Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “thermal resistance”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 163 records · Page 9

NARloy-Z-Carbon Nanotube Composites

Motivation: (1) NARloy-Z (Cu-3%Ag-0.5%Zr) is the state of the art, high thermal conductivity structural alloy used for making liquid rocket engine main combustion chamber liner. It has a Thermal conductivity approx 80% of pure copper. (2) Improving the thermal conductivity of NARloy-Z will help to improve the heat transfer efficiency of combustion chamber. (3)Will also help to reduce the propulsion system mass and increase performance. It will also increases thrust to weight ratio. (4) Improving heat transfer helps to design and build better thermal management systems for nuclear propulsion and other applications. Can Carbon nanotubes (CNT) help to improve the thermal conductivity (TC)of NARloy-Z? (1)CNT's have TC of approx 20X that of copper (2) 5vol% CNT could potentially double the TC of NARloy-Z if properly aligned (3) Improvement will be less if CNT s are randomly distributed, provided there is a good thermal bond between CNT and matrix. Prior research has shown poor results (1) No TC improvement in the copper-CNT composite reported (2)Reported values are typically lower (3) Attributed to high contact thermal resistance between CNT and Cu matrix (4)Results suggest that a bonding material between CNT and copper matrix is required to lower the contact thermal resistance It is hypothesized that Zr in NARloy-Z could act as a bonding agent to lower the contact thermal resistance between CNT and matrix.

Bhat, Biliyar N.↗

Modeling Thermal Contact Resistance

One difficulty in using cryocoolers is making good thermal contact between the cooler and the instrument being cooled. The connection is often made through a bolted joint. The temperature drop associated with this joint has been the subject of many experimental and theoretical studies. The low temperature behavior of dry joints have shown some anomalous dependence on the surface condition of the mating parts. There is also some doubts on how well one can extrapolate from the test samples to predicting the performance of a real system. Both finite element and analytic models of a simple contact system have been developed. The model assumes (a) the contact is dry (contact limited to a small portion of the total available area and the spaces in-between the actual contact patches are perfect insulators), (b) contacts are clean (conductivity of the actual contact is the same as the bulk), (c) small temperature gradients (the bulk conductance may be assumed to be temperature independent), (d) the absolute temperature is low (thermal radiation effects are ignored), and (e) the dimensions of the nominal contact area are small compared to the thickness of the bulk material (the contact effects are localized near the contact). The models show that in the limit of actual contact area much less than the nominal area (a much less than A), that the excess temperature drop due to a single point of contact scales as a(exp -1/2). This disturbance only extends a distance approx. A(exp 1/2) into the bulk material. A group of identical contacts will result in an excess temperature drop that scales as n(exp -1/2), where n is the number of contacts and n dot a is constant. This implies that flat rough surfaces will have a lower excess temperature drop than flat polished surfaces.

Kittel, Peter↗

Spin-caloric resistance of Dirac plasma in a graphene Corbino device

The thermal resistance of a spin-polarized hydrodynamic Dirac plasma in graphene is considered. Here, a mechanism for the coupling of heat and spin flows is discussed, demonstrating that spin diffusion and spin thermocurrent modify viscous dissipation, leading to a significant enhancement of thermal resistance. Practical calculations are then presented for graphene devices in the Corbino geometry.

Graphene↗

Module-Level Thermal Interface Material Degradation in HALT

Abstract In this study, thermal interface material (TIM) degradation is driven through highly accelerated life test (HALT) using temperature cycling with a prescribed vibrational acceleration for two commercially available materials having thermal conductivities of 6.0 and 8.5 W/m K. HALT specimens were prepared by applying TIM through a 4-mil stencil over AlSiC baseplates in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples to characterize the thermal resistance across the baseplate and TIM layer. Thermal dissipation into the top of the baseplates was provided by a custom heating block, which mimics the size and placement of the die junctions in CAS325 modules, applying power loads of 200, 300, and 400 W. After initial characterization, samples were transferred to the HALT chamber with one set of samples exposed to temperature cycling only (TCO) and the other temperature cycling and vibration (TCV). Both sample sets were cycled between temperature extremes of −40 °C and 180 °C with vibrations applied at a peak acceleration of 3.21 Grms. After hundreds of cycles, samples were reevaluated to assess changes in thermal resistance to provide an accelerated measure of TIM degradation. This allows for reliability prediction of useful lifetime (illustrated in a solar inverter case study herein), as well as to provide a basis for developing an accelerated testing method to related temperature cycling to faster methods of degradation. Such techniques provide a means to develop maintenance schedules for power modules for ensuring sufficient thermal performance over the operating lifetime.

Engineering↗

Synthesis and Thermal Oxidation Resistance of Boron-Rich Boron–Carbide Material

A boron-rich boron–carbide material (B4+δC) was synthesized by spark plasma sintering of a ball-milled mixture of high-purity boron powder and graphitic carbon at a pressure of 7 MPa and a temperature of 1930 °C. This high-pressure, high-temperature synthesized material was recovered and characterized by X-ray diffraction, X-ray photoelectron spectroscopy, Raman spectroscopy, Vickers hardness measurements, and thermal oxidation studies. The X-ray diffraction studies revealed a single-phase rhombohedral structure (space group R-3m) with lattice parameters in hexagonal representation as a = 5.609 ± 0.007 Å and c = 12.082 ± 0.02 Å. The experimental lattice parameters result in a value of δ = 0.55, or the composition of the synthesized compound as B4.55C. The high-resolution scans of boron binding energy reveal the existence of a B-C bond at 188.5 eV. Raman spectroscopy reveals the existence of a 386 cm−1 vibrational mode representative of C-B-B linear chain formation due to excess boron in the lattice. The measured Vickers microhardness at a load of 200 gf shows a high hardness value of 33.8 ± 2.3 GPa. Thermal gravimetric studies on B4.55C were conducted at a temperature of 1300 °C in a compressed dry air environment, and its behavior is compared to other high-temperature ceramic materials such as high-entropy transition metal boride. The high neutron absorption cross section, high melting point, high mechanical strength, and thermal oxidation resistance make this material ideal for applications in extreme environments.

36 MATERIALS SCIENCE↗

Retrofittable Thermal Switches for Dynamic Building Envelopes Integrated with Thermal Energy Storage: Preprint

Buildings in the United States consume about 40 quadrillion BTU of primary energy annually, which accounts for the nation's 40% of total energy use, 75% of all electricity use, and 35% of the net carbon emissions. Deploying thermal energy storage in the form of phase change material (PCM) in building envelopes is an effective method to reduce space heating/cooling loads, provide load shedding, and shift demand to periods of lower energy cost. However, the full potential of PCM-integrated envelopes can only be realized if the PCM undergoes complete phase change using free ambient heating/cooling, and the stored energy is effectively transferred between the exterior and the interior environments. Conventional thermal insulation (with a fixed thermal resistance) limits PCM utilization, particularly with the increasing emphasis on higher R-value in building envelopes, which negatively affects the energy-saving potential of a PCM-integrated envelope. In contrast, dynamic building envelopes integrated with PCMs provide the option of varying the thermal resistance based on the indoor and outdoor conditions, thereby enhancing utilization of free ambient cooling and heating to charge/discharge the PCM thermal storage, reducing the buildings' heating and cooling load, and shifting the peak energy demand. In this study, we demonstrate innovative retrofittable thermal switches in the form of the insertable plugs inside an insulation to provide variable thermal resistance depending on the operating temperature and direction of temperature gradient, thus allowing preferential directional heat flow. Notably, they are passive in nature, requiring no external power, and work solely based on the ambient temperature.

buildings↗

Improvements in contact resistivity and thermal stability of Au-contacted InP solar cells

Specific contact resistivities for as-fabricated Au contacts on n-p InP solar cells are typically in the 10(exp -3) ohm/sq cm range, but contact resistivities in the 10(exp -6) ohm/sq cm range can be obtained if the cells are heat treated at 400 C for a few minutes. This heat treatment, however, results in a dramatic drop in the open circuit voltage of the cell due to excessive dissolution of the emitter into the metallization. It was found that low values of contact resistivity can be secured without the accompanying drop in the open circuit voltage by adding Ga and In in the Au metallization. It is shown that Au contacts containing as little as 1 percent atomic Ga can suppress the reaction that takes place at the metal-InP interface during heat treatment, while exhibiting contact resistivity values in the low 10(exp -5) ohm/sq cm. Detailed explanations for the observed superior thermal stability of these contacts are presented.

Fatemi, Navid S.↗

Heat Transfer Experiments of Ribbed, Serpentine Cooling Passages with Supercritical CO2

The results of heat transfer experiments with supercritical CO2 (sCO2) to capture the performance of ribbed, serpentine cooling passages for Reynolds numbers in the range of 100,000 - 400,000 are presented. The oxy-combustion turbine operating in an Allam-Fetvedt cycle has a turbine inlet temperature exceeding 1100°C, necessitating internally cooled turbine blades due to material creep strength limits. Reynolds numbers for sCO2, with its combination of high fluid density and low viscosity, can be up to an order of magnitude higher than comparable internal cooling conditions for an air-breathing engine where the majority of experimental data exists. To improve the prediction of cooling performance through turbulated passages, a test rig was designed and constructed with interchangeable insert capability for operation in sCO2 with heat transfer from a heater outlet flow stream to a lower temperature recuperator outlet flow stream. The inserts included serpentine passage geometry with five passes, one of the inserts including chevron ribs and the other a plain wall. The multi-pass serpentine geometry allowed for the evaluation of the effects 180 deg. tip turns have on the return passage flow characteristics, as they can depart significantly from fully-developed flow characteristics. The test procedure included the use of a modified Wilson plot method, with hot flow stream conditions kept effectively constant so that monitored changes in the overall thermal resistance could be attributed to manipulations in cooling flow stream conditions. Conditions during testing consisted of test section pressures of approximately 180 bar, cooling flow stream temperature of 175°C and hot flow stream temperature of 410°C. Test points at discrete cool flow Reynolds numbers up to 400,000 demonstrated an expected trend of decreased fluid thermal resistance with increasing Reynolds number, while at comparable Reynolds number there was an exhibited lower thermal resistance and higher passage pressure drop for the ribbed insert compared to the plain-walled insert. Processing of test data included establishment of Nusselt number enhancement ratios, so that for different internal cooling passage dimensions in the actual turbine blade at comparable Reynolds number the ratio could be applied to predict cooling performance.

Marshall, Michael↗

SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm 2

Thermal management has become a major barrier in the development of high-power micro-devices. Microchannel heat sinks (MCHS) are a promising method to dissipate high heat fluxes from high power density devices. Reducing the thermal resistance will reduce the temperature increase of the electronic device, allowing for higher powers to be achieved while maintaining a safe operating temperature. This paper reports on the use of silicon carbide (Sic) microchannels to dissipate high heat fluxes up to 1 kW/cm 2 over a footprint of 0.25 cm 2 . The use of high aspect ratio and decreased hydraulic diameter channels has allowed for very low thermal resistances to be achieved at higher heat duties compared to previous studies. The experiments performed resulted in heater temperatures of less than 60 °C and thermal resistances as low as 0.024 cm 2 . ° $C$/W between the heater surface and fluid inlet temperature. In conclusion, the demonstrated thermal performance of the SiC MCHS is an encouraging means for dissipating heat from high power density microelectronic devices.

42 ENGINEERING↗

High throughput, spatially resolved thermal properties measurement using attachable and reusable 3ω sensors

The 3ω method is a well-established thermal technique used to measure the thermal conductivity of materials and the thermal resistance of interfaces. It has significant advantages over other steady state and transient thermal techniques in its ability to provide spatially resolved thermal property measurements over a wide range of thermal conductivity. Despite its advantages, it has been restricted to lab-scale use because of the difficulty involved in sample preparation and sensor fabrication and is limited to non-metallic substrates. High-throughput 3ω measurements with reusable sensors have not been realized yet. In this work, we demonstrate a method of applying reusable 3ω sensors fabricated on flexible polyimide films to measure bulk and spatially resolved thermal properties. Here, we establish the limits of thermal conductivity measurement with the method to be 1 to 200 W/mK, and within the measurement limit, we verify the method by comparing the measured thermal conductivities of standard samples with established values. From the 3ω measurements, we also determine the thermal resistance of an interlayer of thermal grease as a function of pressure and compare it against the resistance calculated from direct thickness measurements to demonstrate the ability of this method to provide spatially resolved subsurface information. The technique presented is general and applicable to both metallic and non-metallic substrates, providing a method for high-throughput 3ω measurements with reusable sensors and without considerable sample preparation.

47 OTHER INSTRUMENTATION↗

High flux boiling heat transfer enhancement using triangle shaped vertical walls in two-phase microchannel heat exchangers

Two-phase heat exchangers allow heat loads to be dissipated with lower fluid flow rates without inducing thermal gradients, and high surface area microchannels further reduce the thermal resistance of these heat exchangers. However, there are many practical limits that prevent widespread use of two-phase microchannel heat exchangers. Many authors have looked to address these practical limits by treating the channel floors or creating artificial nucleation sites. Few works look to enhance heat transfer in the walls of channels with hydraulic diameters below 200 μm. This work is aimed at increasing the efficacy of high aspect ratio silicon microchannels that use R134a as the working fluid. The 125 parallel channels are 40 μm wide, 200 μm deep, and 2 mm long and contain a 15 μm wide, 150 μm long restriction at each inlet. The thermal resistance and dryout characteristics of traditional, plain-walled channels are compared to channels with 2 area enhancement patterns each of which increases the area available for heat transfer by 41%. Furthermore, a resistance to dryout is seen in both area-enhanced test sections, and a 15.5% reduction in thermal resistance is shown for the area-enhanced part with a 6 μm triangular pitch. Only a 7.8% performance increase is seen in the test section with a 3 μm pitch. Both area enhancement patterns induce an average 27% increase in pressure drop for all tests. Heat transfer characteristics are solved for using a finite element analysis (FEA) model. By examining heat transfer coefficients and local heat fluxes, it is postulated that the area enhancement reduces heat transfer coefficients and the performance increase is caused by increasing the number of active nucleation sites.

42 ENGINEERING↗

Path Toward a Breeding, Proliferation-Resistant, Thermal-Spectrum Molten Salt Reactor

Liquid-fueled, thermal-spectrum molten salt breeder reactors (TS-MSBRs) offer the potential for affordable, safe, inexhaustible energy with minimal potential for nuclear material misuse and without significant actinide waste generation. Realizing the full set of TS-MSBR capabilities is only now becoming possible with the advent of advanced fuel-salt processing techniques, improved materials, and a more detailed understanding of fuel-salt properties. Additionally, modern higher-fidelity modeling and simulation methods enable a more detailed evaluation of TS-MSBR design options. TS-MSBRs, however, remain immature and will require substantial, sustained development resources.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

The continuous push to increase power densities of electric vehicle (EV) traction drive systems necessitates combining electric motor and power electronics into one unit. A single, compact traction drive unit with fewer interconnecting components also facilitates fast, automated assembly of electric vehicles, driving production costs down and enabling wider adoption of EVs. There are a number of challenges associated with the integration of power electronics with the electric machine, including thermal management of the combined traction drive system. However, one important benefit of integration from the thermal management system perspective is the potential for using a single fluid loop instead of two separate cooling systems for the electric machine and the power electronics/inverter. This paper reviews several integration approaches and, employing finite element analysis (FEA), compares thermal management solutions for the combined electric machine and power electronics systems. Namely, three different scenarios are modeled: (1) independent component (motor and power electronics) cooling, which is compared to the combined cooling system approach for (2) radially and (3) axially integrated power electronics modules into the motor enclosure. Temperature distributions for selected thermal loads and thermal resistances from the key heat-generating components to the cooling fluid are compared for each scenario.

47 OTHER INSTRUMENTATION↗

Nanoscale laser flash measurements of diffuson transport in amorphous Ge and Si

The thermal properties of amorphous materials have attracted significant attention due to their technological importance in electronic devices. In addition, the disorder-induced breakdown of the phonon gas model makes vibrational transport in amorphous materials a topic of fundamental interest. In the past few decades, theoretical concepts, such as propagons, diffusons, and locons, have emerged to describe different types of vibrational modes in disordered solids. However, experiments can struggle to accurately determine which types of vibrational states carry the majority of the heat. In this study, we use nanoscale laser flash measurements (front/back time-domain thermoreflectance) to investigate thermal transport mechanisms in amorphous Ge and amorphous Si thin-films. We observe a nearly linear relationship between the amorphous film’s thermal resistance and the film’s thickness. The slope of the film’s thermal resistance vs thickness corresponds to a thickness-independent thermal conductivity of 0.4 and 0.6 W/(m K) for a-Ge and a-Si, respectively. This result reveals that the majority of heat currents in amorphous Si and Ge thin films prepared via RF sputtering at room temperature are carried by diffusons and/or propagons with mean free paths less than a few nanometers.

36 MATERIALS SCIENCE↗

Assess The Water Resistance And Thermal Performance Of Pre-flashing Methods When Adding Continuous Insulation During Re-siding (AIRS)

Retrofitting existing buildings by adding continuous insulation during re-siding projects has become a popular method for enhancing energy efficiency, especially given the aging building stock and stricter energy codes. When properly integrated with existing window systems, continuous insulation can significantly improve thermal performance, but it also presents challenges related to water resistance and building envelope integrity. Research indicates that the interface between windows and wall assemblies is critical as improper installation or sealing can lead to water intrusion, materials deterioration, and energy loss. Moreover, studies show that fully integrating the windows with the insulation layer can reduce window heat loss by up to 40%, emphasizing the importance of optimizing window placement and sealing during retrofitting to ensure both energy efficiency and structural performance. In this study, we conducted experimental tests to evaluate the water penetration and thermal performance of two window types: an aluminum window with a 2-inch installation fin and a wood window, representing typical mid-20th century designs. Using the Heat, Air, and Humidity (HAM) chamber at Oak Ridge National Laboratory (ORNL), we assessed bulk water penetration and performed COMSOL analysis for thermal flux and examined the effectiveness of different pre-flashing methods, i.e., standard self-adhered flashing tape and high-performance flashing tape with low-expansion foam, to enhance water resistance. The results indicate that applying proper flashing techniques and moisture management strategies can mitigate these risks, improving the overall performance and durability of retrofitted buildings. Additionally, proper sealing during retrofitting is essential, as improper installation can lead to moisture issues that compromise both energy efficiency and structural integrity.

Shen, Zhenglai [ORNL]↗

Thermal shock resistance of additively manufactured alumina

The mechanical behavior and cracking patterns of thermally-shocked additively manufactured alumina were investigated. The flexural strength of test specimens that had been heated to temperatures ranging from 200°C to 1000°C and then rapidly quenched in water was determined at ambient temperature by four-point bending. Results indicated that the surface cracking patterns had a multifractal structure and that an increase in the thermal shock temperature led to an increase in the density and uniformity of the crack network. Further, the flexural strength results were analyzed with Weibull statistics, where the Weibull moduli for most of the thermal shock conditions tested were found to be statistically indistinguishable. It was also found that a significant decrease (~50%) in flexural strength occurred for heating temperatures ≥300°C. The effect of the manufacturing method on cracking patterns is discussed, as well as the implication of the material behavior for practical applications of these materials.

36 MATERIALS SCIENCE↗