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At least 1,639 records · Page 91

Magnetic Damping Modulation in IrMn 3 / Ni 80 Fe 20 via the Magnetic Spin Hall Effect

Noncollinear antiferromagnets can have additional spin Hall effects due to the net chirality of their magnetic spin structure, which provides for more complex spin-transport phenomena compared to ordinary nonmagnetic materials. Here we investigated how ferromagnetic resonance of permalloy (Ni 80 Fe 20 ) is modulated by spin Hall effects in adjacent epitaxial IrMn 3 films. We observe a large dc modulation of the ferromagnetic resonance linewidth for currents applied along the [001] IrMn 3 direction. Furthermore, this very strong angular dependence of spin-orbit torques from dc currents through the bilayers can be explained by the magnetic spin Hall effect where IrMn 3 provides novel pathways for modulating magnetization dynamics electrically.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

Search for Daily Modulation of MeV Dark Matter Signals with DAMIC-M

Dark matter (DM) particles with sufficiently large cross sections may scatter as they travel through Earth’s bulk. The corresponding changes in the DM flux give rise to a characteristic daily modulation signal in detectors sensitive to DM-electron interactions. Here, we report results obtained from the first underground operation of the DAMIC-M prototype detector searching for such a signal from DM with MeV-scale mass. A model-independent analysis finds no modulation in the rate of 1 e − events with sidereal period, where a DM signal would appear. We then use these data to place exclusion limits on DM in the mass range [ 0.53 , 2.7 ] MeV / c 2 interacting with electrons via a dark photon mediator. Taking advantage of the time-dependent signal we improve by ∼ 2 orders of magnitude on our previous limit obtained from the total rate of 1 e − events, using the same dataset. This daily modulation search represents the current strongest limit on DM-electron scattering via ultralight mediators for DM masses around 1 MeV / c 2 . Published by the American Physical Society 2024

Arnquist, I. (ORCID:0000000256438330)↗

Design of a low parasitic inductance SiC power module with double-sided cooling

In this paper, a low-parasitic inductance SiC power module with double-sided cooling is designed and compared with a baseline double-sided cooled module. With the unique 3D layout utilizing vertical interconnection, the power loop inductance is effectively reduced without sacrificing the thermal performance. Both simulations and experiments are carried out to validate the design. Q3D simulation results show a power loop inductance of 1.63 nH, verified by the experiment, indicating more than 60% reduction of power loop inductance compared with the baseline module. With 0Ω external gate resistance turn-off at 600V, the voltage overshoot is less than 9% of the bus voltage at a load of 44.6A.

Yang, Fei↗

Bond Wire Damage Detection and State of Health Estimation of a 1200V, 900A Dual Pack IGBT Power Module using the RL-Equivalent Circuit

Electrical and environmental stresses are the two dominant contributors in aging and failure of power semiconductor devices. Insulated gate bipolar junction transistors (IGBTs) and metal-oxide semiconductor field effect transistors (MOSFETs) are two most commonly used switching devices in power converter circuits. A significant portion of research effort is given in inventing innovative methods to estimate the degradation and fatigue in these devices. Until today, no other existing techniques can determine the number of lifted bond wires and their locations in a live IGBT module, although this information is extremely helpful to understand the overall state of health of an IGBT power module. In this paper, we have proposed a reflectometry-based technique to overcome this hurdle. The RL-equivalent circuit to represent a bond wire has been developed for the device under test and simulated in CST Studio Suite to measure the reflection amplitudes. Experimental results were obtained using a prototype reflectometry hardware, and both the simulation and experimental results have been compared. These results prove that with these two sets of measurements, it is possible to locate the aged device inside a module and detect the number of bond wire lift-offs associated to that device.

30 DIRECT ENERGY CONVERSION↗

Analysis and Evaluation of Thermally Annealed Pyrolytic Graphite Heat Spreader for Power Modules

Next generation power modules demand increased heat extraction capability along with reduced weight and volume. In this paper, thermally annealed pyrolytic graphite (TPG) is analyzed and compared with conventional materials used in power modules for thermal management. Fundamental properties of TPG are explained and compared with commonly used materials in power module heat spreaders and substrates. The encapsulated TPG based heat spreader is manufactured and compared with bulk copper in simulation and experimental based analysis. The results show that encapsulated TPG based heat spreader achieves more than 50% reduction in thermal resistance along with 48% reduction in weight in the heat spreader layer.

Gurpinar, Emre↗

SiC MOSFET Based Power Module Design and Analysis for EV Traction Systems

Wide bandgap (WBG) power semiconductor devices, specifically silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) have gained attention from electric vehicle (EV) system developers due to well-known superior properties in comparison to industry standard silicon (Si) based MOSFETs and insulated-gate bipolar transistors (IGBTs). In this work, a power module design based on SiC MOSFETs in a segmented two-level, three-phase inverter topology with 125 kW peak output power and 30 kHz switching frequency is presented. Three different SiC MOSFET die options are analyzed according to experimentally obtained operating conditions of a commercial EV traction system. Substrate design of the power module for multi-die layout, heat sink design, and integration of a segmented phase leg module are presented. Finite-element electrical and thermal analysis of the proposed system are presented and discussed.

Gurpinar, Emre↗

Harmonic Analysis of Common-mode Reduction Modulation for Three-level Inverter

This paper presents harmonic analysis of common-mode reduction (CMR) modulation for three-level voltage source inverters. The analytical model to calculate the harmonics of CMR modulation with arbitrary PWM sequence is developed. The impact of alternative PWM sequences of CMR modulation on harmonics is investigated. New three-state and four-state PWM sequences of CMR are proposed which spread the energy centered in the carrier frequency in the conventional CMR, and thus reduce the voltage peaks in frequency domain. Experiments are conducted on a three-level neutral point clamped inverter. Experiment results verify the developed analytical model and harmonic analysis.

Chen, Ruirui↗

Optimizing Sensor Count and Placement to Detect Bond Wire Lift-Offs and Surface Defects in High-Power IGBT Modules Using Low-Cost Piezo-Electric Resonators

This manuscript presents the most recent results and findings to identify bond wire lift-offs and surface defects in high-power isolated gate bipolar junction transistor (IGBT) modules. The authors of this manuscript formerly proposed a low-cost, piezoelectric resonator-based measurement unit to detect bond wire related degradation in larger IGBT modules. Since high-power IGBT modules are expensive, it was apparent that evaluating our proposed method by inducing controlled damage to fresh (new) IGBTs may not be cost-effective especially when multiple sets of data need to be captured by inducing damage to different levels. In order to overcome this limitation, IGBT bond wires have been mimicked using a 3D printed enclosure, a PCB, and copper wires with dimensions very closely resembling a real IGBT. Using this method, multiple test devices can be built at the cost of a real IGBT, and the proposed technique could be fine-tuned without damaging expensive, real IGBTs. Our recent findings can be used to determine real IGBT degradation and bond wire lift-offs using only two sensors, as opposed to six transducers used in the first iteration of the setup. In addition to optimizing the sensor count, we have also identified the best possible locations of these sensors by attempting multiple placements inside the IGBT casing.

condition monitoring↗

Situated Visualization of Photovoltaic Module Performance for Workforce Development

The rapid growth of the solar energy industry requires advanced educational tools to train the next generation of engineers and technicians. We present a novel system for situated visualization of photovoltaic (PV) module performance, leveraging a combination of PV simulation, sun-sky position, and head-mounted augmented reality (AR). Our system is guided by four principles of development: simplicity, adaptability, collaboration, and maintainability, realized in six components. Users interactively manipulate a physical module's orientation and shading referents with immediate feedback on the module's performance.

augmented reality↗

Updates on the Progress of the Alternate Topology Modulator (AT-HVCM) to support the Proton Power Upgrade (PPU) at the Spallation Neutron Source

The AT-HVCM, achieved by series-stacking the dual-function resonant filter capacitors following each rectification stage, is the baseline design for the PPU project at the SNS [1]. The project requires three AT-HVCM modulators to power 28 additional 700kW klystrons and associated high beta cavities to accelerate 38mA of beam current to 1.3GeV. Each modulator produces an 82 kV, 120A output pulse of 1.35ms duration at a 60Hz repetition rate. The AT design approach improves upon the existing HVCM topology, reducing stresses on the H bridge IGBTs using zero voltage (ZVS) and current switching (ZCS) techniques and on the resonant filter capacitors by limiting voltage reversal. This paper reviews the prototype development progress, currently focused on evaluating system reliability, and discusses some design techniques to achieve the modulator performance requirements.

Solley, Dennis J.↗

Automated Design-for-Reliability of a Power Electronics Module

The design of a power electronics module is a multiphysics problem and involves electrical, thermal, and reliability targets and constraints. Although the electrical and thermal design consider multiple aspects such as materials, geometry, and energy losses, reliability design is often limited to the selection of the attachment materials and electrical interconnect types. In this paper, we incorporate reliability metrics in the design phase by investigating the impact of package geometry on the thermomechanical behavior of the die-attachment material. To this end, we conducted thermal and power cycling simulations of a commercial six-pack power module with silicon carbide devices to compute junction temperature and strain energy density per cycle, respectively. We performed multiple simulations with different geometric dimensions and established a correlation between input features and output variables using subspace-based dimension reduction. The machine learning-based dimension reduction method serves as a surrogate model, which can be employed to identify the optimal module design from a thermal and reliability standpoint.

design-for-reliability↗

The Influence of PV Module Materials and Design on Solder Joint Thermal Fatigue Durability

Finite element model (FEM) simulations have been performed to elucidate the effect of flat plate photovoltaic (PV) module materials and design on PbSn eutectic solder joint thermal fatigue durability. The statistical method of Latin Hypercube sampling was employed to investigate the sensitivity of simulated damage to each input variable. Variables of laminate material properties and their thicknesses were investigated. Using analysis of variance, we determined that the rate of solder fatigue was most sensitive to solder layer thickness, with copper ribbon and silicon thickness being the next two most sensitive variables. By simulating both accelerated thermal cycles (ATCs) and PV cell temperature histories through two characteristic days of service, we determined that the acceleration factor between the ATC and outdoor service was independent of the variables sampled in this study. This result implies that an ATC test will represent a similar time of outdoor exposure for a wide range of module designs. This is an encouraging result for the standard ATC that must be universally applied across all modules.

14 SOLAR ENERGY↗

On Residual Stresses and Reference Temperatures in Thermomechanical Simulations of Photovoltaic Modules Using the Finite Element Method

Thermomechanical simulation of photovoltaic (PV) modules using the finite element method (FEM) is a useful tool to evaluate module design features in terms of structural integrity, reliability, and durability. One of the main challenges in the numerical modeling of a PV module is the incorporation of residual stresses induced by the manufacturing process. Modeling assumptions and abstractions are necessary to limit the model complexity and reduce the computational time. However, oversimplifications and incorrect assumptions can lead to erroneous numerical results. Unfortunately, much simulation work still neglects process-induced stresses. This can lead to incorrect predictions of the stress-strain history and erroneous conclusions during the design process. In this work, we review current modeling practices for incorporating process-induced stresses, and contrast numerical models that consider residual stresses with those that neglect them. We find that the simulation objective and available material properties dictate which process steps need to be modeled, and explore in depth the modeling of residual stresses induced by the lamination process. We demonstrate that a simplified cooldown procedure at the beginning of the simulation can increase the model accuracy and discuss appropriate choices for starting and reference temperatures in the finite element model.

14 SOLAR ENERGY↗

Intraday Outdoor Efficiency Changes in Metal-Halide Perovskite Photovoltaic Modules

Here, we present outdoor observations of metal-halide perovskite modules deployed in the Photovoltaic Accelerator for Commercializing Technologies center, which houses one of the world's broadest efforts to test metal-halide perovskite photovoltaic modules outdoors. As of January 2025, outdoor testing has encompassed over 150 modules from 14 different partners. Our findings illustrate how daily changes in efficiency, driven by exposure to light, affect field performance in real-world conditions. These effects cannot be explained by existing outdoor performance models and frustrate the notion of a traditional temperature coefficient.

14 SOLAR ENERGY↗

Printed Module Interconnects

Monolithic interconnects in photovoltaic modules connect adjacent cells in series, and are typically formed sequentially involving multiple deposition and scribing steps. Interconnect widths of 500 um every 10 mm result in 5% dead area, which does not contribute to power generation in an interconnected solar panel. This work expands on previous work that introduced an alternative interconnection method capable of producing interconnect widths less than 100 um. The interconnect is added to the module in a single step after deposition of the photovoltaic stack, eliminating the need for scribe alignment. This alternative method can be used for all types of thin film photovoltaic modules. Voltage addition with copper-indium-gallium-diselenide (CIGS) solar cells using a 2-scribe printed interconnect approach is demonstrated. Additionally, interconnect widths of 250 um are shown.

14 SOLAR ENERGY↗

Contactless Electroluminescence Imaging for Cell and Module Characterization

Module performance can be characterized by imaging using baseline and periodic images to track defects and degradation. Both thermal images, which can be acquired during sunny operating conditions, and photoluminescence images, which could be acquired at night, can be collected without electrical connection. Electroluminescence (EL) images, which are useful to detect many types of defects such as cracks, interconnect and solder faults, and resistances, have typically required electrical connection to drive current in the cells and modules. Here, a contactless EL imaging technique is proposed, which provides an EL image without the need for electrical connection to drive current through the module. Such EL imaging has the capability to be collected at night without disruption to daytime power generation.

14 SOLAR ENERGY↗

Module Degradation Mechanisms Studied by a Multi-Scale Approach

A key pathway to meeting the Department of Energy SunShot 2020 goals is to reduce financing costs by improving investor confidence through improved photovoltaic (PV) module reliability. A comprehensive approach to further understand and improve PV reliability includes characterization techniques and modeling from module to atomic scale. Imaging techniques, which include photoluminescence, electroluminescence, and lock-in thermography, are used to locate localized defects responsible for module degradation. Small area samples containing such defects are prepared using coring techniques and are then suitable and available for microscopic study and specific defect modeling and analysis.

14 SOLAR ENERGY↗

A Novel Approach to Thermal Design of Solar Modules: Selective-Spectral and Radiative Cooling

For commercial solar modules, up to 80% of the incoming sunlight may be dissipated as heat, potentially raising the temperature 20-30 degrees C higher than the ambient. In the long run, extreme self-heating may erode efficiency and shorten lifetime, thereby, dramatically reducing the total energy output by almost ~10% Therefore, it is critically important to develop effective and practical cooling methods to combat PV self-heating. In this paper, we explore two fundamental sources of PV self-heating, namely, sub-bandgap absorption and imperfect thermal radiation. The analysis suggests that we redesign the optical and thermal properties of the solar module to eliminate the parasitic absorption (selective-spectral cooling) and enhance the thermal emission to the cold cosmos (radiative cooling). The proposed technique should cool the module by ~10 degrees C, to be reflected in significant long-term energy gain (~ 3% to 8% over 25 years) for PV systems under different climatic conditions.

14 SOLAR ENERGY↗