fabricated and characterized with absorbance mapping to demonstrate several patterning approaches. Results for 1) two laser patterned tracks, 2) single laser patterned track with varied average laser power across the sample from a continuously variable neutral density filter, and 3) laser patterning using a beam sent through multiple circular apertures are described. Based on the variable neutral density filter laser pattern, for 20 bilayer PAH/PTEBS films, an absorbance difference between off and on pattern of 0.1 requires an average laser power of less than 15 mW at 405 nm. The patterns produced are on the scale of several millimeters, though they could be made much smaller by focusing the laser used for patterning.

Nanoengineering↗
NASA NTRSDate not supplied

Validation Testing and Statistical Analysis of the Rotary Tumbler Fabric Abrasion Method

The Artemis space suit glove environmental protection garment (EPG) will be the first line of protection used to shield the crewmember’s hands from the environments encountered during extravehicular activity (EVA). As the Artemis missions will include more extreme environments than those experienced on the International Space Station, development, verification, and validation of gloves requires the development of new test methods. A previous paper focused on the development of a test procedure to characterize lunar EVA glove fabrics using ASTM standardized test methods and the design and validation of a new standardized test procedure for comparing abrasion resistance between fabrics using a dust and rock filled rotary tumbler. Preliminary results of testing were presented in that paper. This paper reports on the validation testing and statistical analysis of the newly developed tumbler abrasion test method.

Robert J Jones↗
DOE OSTI2012

Implementation of ASME Code, Section XI, Code Case N-770, on Alternative Examination Requirements for Class 1 Butt Welds Fabricated with Alloy 82/182

In May 2010, the NRC issued a proposed notice of rulemaking that includes a provision to add a new section to its rules to require licensees to implement ASME Code Case N-770, ‘‘Alternative Examination Requirements and Acceptance Standards for Class 1 PWR Piping and Vessel Nozzle Butt Welds Fabricated with UNS N06082 or UNS W86182 Weld Filler Material With or Without the Application of Listed Mitigation Activities, Section XI, Division 1,’’ with 15 conditions. Code Case N-770 contains baseline and inservice inspection (ISI) requirements for unmitigated butt welds fabricated with Alloy 82/182 material and preservice and ISI requirements for mitigated butt welds. The NRC stated that application of ASME Code Case N-770 is necessary because the inspections currently required by the ASME Code, Section XI, were not written to address stress corrosion cracking Alloy 82/182 butt welds, and the safety consequences of inadequate inspections can be significant. The NRC expects to issue the final rule incorporating this code case into its regulations in the spring 2011 time frame. This paper discusses the new examination requirements, the conditions that NRC is imposing , and the major concerns with implementation of the new Code Case.

alloy 82/182↗
DOE OSTI2013

Method for fabricating a microelectromechanical resonator

A method is disclosed which calculates dimensions for a MEM resonator in terms of integer multiples of a grid width G for reticles used to fabricate the resonator, including an actual sub-width L.sub.a=NG and an effective electrode width W.sub.e=MG where N and M are integers which minimize a frequency error f.sub.e=f.sub.d-f.sub.a between a desired resonant frequency f.sub.d and an actual resonant frequency f.sub.a. The method can also be used to calculate an overall width W.sub.o for the MEM resonator, and an effective electrode length L.sub.e which provides a desired motional impedance for the MEM resonator. The MEM resonator can then be fabricated using these values for L.sub.a, W.sub.e, W.sub.o and L.sub.e. The method can also be applied to a number j of MEM resonators formed on a common substrate.

42 ENGINEERING↗
DOE OSTI2014

Development of a new casting method to fabricate U–Zr alloy containing minor actinides

Metal fuel slugs of U–Zr alloys for a sodium-cooled fast reactor (SFR) have conventionally been fabricated using an injection casting method. However, casting alloys containing volatile radioactive constituents, such as Am, are problematic in a conventional injection casting method. As an alternative fabrication method, low pressure gravity casting has been developed. Casting soundness, microstructural characteristics, alloying composition, density, and fuel losses were evaluated for the following as-cast fuel slugs: U–10 wt% Zr, U–10 wt% Zr–5 wt% RE, and U–10 wt% Zr–5 wt% RE–5 wt% Mn. The U and Zr contents were uniform throughout the matrix, and impurities such as oxyen, carbon, and nitrogen satisfied the specification of total impurities less than 2,000 ppm. The appearance of the fuel slugs was generally sound, and the internal integrity was shown to be satisfactory based on gamma-ray radiography. In a volatile surrogate casting test, the U–Zr–RE–Mn fuel slug showed that nearly all of the manganese was retained when casting was done under an inert atmosphere.

99 GENERAL AND MISCELLANEOUS↗
DOE OSTI2014

Optical systems fabricated by printing-based assembly

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

47 OTHER INSTRUMENTATION↗
DOE OSTI2014

Rigid spine reinforced polymer microelectrode array probe and method of fabrication

A rigid spine-reinforced microelectrode array probe and fabrication method. The probe includes a flexible elongated probe body with conductive lines enclosed within a polymeric material. The conductive lines connect microelectrodes found near an insertion end of the probe to respective leads at a connector end of the probe. The probe also includes a rigid spine, such as made from titanium, fixedly attached to the probe body to structurally reinforce the probe body and enable the typically flexible probe body to penetrate and be inserted into tissue, such as neural tissue. By attaching or otherwise fabricating the rigid spine to connect to only an insertion section of the probe body, an integrally connected cable section of the probe body may remain flexible.

47 OTHER INSTRUMENTATION↗
DOE OSTI2014

Contact formation and gettering of precipitated impurities by multiple firing during semiconductor device fabrication

Methods for contact formation and gettering of precipitated impurities by multiple firing during semiconductor device fabrication are provided. In one embodiment, a method for fabricating an electrical semiconductor device comprises: a first step that includes gettering of impurities from a semiconductor wafer and forming a backsurface field; and a second step that includes forming a front contact for the semiconductor wafer, wherein the second step is performed after completion of the first step.

36 MATERIALS SCIENCE↗
DOE OSTI2014

Method of fabricating a back-contact solar cell and device thereof

Methods of fabricating back-contact solar cells and devices thereof are described. A method of fabricating a back-contact solar cell includes forming an N-type dopant source layer and a P-type dopant source layer above a material layer disposed above a substrate. The N-type dopant source layer is spaced apart from the P-type dopant source layer. The N-type dopant source layer and the P-type dopant source layer are heated. Subsequently, a trench is formed in the material layer, between the N-type and P-type dopant source layers.

36 MATERIALS SCIENCE↗
DOE OSTI2014

Semiconductor device PN junction fabrication using optical processing of amorphous semiconductor material

Systems and methods for semiconductor device PN junction fabrication are provided. In one embodiment, a method for fabricating an electrical device having a P-N junction comprises: depositing a layer of amorphous semiconductor material onto a crystalline semiconductor base, wherein the crystalline semiconductor base comprises a crystalline phase of a same semiconductor as the amorphous layer; and growing the layer of amorphous semiconductor material into a layer of crystalline semiconductor material that is epitaxially matched to the lattice structure of the crystalline semiconductor base by applying an optical energy that penetrates at least the amorphous semiconductor material.

14 SOLAR ENERGY↗
DOE OSTI2014

Method of fabricating vertically aligned group III-V nanowires

A top-down method of fabricating vertically aligned Group III-V micro- and nanowires uses a two-step etch process that adds a selective anisotropic wet etch after an initial plasma etch to remove the dry etch damage while enabling micro/nanowires with straight and smooth faceted sidewalls and controllable diameters independent of pitch. The method enables the fabrication of nanowire lasers, LEDs, and solar cells.

36 MATERIALS SCIENCE↗
DOE OSTI2015

Vertical group III-V nanowires on si, heterostructures, flexible arrays and fabrication

Embodiments of the invention provide a method for direct heteroepitaxial growth of vertical III-V semiconductor nanowires on a silicon substrate. The silicon substrate is etched to substantially completely remove native oxide. It is promptly placed in a reaction chamber. The substrate is heated and maintained at a growth temperature. Group III-V precursors are flowed for a growth time. Preferred embodiment vertical Group III-V nanowires on silicon have a core-shell structure, which provides a radial homojunction or heterojunction. A doped nanowire core is surrounded by a shell with complementary doping. Such can provide high optical absorption due to the long optical path in the axial direction of the vertical nanowires, while reducing considerably the distance over which carriers must diffuse before being collected in the radial direction. Alloy composition can also be varied. Radial and axial homojunctions and heterojunctions can be realized. Embodiments provide for flexible Group III-V nanowire structures. An array of Group III-V nanowire structures is embedded in polymer. A fabrication method forms the vertical nanowires on a substrate, e.g., a silicon substrate. Preferably, the nanowires are formed by the preferred methods for fabrication of Group III-V nanowires on silicon. Devices can be formed with core/shell and core/multi-shell nanowires and the devices are released from the substrate upon which the nanowires were formed to create a flexible structure that includes an array of vertical nanowires embedded in polymer.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2015

Design Fabrication and Characterization of High Density Silicon Photonic Components

Our burgeoning appetite for data relentlessly demands exponential scaling of computing and communications resources leading to an overbearing and ever-present drive to improve e ciency while reducing on-chip area even as photonic components expand to ll application spaces no longer satis ed by their electronic counterparts. With a high index contrast, low optical loss, and compatibility with the CMOS fabrication infrastructure, silicon-on-insulator technology delivers a mechanism by which e cient, sub-micron waveguides can be fabricated while enabling monolithic integration of photonic components and their associated electronic infrastructure. The result is a solution leveraging the superior bandwidth of optical signaling on a platform capable of delivering the optical analogue to Moore's Law scaling of transistor density. Device size is expected to end Moore's Law scaling in photonics as Maxwell's equations limit the extent to which this parameter may be reduced. The focus of the work presented here surrounds photonic device miniaturization and the development of 3D optical interconnects as approaches to optimize performance in densely integrated optical interconnects. In this dissertation, several technological barriers inhibiting widespread adoption of photonics in data communications and telecommunications are explored. First, examination of loss and crosstalk performance in silicon nitride over SOI waveguide crossings yields insight into the feasibility of 3D optical interconnects with the rst experimental analysis of such a structure presented herein. A novel measurement platform utilizing a modi ed racetrack resonator is then presented enabling extraction of insertion loss data for highly e cient structures while requiring minimal on-chip area. Finally, pioneering work in understanding the statistical nature of doublet formation in microphotonic resonators is delivered with the resulting impact on resonant device design detailed.

36 MATERIALS SCIENCE↗
DOE OSTI2015

Dopant ink composition and method of fabricating a solar cell there from

Dopant ink compositions and methods of fabricating solar cells there from are described. A dopant ink composition may include a cross-linkable matrix precursor, a bound dopant species, and a solvent. A method of fabricating a solar cell may include delivering a dopant ink composition to a region above a substrate. The dopant ink composition includes a cross-linkable matrix precursor, a bound dopant species, and a solvent. The method also includes baking the dopant ink composition to remove a substantial portion of the solvent of the dopant ink composition, curing the baked dopant ink composition to cross-link a substantial portion of the cross-linkable matrix precursor of the dopant ink composition, and driving dopants from the cured dopant ink composition toward the substrate.

14 SOLAR ENERGY↗
DOE OSTI2015

Optical systems fabricated by printing-based assembly

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

47 OTHER INSTRUMENTATION↗