An Investigation of a Thermal Ice-prevention System for a C-46 Cargo Airplane VII : Effect of the Thermal System on the Wing-structure Stresses as Established in Flight
Explore the source record for details and available documents.
Jones, Alun R↗
SEARCH · Engineering Papers
Results for “THERMAL STRESSES”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Effects of Thermal Treatment on Tensile Creep and Stress-Rupture Behavior of Hi-Nicalon SiC Fibers
Tensile creep and stress-rupture studies were conducted on Hi-Nicalon SiC fibers at 1200 and 1400 C in argon and air. Examined were as-received fibers as well as fibers annealed from 1400 to 1800 C for 1 hour in argon before testing. The creep and rupture results for these annealed fibers were compared to those of the as-received fibers to determine the effects of annealing temperature, test temperature, and test environment. Argon anneals up to 1500 C degrade room temperature strength of Hi-Nicalon fibers, but improve fiber creep resistance in argon or air by as much as 100% with no significant degradation in rupture strength. Argon anneals above 1500 C continue to improve fiber creep resistance when tested in argon, but significantly degrade creep resistance and rupture strength when tested in air. Decrease in creep resistance in air is greater at 1200 C than at 1400 C. Mechanisms are suggested for the observed behavior.
Yun, H. M.↗
Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits
As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.
Strickland, S. M.↗
Healing of voids in the aluminum metallization of integrated circuit chips
The thermal stability of GaAs modulation-doped field effect transistors (MODFETs) is evaluated in order to identify failure mechanisms and validate the reliability of these devices. The transistors were exposed to thermal step-stress and characterized at ambient temperatures to indicate device reliability, especially that of the transistor ohmic contacts with and without molybdenum diffusion barriers. The devices without molybdenum exhibited important transconductance deterioration. MODFETs with molybdenum diffusion barriers were tolerant to temperatures above 300 C. This tolerance indicates that thermally activated failure mechanisms are slow at operational temperatures. Therefore, high-reliability MODFET-based circuits are possible.
Cuddihy, Edward F.↗
Simultaneous Thermal and Gamma Radiation Aging of Electrical Cable Polymers
The polymers used for insulation in nuclear power plant electrical cables are susceptible to aging during long term operation. Elevated temperature is the primary contributor to changes in polymer structure that result loss of mechanical and electrical properties, but gamma radiation is also a significant source of degradation for polymers used within relevant plant locations. Despite many years of polymer degradation research, the combined effects of simultaneous exposure to thermal and radiation stress are not well understood. As nuclear operators contemplate and prepare for extended operations beyond initial license periods, a predictive understanding of exposure-based cable material degradation is becoming an increasingly important input to safety, licensing, operations and economic decisions. We are focusing on carefully-controlled simultaneous thermal and gamma radiation accelerating aging and characterization of the most common nuclear cable polymers to understand the relative contributions of temperature, time, dose and dose rate to changes in cable polymer material structure and properties. Improved understanding of cable performance in long term operation will help support continued sustainable nuclear power generation.
Cables, Nuclear, Polymers, Thermal aging, Gamma ag↗
Recent trends in all-organic polymer dielectrics for high-temperature electrostatic energy storage capacitors
Electrostatic energy storage (EES) capacitors are critical for renewable energy and high-power systems, driving the search for dielectric materials that combine superior electrical insulation, mechanical flexibility, low density, cost-effectiveness, and processability. Polymer-based dielectrics have emerged as leading candidates, particularly for high electric field applications. However, conventional polymers often fail to meet the demands of high-temperature environments due to increased electrical conductivity and reduced discharged energy density at elevated temperatures, resulting in energy loss and reduced performance. High glass transition temperature (T g) polymers show promise but require further optimization to enhance their energy storage capabilities under thermal and electrical stress. This review provides a comprehensive update on recent advancements in high-T g polymer-based dielectrics for EES capacitors, focusing on both intrinsic polymers and all-organic composites. It outlines key design principles, critical performance parameters, and innovative strategies—such as nanofiller doping, layered architectures, physical blending, and chemical crosslinking—to improve electrical, thermal, and mechanical properties. The review also highlights emerging trends, including the integration of machine learning algorithms to explore novel polymer structures and expand the chemical design space. By bridging the gap between academic research and industrial application, this review aims to accelerate the development of next-generation dielectric materials capable of balancing multiple performance metrics for high-temperature EES capacitors.
Xie, Zongliang↗
Direct method of design and stress analysis of rotating disks with temperature gradient
A method is presented for the determination of the contour of disks, typified by those of aircraft gas turbines, to incorporate arbitrary elastic-stress distributions resulting from either centrifugal or combined centrifugal and thermal effects. The specified stress may be radial, tangential, or any combination of the two. Use is made of the finite-difference approach in solving the stress equations, the amount of computation necessary in the evolution of a design being greatly reduced by the judicious selection of point stations by the aid of a design chart. Use of the charts and of a preselected schedule of point stations is also applied to the direct problem of finding the elastic and plastic stress distribution in disks of a given design, thereby effecting a great reduction in the amount of calculation. Illustrative examples are presented to show computational procedures in the determination of a new design and in analyzing an existing design for elastic stress and for stresses resulting from plastic flow.
Manson, S S↗
Creep-fatigue Behavior and Damage Accumulation of a Candidate Structural Material for Concentrating Solar Power Solar Thermal Receiver (Final Technical Report)
Creep-fatigue deformation is an important consideration for a thermal receiver in Concentrating Solar Power systems due to the constant static stress or pressure, diurnal cycling, and elevated service temperatures required for efficient operation. An accurate description of the creep-fatigue behavior, not available for five of the six candidate materials, is important for assessment of preliminary designs. This project has provided a detailed analysis of the creep-fatigue behavior and damage accumulation of Alloy 740H, a candidate structural material for a CSP solar thermal receiver to address a critical knowledge barrier for receiver designs identified in the CSP Gen3 Demonstration Roadmap. This project was divided in to three tasks, split between two general categories: Experimental and design methodology. Tasks 1 and 3, relating to the collection of data on Alloy 740H plate and sheet forms, respectively, were performed at the Idaho National Laboratory and used as input to Task 2, the development of design methodology performed at Argonne National Laboratory. Experimental work covered limited tensile and creep testing to fill gaps in available data that is currently available and to demonstrate how the plate of Alloy 740H tested in this work compared to historical data. A more substantial testing program for fatigue and creep-fatigue was performed, with particular emphasis on creep-fatigue as there is little available data and it is necessary to understand the creep-fatigue interaction and develop related design models. This effort includes the development of rules for the design of solar receiver components against high temperature creep-fatigue and ratcheting failure modes. The ASME Code rules for high temperature nuclear components was used to the basis of the method but adjustments will be made to reflect the generally shorter, diurnal operating cycles of thermal receivers and the relative consequences of failure, comparing nuclear to solar components. This work has provided guidance for the design of components for concentrating power facilities operating at high temperatures and undergoing high, secondary thermal stresses relative to the applied primary pressure stress. The design rules were developed for the design of Generation 3 CSP tubular receivers manufactured from Alloy 740H, but are generally applicable to a wide range of component types undergoing similar loads. Procedural design rules for components to be used in conjunction with the 2019 edition of the ASME Boiler & Pressure Vessel Code and the corresponding design data for Alloy 740H have been developed. A commentary describing the rationale behind the design rules and the data underlying the design material properties, as well as an extensive set of worked sample problems detailing the application of the rules to CSP components were developed as a part of this project, with a separate report covering these aspects in detail and included in the Appendix of this report.
14 SOLAR ENERGY↗
Characterizing and improving the performance of molten-salt-steam heat exchangers in concentrating solar power plants
Shell-and-tube heat exchangers (HXs) for steam generation from molten salts in concentrating solar power (CSP) plants experience thermal fatigue due to significant temperature gradients and inherent transient operation. Molten salt-steam HX design lifespans exceed actual lifespans, and, as a consequence, designers overpredict plant profitability and operators neglect appropriate prescriptions to optimize these lifetimes. Here, this study refines HX lifespan estimates with data benchmarked against thermal-fluid mechanical modeling of stress and accumulated fatigue. Reduced-order thermal models of the molten salt-steam, shell-and-tube evaporator and superheater predict transient temperature profiles along the two HXs salt-steam flow paths. The modeled evaporator and superheater temperature profiles enable assessment of cyclic stresses within the HX tubesheets, where molten-salt HX failures are most common. Evaporator and superheater performance data from a current 110 MW elec commercial CSP plant provide a basis for validating the reduced-order HX models. HX life predictions derived from stochastic failure distributions serve as inputs for simulating and optimizing existing plant operations. The impact of the updated lifespans on overall plant revenue depends on operating scenarios. This study suggests that typical ramping rates for a CSP plant with a high-temperature Rankine cycle result in an evaporator and superheater life of approximately 10 and 25 years, respectively, compared to the design target of 30 years. Reduced HX lifespans decrease operational plant revenue on average by 4.6-5.1%. Furthermore, there may be as many as four HX replacements over the 30-year lifetime of the plant; and, purchase agreement loss due to failure to meet contractual production requirements can have ramifications that include the risk of bankruptcy.
14 SOLAR ENERGY↗
Analysis of local delaminations caused by angle ply matrix cracks
Two different families of graphite/epoxy laminates with similar layups but different stacking sequences, (0,theta,-theta) sub s and (-theta/theta/0) sub s were analyzed using three-dimensional finite element analysis for theta = 15 and 30 degrees. Delaminations were modeled in the -theta/theta interface, bounded by a matrix crack and the stress free edge. The total strain energy release rate, G, along the delamination front was computed using three different techniques: the virtual crack closure technique (VCCT), the equivalent domain Integral (EDI) technique, and a global energy balance technique. The opening fracture mode component of the strain energy release rate, Gl, along the delamination front was also computed for various delamination lengths using VCCT. The effect of residual thermal and moisture stresses on G was evaluated.
Salpekar, Satish A.↗
Defining weather scenarios for simulation-based assessment of thermal resilience of buildings under current and future climates: A case study in Brazil
In response to increasingly severe weather conditions, optimization of building performance and investment provides an opportunity to consider co-benefits of thermal resilience during energy efficiency retrofits. This work aims to assess thermal resilience of buildings using building performance simulation to evaluate the indoor overheating risk under nine weather scenarios, considering historical (2010s), mid-term future (2050s), and long-term future (2090s) typical meteorological years, and heat wave years. Such an analysis is based on resilience profiles that combine six integrated indicators. A case study with a district of 92 buildings in Brazil was conducted, and a combination of strategies to improve thermal resilience was identified. Results reflect the necessity of planning for resilience in the context of climate change. This is because strategies recommended under current conditions might not be ideal in the future. Therefore, an adaptable design should be prioritized. Cooling energy consumption could increase by 48 % by the 2050s, while excessive overheating issues could reach 37 % of the buildings. Simple passive strategies can significantly reduce the heat stress. A comprehensive thermal resilience analysis should ultimately be accompanied by a thorough reflection on the stakeholders’ objectives, available resources, and planning horizon, as well as the risks assumed for not being resilient.
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗
Mount Protects Thin-Walled Glass or Ceramic Tubes from Large Thermal and Vibration Loads
The design allows for the low-stress mounting of fragile objects, like thin walled glass, by using particular ways of compensating, isolating, or releasing the coefficient of thermal expansion (CTE) differences between the mounted object and the mount itself. This mount profile is lower than true full kinematic mounting. Also, this approach enables accurate positioning of the component for electrical and optical interfaces. It avoids the higher and unpredictable stress issues that often result from potting the object. The mount has been built and tested to space-flight specifications, and has been used for fiber-optic, optical, and electrical interfaces for a spaceflight mission. This mount design is often metal and is slightly larger than the object to be mounted. The objects are optical or optical/electrical, and optical and/or electrical interfaces are required from the top and bottom. This requires the mount to be open at both ends, and for the object s position to be controlled. Thin inside inserts at the top and bottom contact the housing at defined lips, or edges, and hold the fragile object in the mount. The inserts can be customized to mimic the outer surface of the object, which further reduces stress. The inserts have the opposite CTE of the housing material, partially compensating for the CTE difference that causes thermal stress. A spring washer is inserted at one end to compensate for more CTE difference and to hold the object against the location edge of the mount for any optical position requirements. The spring also ensures that any fiber-optic or optic interface, which often requires some pressure to ensure a good interface, does not overstress the fragile object. The insert thickness, material, and spring washer size can be traded against each other to optimize the mount and stresses for various thermal and vibration load ranges and other mounting requirements. The alternate design uses two separate, unique features to reduce stress and hold the object. A release agent is applied to the inside surface of the mount just before the binding potting material is injected in the mount. This prevents the potting material from bonding to the mount, and thus prevents stress from being applied, at very low temperatures, to the fragile object being mounted. The potting material mixing and curing is temperature- and humidity-controlled. The mount has radial grooves cut in it that the potting material fills, thus controlling the vertical position of the mounted object. The design can easily be used for long and thin objects, short and wide objects, and any shape in between. The design s advantages are amplified for long and thin fragile objects. The general testing range was 45 to +45 C, but multiple mounts were successfully tested down to 60 and up to 50 C and the design can be adjusted for larger ranges.
Amato, Michael↗
Towards machine-learning a fully-coupled constitutive model for thermal-hydraulic fracture in geothermal systems: phase I (Final Report)
This project, entitled “Towards machine-learning a fully-coupled constitutive model for thermal-hydraulic fracture in geothermal systems: phase I,” addresses challenges in understanding and controlling subsurface fracture networks, which are crucial for applications like deep geothermal heat mining and deep-crustal minerals/metals/hydrogen extraction. The research focuses on advancing the understanding of coupled thermal-hydro-mechanical-chemical (THMC) processes in geologic materials, particularly under the high temperature and pressure conditions found in the deep crust. This seed grant focused specifically on thermal cracking and the development of new constitutive models. Significant progress was made in both experimental and theoretical domains. To study micro-scale fracture formation, the project demonstrated the ability to create thermal cracking under stress in granite samples using a Paterson Gas-medium Deformation Apparatus.
15 GEOTHERMAL ENERGY↗
Accelerated stress testing of terrestrial solar cells
The development of an accelerated test schedule for terrestrial solar cells is described. This schedule, based on anticipated failure modes deduced from a consideration of IC failure mechanisms, involves bias-temperature testing, humidity testing (including both 85-85 and pressure cooker stress), and thermal-cycle thermal-shock testing. Results are described for 12 different unencapsulated cell types. Both gradual electrical degradation and sudden catastrophic mechanical change were observed. These effects can be used to discriminate between cell types and technologies relative to their reliability attributes. Consideration is given to identifying laboratory failure modes which might lead to severe degradation in the field through second quadrant operation. Test results indicate that the ability of most cell types to withstand accelerated stress testing depends more on the manufacturer's design, processing, and worksmanship than on the particular metallization system. Preliminary tests comparing accelerated test results on encapsulated and unencapsulated cells are described.
Lathrop, J. W.↗
Failure Investigation & Design Optimization of a Photo-Multiplier Tube Assembly Under Thermal Loading
Analysis of GLAST ACD Photo-Multiplier Tube (PMT) assembly under thermal loading demonstrates that the glass tube experiences high stresses due to Coefficient of Thermal Expansion mismatch, as well as increased stress due to high stiffness and incompressibility of potting compound. Further investigation shows adverse loading effects due to the magnetic shield, a thin piece of steel wrapped around the PMT. This steel, Mu Metal, contained an overlap region that directly attributed to crack propagation in the outside surface of the tube. Sensitivities to different configurations were studied to reduce the stress and provide a more uniform loading throughout the PMT to ensure mission success. Studies indicate substituting a softer and more compressible potting compound and moving the Mu metal from the glass tube to the outside wall of the aluminum housing yields lower stress.
Dahya, Kevin↗
HDX–MS finds that partial unfolding with sequential domain activation controls condensation of a cellular stress marker
Eukaryotic cells form condensates to sense and adapt to their environment [S. F. Banani, H. O. Lee, A. A. Hyman, M. K. Rosen,Nat. Rev. Mol. Cell Biol.18, 285–298 (2017), H. Yoo, C. Triandafillou, D. A. Drummond,J. Biol. Chem.294, 7151–7159 (2019)]. Poly(A)-binding protein (Pab1), a canonical stress granule marker, condenses upon heat shock or starvation, promoting adaptation [J. A. Ribacket al.,Cell168, 1028–1040.e19 (2017)]. The molecular basis of condensation has remained elusive due to a dearth of techniques to probe structure directly in condensates. We apply hydrogen–deuterium exchange/mass spectrometry to investigate the mechanism of Pab1’s condensation. Pab1’s four RNA recognition motifs (RRMs) undergo different levels of partial unfolding upon condensation, and the changes are similar for thermal and pH stresses. Although structural heterogeneity is observed, the ability of MS to describe populations allows us to identify which regions contribute to the condensate’s interaction network. Our data yield a picture of Pab1’s stress-triggered condensation, which we term sequential activation (Fig. 1A), wherein each RRM becomes activated at a temperature where it partially unfolds and associates with other likewise activated RRMs to form the condensate. Subsequent association is dictated more by the underlying free energy surface than specific interactions, an effect we refer to as thermodynamic specificity. Our study represents an advance for elucidating the interactions that drive condensation. Furthermore, our findings demonstrate how condensation can use thermodynamic specificity to perform an acute response to multiple stresses, a potentially general mechanism for stress-responsive proteins.
Science & Technology - Other Topics↗
Influence of Cooling Channel Geometry on the Thermal Response in Silicon Nitride Plates Studied
Engine manufacturers are continually attempting to improve the performance and efficiency of internal combustion engines. Usually they raise the operating temperature or reduce the cooling air requirement for the hot section turbine components. However, the success of these attempts depends on finding materials that are lightweight, are strong, and can withstand high temperatures. Ceramics are among the top candidate materials considered for such harsh applications. They hold low-density, high-temperature strength, and thermal conductivity, and they are undergoing investigation as potential materials for replacing nickel-base alloys and superalloys that are currently used for engine hot-section components. Ceramic structures can withstand higher operating temperatures and a harsh combustion environment. In addition, their low densities relative to metals help reduce component mass. The long-term objectives of the High Temperature Propulsion Components (HOTPC) Project are to develop manufacturing technology, thermal and environmental barrier coatings (TBC/EBC), and the analytical modeling capability to predict thermomechanical stresses in minimally cooled silicon nitride turbine nozzle vanes under simulated engine conditions. Two- and three-dimensional finite element analyses with TBC were conducted at the NASA Glenn Research Center. Nondestructive evaluation was used to determine processing defects. The study included conducting preliminary parametric analytical runs of heat transfer and stress analyses under steady-state conditions to demonstrate the feasibility of using cooled Si3N4 parts for turbine applications. The influence of cooling-channel shapes (such as circular, square, and ascending-order cooling channels) on cooling efficiency and thermal stresses was investigated. Temperature distributions were generated for all cases considered under both cooling and no-cooling conditions, with air being the cooling medium. The table shows the magnitude of the maximum and minimum temperature obtained for the plates under air cooling. Each channel's cross-sectional shape delivered a different temperature; however, the two-dimensional analyses for circular and square or equal-side rectangular holes produced close results. Moreover, the model of the panel with ascending order cooling channels experienced the lowest temperature. A difference of near 260 C was found among the three cooling-hole configurations investigated. The ascending-order cooling channels arrangement showed superior performance by attaining the lowest temperature (1077 C) in comparison to the circular (1379 C) and square (1343 C) channels for the same cooling-hole size. This indicates that the panel with ascending-order cooling channels is the most suitable configuration regardless of the complexity involved in its manufacture. More details pertaining to this study are reported.
Abdul-Aziz, Ali↗