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A theoretical analysis is presented for the hot-wire anemometer to determine the differences in resistance characteristics as given by King's equation for an infinite wire length and those given by the additional considerations of (a) a finite length of wire with heat loss through its ends and (b) heat loss due to a nonlinear function of the temperature difference between the wire and the air.
Because wire failure in aerospace vehicles could be catastrophic, smart wiring capabilities have been critical for NASA. Through the years, researchers at Kennedy Space Center (KSC) have developed technologies, expertise, and research facilities to meet this need. In addition to aerospace applications, NASA has applied its knowledge of smart wiring, including self-healing materials, to serve the aviation industry. This webinar will discuss the development efforts of several wiring technologies at KSC and provide insight into both current and future research objectives.
NASA is currently working on developing motors for hybrid electric propulsion applications in aviation. To make electric power more feasible in airplanes higher power to weight ratios are sought for electric motors. One facet to these efforts is to improve (increase) the conductivity and (lower) density of the magnet wire used in motors. Carbon nanotubes (CNT) and composites containing CNT are being explored as a possible way to increase wire conductivity and lower density. Presented here are measurements of the current carrying capacity (ampacity) of a composite made from CNT and copper. The ability of CNT to improve the conductivity of such composites is hindered by the presence of semiconductive CNT (s-CNT) that exist in CNT supplies naturally, and currently, unavoidably. To solve this problem, and avoid s-CNT, various preferential growth and sorting methods are being explored. A supply of sorted 95 metallic CNT (m-CNT) was acquired in the form of thick film Buckypaper (BP) as part of this work and characterized using Raman spectroscopy, resistivity, and density measurements. The ampacity (Acm2) of the Cu-5volCNT composite was 3.8 lower than the same gauge pure Cu wire similarly tested. The lower ampacity in the composite wire is believed to be due to the presence of s-CNT in the composite and the relatively low (proper) level of longitudinal cooling employed in the test method. Although Raman spectroscopy can be used to characterize CNT, a strong relation between the ratios of the primary peaks GGand the relative amounts of m-CNT and s-CNT was not observed. The average effective conductivity of the CNT in the sorted, 95 m-CNT BP was 2.5 times higher than the CNT in the similar but un-sorted BP. This is an indication that improvements in the conductivity of CNT composites can be made by the use of sorted, highly conductive m-CNT.
The Icing Research Tunnel (IRT) at NASA Glenn Research Center has been using the SEA Multi-Element Sensor (aka, the multi-wire) as its primary liquid water content instrument since 2011. Recent tests in the IRT with four different multi-wire probes (i.e., different serial numbers) have indicated situations that can result in biasing of the probe data. The reference data used in this report are multi-wire data that have been proven to agree well with the icing blade in low-impingement rate conditions. Data from these recent tests suggest that the presence of a canister probe located 4.45 ft axially downstream and 2.5 ft to the side may have caused multi-wire data to read around 5% low at an airspeed of 150 kts. Additionally, two probes of different serial numbers were observed to measure 5-15% lower than the reference probes, and the causes have been linked to excessive solder on the sensing element and to an out of date element calibration. For these reasons, the authors suggest the community be aware of the possible aerodynamic influences on the probe inlet and outlet, as well as the importance of regular calibration and maintenance of the probes.
The Icing Research Tunnel (IRT) at NASA Glenn Research Center has been using the SEA Multi-Element Sensor (aka, the multi-wire) as its primary liquid water content instrument since 2011. Recent tests in the IRT with four different multi-wire probes (i.e., different serial numbers) have indicated situations that can result in biasing of the probe data. The reference data used in this report are multi-wire data that have been proven to agree well with the icing blade in low-impingement rate conditions. Data from these recent tests suggest that the presence of a canister probe located 4.45 ft axially downstream and 2.5 ft to the side may have caused multi-wire data to read around 5% low at an airspeed of 150 kts. Additionally, two probes of different serial numbers were observed to measure 5-15% lower than the reference probes, and the causes have been linked to excessive solder on the sensing element and to an out of date element calibration. For these reasons, the authors suggest the community be aware of the possible aerodynamic influences on the probe inlet and outlet, as well as the importance of regular calibration and maintenance of the probes.
Automatic reel on automatic welding equipment takes up slack in the reel-fed filler wire when welding operation is terminated. The reel maintains constant, adjustable tension on the wire during the welding operation and rewinds the wire from the wire feed unit when the welding is completed.
Loop of flexible, small diameter, nickel wire protects metal oxide silicon /MOS/ transistors from a damaging electrostatic potential. The wire is attached to a music-wire spring, slipped over the MOS transistor case, and released so the spring tensions the wire loop around all the transistor leads, shorting them together. This allows handling without danger of damage.
Dual feed mechanism enables proportioning of two different weld feed wires during automated TIG welding to produce a weld alloy deposit of the desired composition. The wires are fed into the weld simultaneously. The relative feed rates of the wires and the wire diameters determine the weld deposit composition.
Wire-dispensing tool which resembles mechanical pencil is used to wrap magnet wire around integrated circuit terminals uniformly and securely without damaging insulative coating on wire. Tool is hand-held and easily manipulated to execute wire wrapping movements.
Device recognizes variations in wire size and is being used during computer memory-plane fabrication. Decrease in wire diameter, due to stretching, permits removal of wire from memory-plant mold. Monitoring provides means of detecting imperfect wire and permits fabrication of computer memory plane to be stopped prior to its insertion into mold.
Using half-round reinforcing wires, electrodeposited matrix metal readily fills spaces between wires in intimate contact with wires and without voids. Procedure combines advantages of electroforming with high-strength of commonly available wire to produce non-welded shell structures for high pressure uses.
A digital fly-by-wire flight control system has been installed in an F-8C test airplane and has undergone extensive ground and flight testing as part of an overall program to develop digital fly-by-wire technology. This is the first airplane to fly with a digital fly-by-wire system as its primary means of control and with no mechanical reversion capability. Forty-two test flights were made for a total flight time of 57 hours. Six pilots participated in the evaluation. This paper presents an overview of the digital fly-by-wire program and discusses some of the flight-test results.
The feasibility of using digital fly-by-wire systems to control aircraft was demonstrated by developing and flight testing a single channel system, which used Apollo hardware, in an F-8C test airplane. This is the first airplane to fly with a digital fly-by-wire system as its primary means of control and with no mechanical reversion capability. The development and flight test of a triplex digital fly-by-wire system, which will serve as an experimental prototype for future operational digital fly-by-wire systems, is underway.
The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.
The feasibility of using digital fly by wire systems to control aircraft was demonstrated by developing and flight testing a single channel system, which used Apollo hardware, in an F-8C test airplane. This is the first airplane to fly with a digital fly by wire system as its primary means of control and with no mechanical reversion capability. The development and flight test of a triplex digital fly by wire system, which will serve as an experimental prototype for future operational digital fly by wire systems, are underway.
The printed wiring board system provides automated techniques for the design of printed circuit boards and hybrid circuit boards. The system consists of four programs: (1) the preprocessor program combines user supplied data and pre-defined library data to produce the detailed circuit description data; (2) the placement program assigns circuit components to specific areas of the board in a manner that optimizes the total interconnection length of the circuit; (3) the organizer program assigns pin interconnections to specific board levels and determines the optimal order in which the router program should attempt to layout the paths connecting the pins; and (4) the router program determines the wire paths which are to be used to connect each input pin pair on the circuit board. This document is intended to serve as a programmer's reference manual for the printed wiring board system. A detailed description of the internal logic and flow of the printed wiring board programs is included.
Semi-automatic-wire labeling equipment installs heat-shrink identification sleeves on small-diameter wires for moderate-size production runs. Supply reel contains wire of desired diameter and is cut into lengths set on the measuring rolls. Required number of identification sleeves are slipped over wire, which is then placed through sleeve-releasing mechanism. Sleeves are shrunk at 350 degrees F in an infrared oven.
A hot wire anemometer is described which has a body formed of heat resistant metal such as an alloy high in nickel content which supports a probe wire disposed in a V groove in the body. The V groove contains a high temperature ceramic adhesive that partially encompasses the downstream side of the probe wire. Mechanical and electrical connection to the probe wire is achieved through conductive support rods that are constructed of the same high temperature metal, insulation between the body and the conductor rods being provided by a coating of an oxide of the same material which coating is formed in situ. The oxide coating insulates the conductor rods from the body, mechanically fixes the conductors within the body, and maintains its integrity at elevated temperatures.