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At least 163 records · Page 9

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NASA NTRS2008

Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation

Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗

NASA NTRS2000

Extreme Winter/Early-Spring Temperature Anomalies in Central Europe

Extreme seasonal fluctuations of the surface-air temperature characterize the climate of central Europe, 45-60 deg North Temperature difference between warm 1990 and cold 1996 in the January-March period, persisting for more than two weeks at a time, amounted to 18 C for extensive areas. These anomalies in the surface-air temperature stem in the first place from differences in the low level flow from the eastern North-Atlantic: the value of the Index 1na of southwesterlies over the eastern North-Atlantic was 8.0 m/s in February 1990, but only 2.6 m/ s in February 1996. The primary forcing by warm advection to positive anomalies in monthly mean surface temperature produced strong synoptic-scale uplift at the 700 mb level over some regions in Europe. The strong uplift contributed in 1990 to a much larger cloud-cover over central Europe, which reduced heat-loss to space (greenhouse effect). Thus, spring arrived earlier than usual in 1990, but later than usual in 1996.

Otterman, Joseph↗

NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗

NASA NTRS2011

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard↗

NASA NTRS2008

Development of a Temperature Sensor for Jet Engine and Space Missions Environments

Electronic systems in aerospace and in space exploration missions are expected to encounter extreme temperatures and wide thermal swings. To address the needs for extreme temperature electronics, research efforts exist at the NASA Glenn Research Center (GRC) to develop and evaluate electronics for extreme temperature operations, and to establish their reliability under extreme temperature operation and thermal cycling; conditions that are typical of both the aerospace and space environments. These efforts are supported by the NASA Fundamental Aeronautics/Subsonic Fixed Wing Program and by the NASA Electronic Parts and Packaging (NEPP) Program. This work reports on the results obtained on the development of a temperature sensor geared for use in harsh environments.

Patterson, Richard L.↗

NASA NTRS2011

TPSAS-NF1676L-11812-DND

Reducing the weight of spacecraft will reduce the fabrication costs and the launch costs . The elimination of wiring and wiring harnesses reduces the total mass of the vehicle . Wireless sensor technology can reduce the weight and therefore the costs of spacecraft . The Decadal Survey of Civil Aeronautics survey identified that "self-powered, wireless microelectromechanical sensors" warrant attention over the next decade . Current wireless sensor systems have low data rates and require batteries. The environment of aerospace vehicles is often very harsh, with temperature extremes ranging from cryogenic to very high temperatures during re-entry. For example, X-37B mini unmanned shuttle will require high temperature sensors mounted on the structure, as well as cryogenic sensors for monitoring fuel tanks. Batteries do not work well in either temperature extremes. Also, sensors are typically located in internal structures with limited access, making the periodic changing of batteries costly and time consuming. Passive wireless sensors are needed that operate across an extremely large temperature range and do not require batteries. NASA recently instrumented an all Composite Crew Module for structural testing on the ground. Wireless sensors could have reduced the time to instrument the module and check out the sensor wiring.

W (Cy) Wilson↗

NASA NTRS2016

Technology Development and Design of a Hybrid Mars Ascent Vehicle Concept

Hybrid propulsion has been investigated as an enhancing technology for a Mars Ascent Vehicle (MAV) concept as part of potential Mars Sample Return (MSR) because of its high specific impulse, restartability, and the ability to operate and survive at extremely low temperatures. A new wax-based hybrid fuel formulation has been developed that could withstand the harsh and variable Mars environment protected solely by a minimal layer of passive insulation. This formulation could provide substantial energy savings for a notional lander and is critical for rover mobility. Preliminary thermal cycle testing has determined that the formulation can survive the expected temperature extremes and lifetime thermal testing is currently underway. A complete preliminary design using this new fuel formulation combined with a low temperature oxidizer such as Mixed Oxides of Nitrogen (MON30) is presented. Several key features associated with a complete hybrid MAV concept are investigated to determine their mission suitability (e.g. Thrust Vector Control and restartable ignition options). Potential challenges along a path towards developing such a system are outlined and future work is suggested as a means of technology maturation. The hybrid design presented here was the lowest Gross Lift Off Mass (GLOM) result of a 2015 Jet Propulsion Laboratory (JPL) led MAV concept study.

MSR↗

NASA NTRS2016

Technology Development and Design of a Hybrid Mars Ascent Vehicle Concept

Karp, Ashley C.↗

NASA NTRS2020

Change of Exposure Time Mid-test in High Temperature DIC Measurement

Performing digital image correlation (DIC) at extreme temperatures has been greatly challenging due to the radiation which saturates the camera sensor. At such high temperatures, the light intensity emitted from an object is occasionally so powerful that the acquired images are overwhelmingly saturated. This induces data loss, potentially ruining the test, thus requiring the user to restart the test. For this reason, selection of an appropriate camera sensitivity plays a crucial role prior to beginning the test. Exposure time is a factor contributing to camera sensitivity and it is the easiest setting to manipulate during the test since it introduces minimal errors when comparing to other factors, especially in quasi-static tests. This paper examines the influence of changing exposure time mid-test on DIC measurement uncertainty. The investigation was conducted by rigid body motion experiments at room temperature and 1600 ◦C, respectively. Thereby, some recommendations are given to help DIC users assess their images at room temperature to extrapolate the exposure at extreme temperatures along with accompanying solutions to salvage data at high temperature.

Digital Image Correlation↗

NASA NTRS1979

Chemical and physical microenvironments at the Viking landing sites

Physical and chemical considerations permit the division of the near-surface regolith on Mars into at least six zones of distinct microenvironments. The zones are euphotic, duricrust/peds, tempofrost, permafrost, endolithic, and interfacial/transitional. Microenvironments vary significantly in temperature extremes, mean temperature, salt content, relative pressure of water vapor, UV and visible light irradiance, and exposure to ionizing radiation events (100 Mrad) and oxidative molecular species. From what is known of the chemistry of the atmosphere and regolith fines (soil), limits upon the aqueous chemistry of soil pastes may be estimated. Heat of wetting could reach 45 cal/g dry soil; initial pH is indeterminate between 1 and 10; ionic strength and salinity are predicted to be extremely high; freezing point depression is inadequate to provide quantities of liquid water except in special cases. The prospects for biotic survival are grim by terrestrial standards, but the extremes of biological resiliency are inaccessible to evaluation. Second-generation in situ experiments which will better define Martian microenvironments are clearly possible. Antarctic dry valleys are approximations to Martian conditions, but deviate significantly by at least half-a-dozen criteria.

Clark, B. C.↗

DOE OSTI2022

Materials properties characterization in the most extreme environments

Abstract There is an ever-increasing need for material systems to operate in the most extreme environments encountered in space exploration, energy production, and propulsion systems. To effectively design materials to reliably operate in extreme environments, we need an array of tools to both sustain lab-scale extreme conditions and then probe the materials properties across a variety of length and time scales. Within this article, we examine the state-of-the-art experimental systems for testing materials under extreme environments and highlight the limitations of these approaches. We focus on three areas: (1) extreme temperatures, (2) extreme mechanical testing, and (3) chemically hostile environments. Within these areas, we identify six opportunities for instrument and technique development that are poised to dramatically impact the further understanding and development of next-generation materials for extreme environments. Graphical abstract

Schreiber, Daniel K.↗

DOE OSTI2023

Effect of Cr and Ni concentrations on resilience of cast Nb- alloyed heat resistant austenitic steels at extreme high temperatures

Austenitic Cr–Ni alloyed heat resistant steels with Nb additions are used for intensively thermo-mechanically loaded cast components working in extreme high temperature oxidizing environment. Their performance during static oxidation and transient thermo-mechanical loading was investigated to recommend an optimal cost-effective Cr/Ni composition of Nb-alloyed austenitic class steels. Here, the static oxidation and transient thermo-mechanical behavior of three austenitic steels with different Cr/Ni alloying levels were investigated and compared for variety of working conditions. Static oxidation was performed between 900 °C and 1000 °C in air for 400 h. The critical temperature which increases spallation during static oxidation was determined for each of the steel alloying levels. In addition, thermal cycling of a constrained specimen was done with varying upper cycling temperatures between 850 °C and 1000 °C. SEM and TEM analyses were supported by thermodynamic simulation of the phases precipitated in the metal matrix and the structure of formed oxide layers. These studies were used to determine the mechanisms of degradation of thermo-mechanically loaded Cr/Ni austenitic steels at extreme high temperatures. A recommendation for a cost-effective Cr/Ni alloying level for different working conditions was determined.

36 MATERIALS SCIENCE↗

DOE OSTI2021

Multiphase, Multiscale Chemomechanics at Extreme Low Temperatures: Battery Electrodes for Operation in a Wide Temperature Range

Understanding the behavior of lithium-ion batteries (LIBs) under extreme conditions, for example, low temperature, is key to broad adoption of LIBs in various application scenarios. LIBs, poor performance at low temperatures is often attributed to the inferior lithium-ion transport in the electrolyte, which has motivated new electrolyte development as well as the battery preheating approach that is popular in electric vehicles. A significant irrevocable capacity loss, however, is not resolved by these measures nor well understood. Herein, multiphase, multiscale chemomechanical behaviors in composite LiNi x Mn y Co z O 2 (NMC, x + y + z = 1) cathodes at extremely low temperatures are systematically elucidated. The low-temperature storage of LIBs can result in irreversible structural damage in active electrodes, which can negatively impact the subsequent battery cycling performance at ambient temperature. Furthermore, beside developing electrolytes that have stable performance, designing batteries for use in a wide temperature range also calls for the development of electrode components that are structurally and morphologically robust when the cell is switched between different temperatures.

25 ENERGY STORAGE↗

NASA NTRS2013

Data Transfer for Multiple Sensor Networks Over a Broad Temperature Range

At extreme temperatures, cryogenic and over 300 C, few electronic components are available to support intelligent data transfer over a common, linear combining medium. This innovation allows many sensors to operate on the same wire bus (or on the same airwaves or optical channel: any linearly combining medium), transmitting simultaneously, but individually recoverable at a node in a cooler part of the test area. This innovation has been demonstrated using room-temperature silicon microcircuits as proxy. The microcircuits have analog functionality comparable to componentry designed using silicon carbide. Given a common, linearly combining medium, multiple sending units may transmit information simultaneously. A listening node, using various techniques, can pick out the signal from a single sender, if it has unique qualities, e.g. a voice. The problem being solved is commonly referred to as the cocktail party problem. The human brain uses the cocktail party effect when it is able to recognize and follow a single conversation in a party full of talkers and other noise sources. High-temperature sensors have been used in silicon carbide electronic oscillator circuits. The frequency of the oscillator changes as a function of the changes in the sensed parameter, such as pressure. This change is analogous to changes in the pitch of a person s voice. The output of this oscillator and many others may be superimposed onto a single medium. This medium may be the power lines supplying current to the sensors, a third wire dedicated to data transmission, the airwaves through radio transmission, an optical medium, etc. However, with nothing to distinguish the identities of each source that is, the source separation this system is useless. Using digital electronic functions, unique codes or patterns are created and used to modulate the output of the sensor.

Krasowski, Michael↗

DOE OSTI2021

Changes in Annual Extremes of Daily Temperature and Precipitation in CMIP6 Models

This study presents an analysis of daily temperature and precipitation extremes with return periods ranging from 2 to 50 years in phase 6 of the Coupled Model Intercomparison Project (CMIP6) multimodel ensemble of simulations. Judged by similarity with reanalyses, the new-generation models simulate the present-day temperature and precipitation extremes reasonably well. In line with previous CMIP simulations, the new simulations continue to project a large-scale picture of more frequent and more intense hot temperature extremes and precipitation extremes and vanishing cold extremes under continued global warming. Changes in temperature extremes outpace changes in global annual mean surface air temperature (GSAT) over most landmasses, while changes in precipitation extremes follow changes in GSAT globally at roughly the Clausius–Clapeyron rate of ~7% °C –1 . Changes in temperature and precipitation extremes normalized with respect to GSAT do not depend strongly on the choice of forcing scenario or model climate sensitivity, and do not vary strongly over time, but with notable regional variations. Over the majority of land regions, the projected intensity increases and relative frequency increases tend to be larger for more extreme hot temperature and precipitation events than for weaker events. To obtain robust estimates of these changes at local scales, large initial-condition ensemble simulations are needed. Appropriate spatial pooling of data from neighboring grid cells within individual simulations can, to some extent, reduce the needed ensemble size.

54 ENVIRONMENTAL SCIENCES↗

NASA NTRS2019

Performance Evaluation of High-Speed, Low-Side Gate Driver, FAN3122, over Extended Temperature Range

Emerging power metal-oxide semiconductor field-effect transistor (MOSFETs) based on silicon carbide and gallium nitride technology are finding widespread use in many electronic applications such as motor control and DC/DC converters due to their higher voltage, higher temperature tolerance, and higher frequency switching capabilities. To utilize these power devices and to meet circuit/system compactness, modularity, and operational functionality, gate drivers that provide unique attributes, such as fast switching and high-current handling capability, are needed. In addition, power systems geared for use in space mission applications require on-board devices to withstand exposure to extreme temperatures and wide thermal swings. Very little data, however, exist on the performance of such devices and circuits under extreme temperatures. In this work, the performance of a high-speed gate driver with potential use in controlling power-level transistors was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Wide Bandgap Semiconductors↗

DOE OSTI2026

A worldwide climatology of extreme air masses

Extreme temperature events are among the most damaging weather phenomena. In a warming world, more heat extremes and fewer cold extremes are expected in most regions in the future, a trade-off that warrants further understanding of such events. Here, we track and analyze large, persistent areas of hot and cold extreme temperatures in parallel, relative to the location and time of year, to quantify overall regional exposure to extreme temperatures. To accomplish this, we compare the frequencies, movements, trends, and sources/sinks in each type of extreme air mass, calling them extreme cold or extreme hot air masses (ECAMs/EHAMs). For most land regions, ECAMs occur more often than EHAMs, and ECAMs are more common in each hemisphere’s winter, when cold-air advection is strongest and most widespread. Average movement of ECAMs has a stronger equatorward component in winter than in summer, while movement of EHAMs is eastward all year, with less meridional movement than ECAMs. EHAMs have become more common almost everywhere on land, and the reverse is true for ECAMs, with the strongest trends in the northern hemisphere occurring in autumn, especially in the Arctic. The number of EHAMs around the world is increasing at a higher rate (+ 2.32 events/year) than ECAM numbers are decreasing (-1.27 events/year), causing a net increase in extremes, especially in some midlatitude regions. These results help to document the different processes driving hot and cold extremes, and thus the asymmetric and regionally varying trends in frequency for extreme air masses.

Ryan, James M↗

NASA NTRS2006

Temperature-adaptive Circuits on Reconfigurable Analog Arrays

This paper describes a new reconfigurable analog array (MA) architecture and integrated circuit (IC) used to map analog circuits that can adapt to extreme temperatures under programmable control. Algorithm-driven adaptation takes place on the RAA IC. The algorithms are implemented in a separate Field Programmable Gate Array (FPGA) IC, co-located with the RAA in the extreme temperature environment. The experiments demonstrate circuit adaptation over a wide temperature range, from extremely low temperature of -180 C to high 120 C.

self recovery↗