Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “slicing”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS1978

Silicon Sheet Growth Development for the Large Area Sheet Task of the Low Cost Solar Array Project. Heat Exchanger Method - Ingot Casting Fixed Abrasive Method - Multi-Wire Slicing

Solar cells fabricated from HEM cast silicon yielded up to 15% conversion efficiencies. This was achieved in spite of using unpurified graphite parts in the HEM furnace and without optimization of material or cell processing parameters. Molybdenum retainers prevented SiC formation and reduced carbon content by 50%. The oxygen content of vacuum cast HEM silicon is lower than typical Czochralski grown silicon. Impregnation of 45 micrometers diamonds into 7.5 micrometers copper sheath showed distortion of the copper layer. However, 12.5 micrometers and 15 micrometers copper sheath can be impregnated with 45 micrometers diamonds to a high concentration. Electroless nickel plating of wires impregnated only in the cutting edge showed nickel concentration around the diamonds. This has the possibility of reducing kerf. The high speed slicer fabricated can achieve higher speed and longer stroke with vibration isolation.

Schmid, F.↗
NASA NTRS1978

Slicing of silicon into sheet material: Silicon sheet growth development for the large area silicon sheet task of the Low Cost Silicon Solar Array project

The limits of blade tolerance were defined. The standard blades are T-2 thickness tolerance. Good results were obtained by using a slurry fluid consisting of mineral oil and a lubricity additive. Adjustments of the formulation and fine tuning of the cutting process with the new fluid are necessary. Test results and consultation indicate that the blade breakage encountered with water based slurries is unavoidable. Two full capacity (974 wafer) runs were made on the large prototype saw. Both runs resulted in extremely low yield. However, the reasons for the low yield were lack of proper technique rather than problems with machine function. The test on the effect of amount of material etched off of an as-sawn wafer on solar cell efficiency were completed. The results agree with previous work at JPL in that the minimum material removed per side that gives maximum efficiency is on the order of 10 microns.

Fleming, J. R.↗
NASA NTRS1979

Slicing of Silicon into Sheet Material. Silicon Sheet Growth Development for the Large Area Silicon Sheet Task of the Low Cost Silicon Solar Array Project

Tests on mineral oil slurries show that the potential for workability and low cost is present. However, slurries tested to date which had sufficient lubricity exhibited wafer breakage problems near the end of the run for as-yet unknown reasons. The first test of the large prototype saw under cutting force control was largely successful in that the controller worked perfectly. Unfortunately a technique error (excessive stroke shortening) caused blade breakage and low yield. The latest run of the large saw pointed up the fact that an indication of end-of-stoke vertical motion, or bounce, is necessary. A circuit to provide such indication was fabricated and installed. Preliminary tests show it to be excessively noise sensitive; therefore, work on grounding and shielding to reduce this sensitivity is in progress.

Fleming, J. R.↗
NASA NTRS1979

Slicing of Silicon into Sheet Material: Silicon Sheet Growth Development for the Large Area Silicon Sheet Task of the Low Cost Silicon Solar Array Project

Testing of low cost low suspension power slurry vehicles is presented. Cutting oils are unlikely to work, but a mineral oil with additives should be workable. Two different abrasives were tested. A cheaper silicon carbide from Norton gave excellent results except for excessive kerf loss: the particles were too big. An abrasive treated for lubricity showed no lubricity improvement in mineral oil vehicle. The bounce fixture was tested for the first time under constant cut rate conditions (rather than constant force). Although the cut was not completed before the blades broke, the blade lifetime of thin (100 micrometer) blades was 120 times the lifetime without the fixture. The large prototype saw completed a successful run, producing 90% cutting yield (849 wafers) at 20 wafers/cm. Although inexperience with large numbers of wafers caused cleaning breakage to reduce this yield to 74%, the yield was high enough that the concept of the large saw is proven workable.

Fleming, J. R.↗
NASA NTRS1979

Slicing of Silicon into Sheet Material. Silicon Sheet Growth Development for the Large Area Silicon Sheet Task of the Low Cost Solar Array Project

The use of multiblade slurry sawing to produce silicon wafers from ingots was investigated. The commercially available state of the art process was improved by 20% in terms of area of silicon wafers produced from an ingot. The process was improved 34% on an experimental basis. Economic analyses presented show that further improvements are necessary to approach the desired wafer costs, mostly reduction in expendable materials costs. Tests which indicate that such reduction is possible are included, although demonstration of such reduction was not completed. A new, large capacity saw was designed and tested. Performance comparable with current equipment (in terms of number of wafers/cm) was demonstrated.

Fleming, J. R.↗
NASA NTRS1980

System for slicing silicon wafers

An improved system is described which has at least one endless band saw blade that is characterized by a continuously regenerated cutting edge and is unidirectionally driven along a pair of courses extended in mutual parallelism through a cutting station located near the midportion of the courses. The blade is supported at the cutting station by pairs of guides continuously rotated through less than 360 deg of angular displacement during each cutting operation in order to continuously regenerate the blade supporting surfaces of the guide. Blade wobble is thus substantially eliminated.

Collins, E. R.↗
NASA NTRS1980

Universal delta modulation receivers using the bit slice approach

The architecture of programmable processors is described, with particular reference to the design of a programmable delta-modulation decoder capable of receiving DM encoders employing different schemes. A switching receiver implementation, allowing communication between different DM algorithms, is designed and shown.

Apelewicz, T.↗
NASA NTRS1981

A new CT collimator for producing two simultaneous overlapping slices from one scan

A new CT collimator is developed which is capable of producing two simultaneous successive overlapping images from a single scan. The collimator represents a modification of the standard EMI 5005 collimator achieved by alternately masking one end or portions of both ends of the X-ray detectors at a 13-mm beamwidth so that a set of 540 filtered projections is obtained for each scan which can be separated into two sets of interleaved projections corresponding to views 3 mm apart. Tests have demonstrated that the quality of the images produced from these two projections almost equals the quality of those produced by the standard collimator from two separate scans. The new collimator may thus be used to achieve a speed improvement in the generation of overlapping sections as well as a reduction in X-ray dosage.

Kwoh, Y. S.↗
NASA NTRS1982

Some disconnected speculations on slicing silicon

The basic principles for qualifying silicon wafering methods are summarized, and unconventional methods of wafering was discussed. Methods of cleaving analogous to diamond cutting, geological processes employing the expansion of freezing water, and karate chops are touched upon.

Iles, P. A.↗