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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,639 records · Page 91
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Circuit breaker cases

A flammable plastic part was duplicated dimensionally using a nonflammable material in place of the flammable plastic. The material used was L-3203-6 with a 16-hour post-cure at 400 F. Initial efforts were made to determine shrinkage tolerances required to produce a mold which would produce a finished, workable part. The final twenty-five circuit breaker cases were shipped and the metal inserts when installed, produced a workable breaker. Initial submissions of cases were rejected as lacking sufficient rigidity though they met all other requirements. The plastic cases weighed 16.5 grams, whereas the Refset cases weighed 17 grams, not meeting the less-weight requirement. The data on shrinkage determinations, and mold and part dimensions are shown. The method of manufacture is also reported.

Holmes, R. L.↗
NASA NTRS1972

Circuit performance of a parasitic-loading digital speed controller for a 400-hertz turbine-driven alternator

Parasitic speed controllers are used in space power electrical generating systems to maintain the speed of the turbine-driven alternators within specified limits. Selected subcircuits for a solid state parasitic-loading speed controller were assembled and tested. The test results as obtained to date consist of the performance evaluation of the frequency reference and the period counter subcircuits. These circuits performed as expected.

Ryan, J. P.↗
NASA NTRS1971

Quasioptical circuits relating to frequency multipliers.

Description of the various major components useful in a 30- to 60-GHz varactor doubler circuit employing quasi-optical techniques. A description is given of the required directional filters, waveguide tuners, and varactor mounts. An attempt is made to determine the potential efficiency of various quasi-optical multiplier mounts and also to compare the efficiency obtainable by quasi-optical techniques with that achievable in standard-waveguide multiplier mounts.

Kraemer, E.↗
NASA NTRS1972

GaAs IMPATT diodes for microstrip circuit applications.

GaAs IMPATT diodes with plated heat sinks are shown to be particularly well suited for microstrip circuit applications. Details of materials growth and device fabrication procedures are given, and experimental results are presented for a GaAs IMPATT microstrip oscillator operating at X band.

Wisseman, W. R.↗
NASA NTRS1971

Computer simulation of the thermal environment of large-scale integrated circuits - Computer time-saving techniques.

This paper is concerned with the computer costs for both the steady-state and transient thermal responses of large-scale integrated circuits (LSI) when metal is present within the substrate. For the more cost-sensitive transient case, an extrapolation technique for computer time savings is compared with the accuracy loss in this study. This approach could be useful for design-cost planning.

Thompson, R. R.↗
NASA NTRS1972

Techniques for control of long-term reliability of complex integrated circuits. I - Reliability assurance by test vehicle qualification.

Development of an alternate approach to the conventional methods of reliability assurance for large-scale integrated circuits. The product treated is a large-scale T squared L array designed for space applications. The concept used is that of qualification of product by evaluation of the basic processing used in fabricating the product, providing an insight into its potential reliability. Test vehicles are described which enable evaluation of device characteristics, surface condition, and various parameters of the two-level metallization system used. Evaluation of these test vehicles is performed on a lot qualification basis, with the lot consisting of one wafer. Assembled test vehicles are evaluated by high temperature stress at 300 C for short time durations. Stressing at these temperatures provides a rapid method of evaluation and permits a go/no go decision to be made on the wafer lot in a timely fashion.

Van Vonno, N. W.↗
NASA NTRS1972

Shielded silicon gate complementary MOS integrated circuit.

An electrostatic shield for complementary MOS integrated circuits was developed to minimize the adverse effects of stray electric fields created by the potentials in the metal interconnections. The process is compatible with silicon gate technology. N-doped polycrystalline silicon was used for all the gates and the shield. The effectiveness of the shield was demonstrated by constructing a special field plate over certain transistors. The threshold voltages obtained on an oriented silicon substrate ranged from 1.5 to 3 V for either channel. Integrated inverters performed satisfactorily from 3 to 15 V, limited at the low end by the threshold voltages and at the high end by the drain breakdown voltage of the n-channel transistors. The stability of the new structure with an n-doped silicon gate as measured by the shift in C-V curve under 200 C plus or minus 20 V temperature-bias conditions was better than conventional aluminum gate or p-doped silicon gate devices, presumably due to the doping of gate oxide with phosphorous.

Lin, H. C.↗
NASA NTRS1973

Carrier extraction circuit

Feedback loop extracts demodulated reference signals from IF input and feeds signal back to demodulator. Since reference signal is extracted directly from carrier, no separate reference need be transmitted. Circuit obtains coherent carrier from balanced or unbalanced four-phase signal of varying characteristics.

Solomon, K.↗
NASA NTRS1973

Complementary MOS four-phase logic circuits

Technique can provide four-phase clock signal from single-phase clock and requires only one power supply voltage. This arrangement saves considerable power compared to circuits having load resistor between power supply and ground.

Petersen, H. L.↗
NASA NTRS1973

Operational slope-limiting circuit

Circuit limits slope of arbitrary waveform to avoid exceeding rate limit of subsequent amplifier, or to form trapezoidal wave with adjustable rise and fall rates from square wave of arbitrary frequency. Integrator provides delay needed to develop output waveform. DC coupling is used to preserve original dc offset.

Engel, A.↗
NASA NTRS1973

Meter circuit for tuning RF amplifiers

Circuit computes and indicates efficiency of RF amplifier as inputs and other parameters are varied. Voltage drop across internal resistance of ammeter is amplified by operational amplifier and applied to one multiplier input. Other input is obtained through two resistors from positive terminal of power supply.

Longthorne, J. E.↗
NASA NTRS1973

Welded printed circuit (pc) stick

Printed-circuit stick module has reduced comb technique to six steps, cutting process time by approximately 50%. Method incorporates all type of components into one assembly. It reduces design and fabrication time for 14-lead flat pack to less than four hours and for the 22-lead flat pack to four hours. Average weight of each flat pack is also reduced to 2 g.

Kreis, F.↗
NASA NTRS1971

Development of a plan for automating integrated circuit processing

The operations analysis and equipment evaluations pertinent to the design of an automated production facility capable of manufacturing beam-lead CMOS integrated circuits are reported. The overall plan shows approximate cost of major equipment, production rate and performance capability, flexibility, and special maintenance requirements. Direct computer control is compared with supervisory-mode operations. The plan is limited to wafer processing operations from the starting wafer to the finished beam-lead die after separation etching. The work already accomplished in implementing various automation schemes, and the type of equipment which can be found for instant automation are described. The plan is general, so that small shops or large production units can perhaps benefit. Examples of major types of automated processing machines are shown to illustrate the general concepts of automated wafer processing.

Source record↗
NASA NTRS1973

Computerized logic design of digital circuits

This manual presents a computer program that performs all the work required for the logic design of digital counters or sequential circuits and the simplification of Boolean logic expressions. The program provides both the experienced and inexperienced logic designer with a comprehensive logic design capability. The manual contains Boolean simplification and sequential design theory, detailed instructions for use of the program, a large number of illustrative design examples, and complete program documentation.

Sussow, S.↗
NASA NTRS1972

Hierarchical hybrid control of manipulators: Artificial intelligence in large scale integrated circuits

Both in practical engineering and in control of muscular systems, low level subsystems automatically provide crude approximations to the proper response. Through low level tuning of these approximations, the proper response variant can emerge from standardized high level commands. Such systems are expressly suited to emerging large scale integrated circuit technology. A computer, using symbolic descriptions of subsystem responses, can select and shape responses of low level digital or analog microcircuits. A mathematical theory that reveals significant informational units in this style of control and software for realizing such information structures are formulated.

Greene, P. H.↗
NASA NTRS1972

Extended life testing evaluation of complementary MOS integrated circuits

The purpose of the extended life testing evaluation of complementary MOS integrated circuits was twofold: (1) To ascertain the long life capability of complementary MOS devices. (2) To assess the objectivity and reliability of various accelerated life test methods as an indication or prediction tool. In addition, the determination of a suitable life test sequence for these devices was of importance. Conclusions reached based on the parts tested and the test results obtained was that the devices were not acceptable.

Brosnan, T. E.↗
NASA NTRS1973

Circuit board package with wedge shaped covers

A circuit board packaging and mounting technique that protects the wiring board from vibrations and contamination is described. The technique also augments chassis rigidity and damping and conducts component generated heat to the chassis.

Pesek, C. T.↗